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IC封装资料_电源管理芯片_TPS2421-2DDAR.pdf
CTVOUTVINENFLTPGISETGNDRCLOADCCTOptional:ToSystemMonitor37245618VINVOUTRSETProductFolderOrderNowTechnicalDocumentsTools&SoftwareSu...
2024-12-1211932.44 MB31页58
IC封装资料_连接器_KF170V-5.0-3P.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-121822207.6 KB1页58
IC封装资料_电容_1206CG471J500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1210381.05 MB27页58
IC封装资料_电容_CL10C0R3CB8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-121596340.1 KB3页58
IC封装资料_连接器_F0502-B-21-20T.pdf
FPC0.50mmConnectorsF0502-B-XX-20T≥24D更多资料下载请到五八文库wk.58sms.com
2024-12-12424290.85 KB1页58
IC封装资料_电容_CL10B561KB8NNWC.pdf
-MiniatureSize-WideCapacitanceandVoltageRange-Tape&ReelforSurfaceMountAssembly-LowESR-GeneralElectronicCircuitGeneralFeaturesAppli...
2024-12-121699452.9 KB21页58
IC封装资料_电容_CL10B561JB8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B561JB8NNNC·Product:Multi-layerCeramicCapacitor...
2024-12-121337360.63 KB3页58
IC封装资料_连接器_DF12D_4.0_-30DP-0.5V_81_.pdf
A1930.5mmPitchSMTBoard-to-BoardConnectorDF12Series■Features1.BroadVariationsofStackingHeightInadditionto0.5mmpitchultra-miniature...
2024-12-121122288.67 KB11页58
IC封装资料_电感_YPRH104R-4R7M.pdf
SMDPowerInductors-YPRH104RSeries深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjysmd.com.cn-1-■Features●U...
2024-12-12349762.21 KB4页58
IC封装资料_连接器_BM28B0.6-20DS2-0.35V_53_.pdf
12019.7④0.35mmpitch,0.6mmheight,BoardtoBoardorBoardtoFPCConnectorswithRatedCurrentUpto5ABM28Series■Features1.Ratedcurrent5A2Powe...
2024-12-121468562.52 KB8页58
IC封装资料_电容_DE2B3KY471KA2BM01F.pdf
LeadTypeDiscCeramicCapacitors(SafetyStandardCertified)ResinMoldingSMDTypeCeramicCapacitors(SafetyStandardCertified)C85E.pdfSep.14,...
2024-12-1216231.8 MB73页58
IC封装资料_连接器_A2541HWV-35P.pdf
A2541SERIESCHANGJIANGCONNECTORSTEL:86-755-2995911929959129FAX:86-755-29959139Http://www.CJT.cn2.54mmpitchwiretoboardconnectorSpeci...
2024-12-12703814.88 KB16页58
IC封装资料_电容_GRM1885C1HR70BA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12990944.07 KB30页58
IC封装资料_电容_CL21B471KBANNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL21B332KBANNNC·Product:Multi-layerCeramicCapacitor...
2024-12-1210841.45 MB36页58
IC封装资料_电容_GRM1885C1H4R7CA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12192944.07 KB30页58
IC封装资料_电容_GRM1555C1H681JA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121174920.26 KB29页58
IC封装资料_电容_CL10B102KC8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121987259.58 KB3页58
IC封装资料_电源管理芯片_LTC4211IMS_PBF.pdf
LTC421114211fcFormoreinformationwww.linear.com/LTC4211TYPICALAPPLICATIONFEATURESDESCRIPTIONHotSwapControllerwithMultifunctionCurre...
2024-12-12378519.68 KB40页58
IC封装资料_连接器_1803507.pdf
TableofcontentsDeviceconnectiontechnologyforsignals,data,andpowerfromPhoenixContact2HighdensityPCBterminalblocksandplug-inconnecto...
2024-12-1234736.13 MB445页58
IC封装资料_连接器_1757475.pdf
PHOENIXCONTACTInc.,USAPage1/5http://www.phoenixcon.comFeb25,2010ExtractfromtheonlinecatalogMSTBA2,5/2-GOrderNo.:1757475Thefiguresh...
2024-12-121063228.93 KB5页58

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