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IC封装资料_电容_C241J102J20C000.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-12782.29 MB5页78
IC封装资料_电源管理芯片_UC2844BD1R2G.pdf
©SemiconductorComponentsIndustries,LLC,2013August,2013−Rev.111PublicationOrderNumber:UC3844B/DUC3844B,UC3845B,UC2844B,UC2845BHig...
2024-12-121829482.14 KB19页78
IC封装资料_电容_TC212A475K025Y.pdf
SunlordIndustrialPark,DafuyuanIndustrialZone,Guanlan,Shenzhen,China518110Tel:0086-755-29832660Fax:0086-755-82269029E-Mail:sunlord@...
2024-12-121448350.17 KB10页78
IC封装资料_电容_TAJA476M004RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-12303210.32 KB7页78
IC封装资料_连接器_BM28B0.6-16DP2-0.35V_53_.pdf
12019.7④0.35mmpitch,0.6mmheight,BoardtoBoardorBoardtoFPCConnectorswithRatedCurrentUpto5ABM28Series■Features1.Ratedcurrent5A2Powe...
2024-12-121867562.52 KB8页78
IC封装资料_电感_YP0705-2R2M.pdf
SMDPowerInductors-YP0705Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Highc...
2024-12-121736721.48 KB5页78
IC封装资料_连接器_AFC01-S36H1A-00.pdf
更多资料下载请到五八文库wk.58sms.com深圳市钜硕电子有限公司AFC01-S**F**-00
2024-12-1217331.58 MB1页78
IC封装资料_连接器_1844304.pdf
https://www.phoenixcontact.com/us/produkte/184430410.10.2012Page1/6Basestrip-MC1,5/11-G-3,5-1844304Pleasebeinformedthatthedatashow...
2024-12-12154188.72 KB6页78
IC封装资料_电容_0805F153M500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-122261.05 MB27页78
IC封装资料_电容_CL10B105MO8NNWC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121459259.58 KB3页78
IC封装资料_电容_GRM155R71C104MA88D.pdf
GRM155R71C104MA88_(0402,X7R:EIA,0.1uF,DC16V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:m...
2024-12-121390970.83 KB30页78
IC封装资料_过压保护_RCLAMP3346P.pdf
RClamp3346PFinalDatasheetRev5.0Revisiondate10/5/2016www.semtech.com1of9SemtechFeatures•ESDprotectionforhigh-speeddatalinestoIEC...
2024-12-12903456.59 KB10页78
IC封装资料_电容_GRM155R61A824KE15D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121735920.26 KB29页78
IC封装资料_电源管理芯片_LTC3859IUHF_TRPBF.pdf
LTC385913859fbTypicalapplicaTionDescripTionLowIQ,TripleOutput,Buck/Buck/BoostSynchronousControllerTheLTC®3859isahighperformancetr...
2024-12-12607631.38 KB42页78
IC封装资料_电容_0603N4R7C500CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-126521.26 MB20页78
IC封装资料_电容_GRM31CR71H475KA12L.pdf
GRM31CR71H475KA12_(1206,X7R:EIA,4.7uF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:m...
2024-12-121992964.38 KB30页78
IC封装资料_电感_SDCL1005C3N9STDF.pdf
Specificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2013/05/15SunlordIndustrialPark,Dafuyu...
2024-12-121617376.19 KB4页78
IC封装资料_电容_GJM1555C1H5R6CB01D.pdf
ChipMultilayerCeramicCapacitorsforGeneral2018C02E.pdfNov.27,2017更多资料下载请到五八文库wk.58sms.comC02E.pdfNov.27,2017!Note•Plea...
2024-12-12164610.43 MB296页78
IC封装资料_电容_0603CG1R0C500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-126271.05 MB27页78
IC封装资料_电感_NLV32T-018J-EFD.pdf
Pleasebesuretorequestdeliveryspecificationsthatprovidefurtherdetailsonthefeaturesandspecificationsoftheproductsforproperandsafeuse...
2024-12-1297325.74 KB6页78

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