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IC资料

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IC封装资料_电容_0805CG200F500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1212821.05 MB27页81
IC封装资料_连接器_5-103904-3.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-121642255.72 KB1页81
IC封装资料_电容_CL10B104KB85PND.pdf
●Supplier:SamsungElectro-MechanicsCL10B104KB85PND●Product:Multi-layerCeramicCapacitorCAP,100㎋,50V,±10%,X7R,0603●AEC-Q200Quali...
2024-12-1219285.82 MB36页81
IC封装资料_电感_YNR2512-4R7M.pdf
SMDPowerInductors-YNR2512Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Lowp...
2024-12-12453661.28 KB5页81
IC封装资料_连接器_1-292133-5.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-12336222.7 KB2页81
IC封装资料_电感_NLCV32T-221K-EF.pdf
•Allspecificationsaresubjecttochangewithoutnotice.•ConformitytoRoHSDirective:Thismeansthat,inconformitywithEUDirective2002/95/EC...
2024-12-12660249.79 KB16页81
IC封装资料_电容_GMK316F106ZL-T.pdf
NoticeforTAIYOYUDENProducts[ForGeneralElectronicEquipment]PleasereadthisnoticebeforeusingtheTAIYOYUDENproducts.REMINDERS■Producti...
2024-12-121151857.12 KB55页81
IC封装资料_电源管理芯片_LTC3704EMS_TRPBF.pdf
1LTC37043704fbFEATURESDESCRIPTIOUAPPLICATIOSUTYPICALAPPLICATIOUWideInputRange,NoRSENSETMPositive-to-NegativeDC/DCControllerTheLTC...
2024-12-121085409.08 KB28页81
IC封装资料_电源管理芯片_LTC3601EUD_TRPBF.pdf
LTC360113601fcFormoreinformationwww.linear.com/LTC3601TYPICALAPPLICATIONFEATURESAPPLICATIONSDESCRIPTION1.5A,15VMonolithicSynchrono...
2024-12-121443491.31 KB26页81
IC封装资料_电容_CL03C090DA3GNNC.pdf
November20151.86gMLCC(02A104M)1pieceCarbonEmission更多资料下载请到五八文库wk.58sms.com1.86gMLCC(02A104M)1piece1.86gCarbonEmissionW...
2024-12-123727.46 MB84页81
IC封装资料_电源管理芯片_LT3741EFE_PBF.pdf
LT3741/LT3741-1137411fgFormoreinformationwww.linear.com/LT3741TYPICALAPPLICATIONDESCRIPTIONHighPower,ConstantCurrent,ConstantVolta...
2024-12-121467714.49 KB24页81
IC封装资料_电容_GCM31CR71H225KA55L.pdf
IC封装资料_电容_GCM31CR71H225KA55L.pdf
2024-12-1212162.87 MB1页81
IC封装资料_电容_0603CG120F500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1212671.05 MB27页81
IC封装资料_电源管理芯片_L7812CV.pdf
TO-220FPTO-220D²PAKDPAKFeatures•Outputcurrentupto1.5A•Outputvoltagesof5;6;8;8.5;9;12;15;18;24V•Thermaloverloadprotection•Shor...
2024-12-1210461.19 MB56页81
IC封装资料_电感_NLV25T-015J-EF.pdf
Pleasebesuretorequestdeliveryspecificationsthatprovidefurtherdetailsonthefeaturesandspecificationsoftheproductsforproperandsafeuse...
2024-12-12512316.78 KB6页81
IC封装资料_电容_CC0603KRX7R9BB123.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-1219061.22 MB13页81
IC封装资料_电容_CL10B124KO8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B124KO8NNNC·Product:Multi-layerCeramicCapacitor...
2024-12-1217161.45 MB36页80
IC封装资料_电容_0805CG250J500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1217331.05 MB27页80
IC封装资料_电容_GRM1885C1H1R0BA01D.pdf
GRM1885C1H1R0BA01_(0603,C0G:EIA,1pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121759944.1 KB30页80
IC封装资料_电容_GRM1555C2A120JA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-12727920.26 KB29页80

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