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IC资料

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IC封装资料_电容_0603B152K500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1210541.05 MB27页78
IC封装资料_电容_CC0805JRX7R9BB104.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-1217711.22 MB13页78
IC封装资料_电容_0805CG6R0C500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1216681.05 MB27页77
IC封装资料_电容_CL10Y474MR5NJNC.pdf
SPECIFICATION(Referencesheet)Supplier:Samsungelectro-mechanicsSamsungP/N:CL10Y474MR5NJNCProduct:Multi-layerCeramicCapacitor...
2024-12-121461264.26 KB3页77
IC封装资料_电容_0805B682K500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-127461.05 MB27页77
IC封装资料_机械式继电器_G6K-2P.pdf
1G6KG6KSurfaceMountingRelaySurfaceMountingRelaywiththeWorld’sSmallestMountingArea•Subminiaturemodelassmallas5.2(H)×6.5(W)×10(L...
2024-12-1215391.72 MB9页77
IC封装资料_电容_GRM1555C1H220JA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121886920.26 KB29页77
IC封装资料_电感_SWPA6045S101MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-129861.32 MB22页77
IC封装资料_电容_CL03C2R2BA3GNNC.pdf
SPECIFICATION(Referencesheet)Supplier:Samsungelectro-mechanicsSamsungP/N:Product:Multi-layerCeramicCapacitorDescription:CA...
2024-12-129911.4 MB36页77
IC封装资料_电容_CL10A106KQ8NNNL.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10A106KQ8NNNL·Product:Multi-layerCeramicCapacitor...
2024-12-1216191.42 MB36页77
IC封装资料_电感_SDFL1608S5R6KTF.pdf
Specificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2013/11/15SunlordIndustrialPark,Dafuyu...
2024-12-121702457.75 KB7页77
IC封装资料_电感_NLV32T-R22J-PF.pdf
INDUCTORSJanuary2015WoundFerriteNLV32-PF3225[1210inch]**DimensionsCodeJIS[EIA]InductorsforStandardCircuitsNLV32-PFTypeNLV-PFSeries...
2024-12-121402224.35 KB10页77
IC封装资料_电容_CC1206JKNPOZBN101.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-1214521.22 MB13页77
IC封装资料_电容_0402CG5R0C500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1218561.05 MB27页77
IC封装资料_电源管理芯片_IB0505S-2W.pdf
YUANDC-DCCONVERTERShenzhenSunyuanTechnologyCo.,Ltd.IB系列IBxxxxS-xW1KVDC隔离1W～2W稳压单输出SIP7脚封装输入电压5V/9V/12V/15V/24VDC...
2024-12-12377454.21 KB3页77
IC封装资料_电容_GCM2165C1H471JA16D.pdf
ChipMultilayerCeramicCapacitorsforAutomotive2017C03E.pdfJun22,2017更多资料下载请到五八文库wk.58sms.comEURoHSCompliant��...
2024-12-1216454.17 MB96页77
IC封装资料_连接器_1727117.pdf
TableofcontentsDeviceconnectiontechnologyforsignals,data,andpowerfromPhoenixContact2HighdensityPCBterminalblocksandplug-inconnecto...
2024-12-12181836.13 MB445页77
IC封装资料_电源管理芯片_F2410S-1W.pdf
YUANDC-DCCONVERTERF系列FxxxxS-xW3KVDC隔离0.1W～2W非稳压单输出SIP7脚封装输入电压3.3V/5V/9V/12V/15V/24VDC输出电压3.3V/5V/9V/12V/15V/...
2024-12-121813489.36 KB4页77
IC封装资料_电源管理芯片_AP3012KTR-G1.pdf
1.5MHzSTEP-UPDC-DCCONVERTERAP30121May2010Rev.1.6BCDSemiconductorManufacturingLimitedDataSheetGeneralDescriptionTheAP3012isahighpow...
2024-12-121823700.49 KB11页77
IC封装资料_电感_LQP03TN4N7H02D.pdf
SpecNo.JELF243C-0015T-01P.1/12MURATAMFG.CO.,LTDReferenceOnlyCHIPCOIL(CHIPINDUCTORS)LQP03TN□□□□02DREFERENCESPECIFICATION1.Scope...
2024-12-121940281.03 KB12页77

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