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IC资料

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IC封装资料_电容_CL10C220JB8NCNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-12442316.3 KB3页57
IC封装资料_三极管_DMG3415U-7.pdf
DMG3415UDocumentnumber:DS31735Rev.13-31of7www.diodes.comMarch2018©DiodesIncorporatedDMG3415UP-CHANNELENHANCEMENTMODEMOSFETProduct...
2024-12-121220698.76 KB7页57
IC封装资料_电容_TAJB686M010RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-121341210.32 KB7页57
IC封装资料_电容_T491D226K035AT.pdf
©KEMETElectronicsCorporation•P.O.Box5928•Greenville,SC29606•864-963-6300•www.kemet.comT2005_T491•5/8/20171Oneworld.OneKEMETB...
2024-12-123271.54 MB23页57
IC封装资料_电容_CL10B684KO8NFNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12889259.58 KB3页57
IC封装资料_连接器_1803293.pdf
TableofcontentsDeviceconnectiontechnologyforsignals,data,andpowerfromPhoenixContact2HighdensityPCBterminalblocksandplug-inconnecto...
2024-12-1250936.13 MB445页57
IC封装资料_电容_1206B333K500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1211051.05 MB27页57
IC封装资料_连接器_AYF534235.pdf
–1–ACCTB1E201803-TDETAILEDFEATURESForFPC/FFCY5B/Y5BWFPC/FFCconnectors(0.5mmpitch)BacklockPitch0.5mm,lowprofile/spacesavinganddou...
2024-12-1214771.1 MB13页57
IC封装资料_电容_GRM1885C2A620JA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12248944.07 KB30页57
IC封装资料_电容_CL31B103KGFNNNE.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL31B103KGFNNNE·Product:Multi-layerCeramicCapacitor...
2024-12-1218631.45 MB36页57
IC封装资料_连接器_A0801AWR-06-F4MB1-R.pdf
A0801AWR-**-F4M*1-*HU2016.09.28QWY-GCCP-0705更多资料下载请到五八文库wk.58sms.com
2024-12-121834334.91 KB1页57
IC封装资料_电容_GRM155R71C563KA88D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121323920.26 KB29页57
IC封装资料_电容_CL10B103KC85PNC.pdf
-MiniatureSize-WideCapacitanceandVoltageRange-Tape&ReelforSurfaceMountAssembly-LowESR-GeneralElectronicCircuitGeneralFeaturesAppli...
2024-12-12274452.9 KB21页57
IC封装资料_电容_C1608X5R1A106K080AC.pdf
February2019MULTILAYERCERAMICCHIPCAPACITORSMULTILAYERCERAMICCHIPCAPACITORSMULTILAYERCERAMICCHIPCAPACITORSC0402[01005inch]C0603[020...
2024-12-1210981.65 MB57页57
IC封装资料_电容_CL10C390GB8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-121965316.18 KB3页57
IC封装资料_电容_GRM155B11E103KA01D.pdf
ChipMultilayerCeramicCapacitorsforGeneral2018C02E.pdfNov.27,2017更多资料下载请到五八文库wk.58sms.comC02E.pdfNov.27,2017!Note•Plea...
2024-12-12104010.43 MB296页57
IC封装资料_电容_0603N5R0C500CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-1213571.26 MB20页57
IC封装资料_电感_SDFL1608LR22KTF.pdf
Specificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2013/11/15SunlordIndustrialPark,Dafuyu...
2024-12-121400457.75 KB7页57
IC封装资料_电源管理芯片_LTC3589EUJ-2_TRPBF.pdf
LTC3589/LTC3589-1/LTC3589-213589fhFormoreinformationwww.linear.com/LTC3589TypicalapplicaTionFeaTuresDescripTionapplicaTionsTheLTC...
2024-12-121101769.35 KB50页57
IC封装资料_电源管理芯片_LT8490IUKJ_PBF.pdf
LT849018490faFormoreinformationwww.linear.com/LT8490TypicalapplicaTionFeaTuresDescripTionHighVoltage,HighCurrentBuck-BoostBatteryC...
2024-12-121714773.85 KB42页57

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