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IC资料

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IC封装资料_电容_1206X225K500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1214801.05 MB27页277
IC封装资料_电容_TAJE687K004RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-121426210.32 KB7页277
IC封装资料_电容_CL10B181KB8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B181KB8NNNC·Product:Multi-layerCeramicCapacitor...
2024-12-121876361.13 KB3页277
IC封装资料_电感_YNR5040-331M.pdf
SMDPowerInductors-YNR5040Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Lowp...
2024-12-121320666.66 KB5页277
IC封装资料_电容_TAJA106K016RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-12936210.32 KB7页277
IC封装资料_电源管理芯片_RS3002-5_0YE3.pdf
RS3002REVA.41www.run-ic.com150mA,UltralowPowerConsumption,HighVoltageCMOSLDORegulatorFEATURES•UltralowQuiescentCurrentIQ:2.5µATy...
2024-12-12606660.04 KB15页277
IC封装资料_电容_GRM1555C1H2R7BA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121425920.26 KB29页277
IC封装资料_连接器_A0801AWR-09-F4MB1-R.pdf
A0801AWR-**-F4M*1-*HU2016.09.28QWY-GCCP-0705更多资料下载请到五八文库wk.58sms.com
2024-12-12671334.91 KB1页277
IC封装资料_电容_T55V157M6R3C0040.pdf
T55www.vishay.comVishayPolytechRevision:18-Apr-20191DocumentNumber:40174Fortechnicalquestions,contact:polytech@vishay.comTHISDOCUM...
2024-12-121506782.89 KB27页277
IC封装资料_电源管理芯片_LTC4089EDJC_TRPBF.pdf
LTC4089/LTC4089-5140895fdFormoreinformationwww.linear.com/LTC4089ApplicAtionsHVINBOOSTHVENINSW4.7µF10µF4.7µF1µFTIMERCLPROGLTC4...
2024-12-12705806 KB26页277
IC封装资料_电源管理芯片_LTC3872ETS8_TRMPBF.pdf
LTC387213872fcFormoreinformationwww.linear.com/LTC3872NoRSENSECurrentModeBoostDC/DCControllerHighEfficiency3.3VInput,5VOutputBoost...
2024-12-12988339.95 KB22页277
IC封装资料_电容_CC0805KKX7R8BB225.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-1211981.22 MB13页277
IC封装资料_电感_NLV32T-R22J-EF.pdf
Pleasebesuretorequestdeliveryspecificationsthatprovidefurtherdetailsonthefeaturesandspecificationsoftheproductsforproperandsafeuse...
2024-12-121077325.01 KB6页277
IC封装资料_电源管理芯片_LTC3110EUF_TRPBF.pdf
LTC31101RevCFormoreinformationwww.analog.comDocumentFeedbackTYPICALAPPLICATIONFEATURESDESCRIPTION2ABidirectionalBuck-BoostDC/DCReg...
2024-12-121148634.55 KB36页277
IC封装资料_电容_C1608X7R1E105KT000N.pdf
MULTILAYERCERAMICCHIPCAPACITORSMULTILAYERCERAMICCHIPCAPACITORSC0402[01005inch]C0603[0201inch]C1005[0402inch]C1608[0603inch]C2012[0...
2024-12-1215161.61 MB56页277
IC封装资料_电容_CC0805KKX7R8BB684.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-1219161.22 MB13页277
IC封装资料_电容_C2012X5R1C106KT0J0E.pdf
COM-GEN-006DELIVERYSPECIFICATIONSPEC.No.C-General-fDATE:Aug,2019ToUpontheacceptanceofthisspec.previousspec.(C2011-0454)shallbeabol...
2024-12-1211571.79 MB37页277
IC封装资料_电容_0603B362K500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1218321.05 MB27页277
IC封装资料_电源管理芯片_LM317MDCYR.pdf
INPUTADJUSTINPUTOUTPUTADJUSTOUTPUTOUTPUTKVU(TO-252)PACKAGE(TOPVIEW)OUTPUTINPUTADJUSTOUTPUTKTP(PFM)PACKAGE(TOPVIEW)DCY(SOT-223)PACK...
2024-12-1218461.11 MB23页277
IC封装资料_电容_CL10B121KB8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12754259.58 KB3页277

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