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IC资料

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IC封装资料_电容_GRM1885C1H1R0BA01D.pdf
GRM1885C1H1R0BA01_(0603,C0G:EIA,1pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121758944.1 KB30页80
IC封装资料_电容_GRM1555C2A120JA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-12726920.26 KB29页80
IC封装资料_电容_CC0201JRNPO9BN270.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-1211741.22 MB13页80
IC封装资料_电容_CL10B104JO8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12316259.58 KB3页80
IC封装资料_电容_CL10C680JC8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121592259.58 KB3页80
IC封装资料_电容_C1005X5R1A475K050BC.pdf
February2019MULTILAYERCERAMICCHIPCAPACITORSMULTILAYERCERAMICCHIPCAPACITORSMULTILAYERCERAMICCHIPCAPACITORSC0402[01005inch]C0603[020...
2024-12-1219171.65 MB57页80
IC封装资料_电阻_FMF25FPJR010-LH.pdf
SPECIFICATIONFORAPPROVALDATE:CUSTOMER:PARTNAME:MetalStripTypeHalogenFreeCurrentSensingResistorsCUSTOMER'SDWG.NO.CUSTOMER'SPARTNO.P...
2024-12-121575367.83 KB10页80
IC封装资料_电容_CL10C470JB8NFNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-1215901.39 MB36页80
IC封装资料_电源管理芯片_LTC4002ES8-8.4_PBF.pdf
LTC400214002f,LTCandLTareregisteredtrademarksofLinearTechnologyCorporation.Allothertrademarksarethepropertyoftheirrespectiveowners...
2024-12-121446253.54 KB16页80
IC封装资料_连接器_1758092.pdf
TableofcontentsDeviceconnectiontechnologyforsignals,data,andpowerfromPhoenixContact2HighdensityPCBterminalblocksandplug-inconnecto...
2024-12-1254636.13 MB445页80
IC封装资料_电容_CL05C100DB5NNNC.pdf
November20151.86gMLCC(02A104M)1pieceCarbonEmission更多资料下载请到五八文库wk.58sms.com1.86gMLCC(02A104M)1piece1.86gCarbonEmissionW...
2024-12-1216767.55 MB84页80
IC封装资料_电源管理芯片_LT1613CS5_TRPBF.pdf
1LT16131.4MHz,SingleCellDC/DCConverterin5-LeadSOT-23IUsesTinyCapacitorsandInductorIInternallyCompensatedIFixedFrequency1.4MHzOpera...
2024-12-12359378.72 KB12页80
IC封装资料_电感_NLV25T-039J-EF.pdf
Pleasebesuretorequestdeliveryspecificationsthatprovidefurtherdetailsonthefeaturesandspecificationsoftheproductsforproperandsafeuse...
2024-12-121751316.79 KB6页80
IC封装资料_电感_MLG1005S11NJT000.pdf
INDUCTORSMay2016��MLG1005S1005[0402inch]**��JIS[EIA]��MLG1005S�MLG��更多资料下载请到五八文库wk....
2024-12-121810420.58 KB16页80
IC封装资料_电容_CC0805KKX5R8BB225.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-123781.22 MB13页80
IC封装资料_电容_0402B682J500CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-123221.26 MB20页80
IC封装资料_电感_LQG15HN56NJ02D.pdf
SpecNo.JELF243B-0009T-01P.1/11MURATAMFG.CO.,LTDReferenceOnlyCHIPCOIL(CHIPINDUCTORS)LQG15HN□□□□02DREFERENCESPECIFICATION1.Scope...
2024-12-121430273.56 KB11页80
IC封装资料_电容_CC0402KRX7R9BB103P.pdf
ProductSpecification–January18,2017V.9DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORS01005NP0/X5R/X7R4VTO16V0.5pFto220nFRoHScom...
2024-12-121050998.46 KB11页80
IC封装资料_三极管_NX3008CBKS_115.pdf
1.Productprofile1.1GeneraldescriptionComplementaryN/P-channelenhancementmodeField-EffectTransistor(FET)inverysmallSOT363(SC-88)Sur...
2024-12-1210802.36 MB21页80
IC封装资料_三极管_NTR4502PT1G.pdf
©SemiconductorComponentsIndustries,LLC,2003June,2019−Rev.61PublicationOrderNumber:NTR4502P/DNTR4502P,NVTR4502PMOSFET–Power,Sing...
2024-12-121850208.04 KB5页80

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