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IC资料

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IC封装资料_电源管理芯片_L7812CV.pdf
TO-220FPTO-220D²PAKDPAKFeatures•Outputcurrentupto1.5A•Outputvoltagesof5;6;8;8.5;9;12;15;18;24V•Thermaloverloadprotection•Shor...
2024-12-1210451.19 MB56页81
IC封装资料_电感_NLV25T-015J-EF.pdf
Pleasebesuretorequestdeliveryspecificationsthatprovidefurtherdetailsonthefeaturesandspecificationsoftheproductsforproperandsafeuse...
2024-12-12511316.78 KB6页81
IC封装资料_电容_CC0603KRX7R9BB123.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-1219051.22 MB13页81
IC封装资料_电容_CL10B124KO8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B124KO8NNNC·Product:Multi-layerCeramicCapacitor...
2024-12-1217151.45 MB36页80
IC封装资料_电容_0805CG250J500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1217321.05 MB27页80
IC封装资料_电容_GRM1885C1H1R0BA01D.pdf
GRM1885C1H1R0BA01_(0603,C0G:EIA,1pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121758944.1 KB30页80
IC封装资料_电容_GRM1555C2A120JA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-12726920.26 KB29页80
IC封装资料_电容_CC0201JRNPO9BN270.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-1211741.22 MB13页80
IC封装资料_电容_CL10B104JO8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12316259.58 KB3页80
IC封装资料_电容_CL10C680JC8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121592259.58 KB3页80
IC封装资料_电容_C1005X5R1A475K050BC.pdf
February2019MULTILAYERCERAMICCHIPCAPACITORSMULTILAYERCERAMICCHIPCAPACITORSMULTILAYERCERAMICCHIPCAPACITORSC0402[01005inch]C0603[020...
2024-12-1219171.65 MB57页80
IC封装资料_电阻_FMF25FPJR010-LH.pdf
SPECIFICATIONFORAPPROVALDATE:CUSTOMER:PARTNAME:MetalStripTypeHalogenFreeCurrentSensingResistorsCUSTOMER'SDWG.NO.CUSTOMER'SPARTNO.P...
2024-12-121576367.83 KB10页80
IC封装资料_电容_CL10C470JB8NFNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-1215901.39 MB36页80
IC封装资料_电源管理芯片_LTC4002ES8-8.4_PBF.pdf
LTC400214002f,LTCandLTareregisteredtrademarksofLinearTechnologyCorporation.Allothertrademarksarethepropertyoftheirrespectiveowners...
2024-12-121446253.54 KB16页80
IC封装资料_连接器_1758092.pdf
TableofcontentsDeviceconnectiontechnologyforsignals,data,andpowerfromPhoenixContact2HighdensityPCBterminalblocksandplug-inconnecto...
2024-12-1254636.13 MB445页80
IC封装资料_电容_CL05C100DB5NNNC.pdf
November20151.86gMLCC(02A104M)1pieceCarbonEmission更多资料下载请到五八文库wk.58sms.com1.86gMLCC(02A104M)1piece1.86gCarbonEmissionW...
2024-12-1216767.55 MB84页80
IC封装资料_电源管理芯片_LT1613CS5_TRPBF.pdf
1LT16131.4MHz,SingleCellDC/DCConverterin5-LeadSOT-23IUsesTinyCapacitorsandInductorIInternallyCompensatedIFixedFrequency1.4MHzOpera...
2024-12-12359378.72 KB12页80
IC封装资料_电感_NLV25T-039J-EF.pdf
Pleasebesuretorequestdeliveryspecificationsthatprovidefurtherdetailsonthefeaturesandspecificationsoftheproductsforproperandsafeuse...
2024-12-121751316.79 KB6页80
IC封装资料_电感_MLG1005S11NJT000.pdf
INDUCTORSMay2016��MLG1005S1005[0402inch]**��JIS[EIA]��MLG1005S�MLG��更多资料下载请到五八文库wk....
2024-12-121810420.58 KB16页80
IC封装资料_电容_CC0805KKX5R8BB225.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-123781.22 MB13页80

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