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IC资料

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IC封装资料_电容_CC0603KRX7R0BB223.pdf
ProductSpecification–January18,2017V.9DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORS01005NP0/X5R/X7R4VTO16V0.5pFto220nFRoHScom...
2024-12-121106998.46 KB11页56
IC封装资料_电感_MLF2012A1R5KT000.pdf
February2017INDUCTORSFebruary2017积层铁氧体MLF20122012[0805inch]**表示尺寸代码。JIS[EIA]普通电路用电感器MLF2012型MLF系列更多资料下...
2024-12-12878441.86 KB11页56
IC封装资料_电容_0402B102J500CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-1216731.26 MB20页56
IC封装资料_电感_LQG15HS12NJ02D.pdf
SpecNo.JELF243B-0010S-01P.1/11MURATAMFG.CO.,LTDReferenceOnlyCHIPCOIL(CHIPINDUCTORS)LQG15HS□□□□02DREFERENCESPECIFICATION1.Scope...
2024-12-12492361.38 KB11页56
IC封装资料_电感_LQG15HS2N2B02D.pdf
SpecNo.JELF243B-0010Q-01P.1/11MURATAMFG.CO.,LTDCHIPCOIL(CHIPINDUCTORS)LQG15HS□□□□02DREFERENCESPECIFICATION1.ScopeThisreference...
2024-12-12764360.21 KB11页56
AL-314OR1C (A-BRIGHT).pdf
AAA---BBBRRRIIIGGGHHHTTTA-BRIGHTINDUSTRIALCO.,LTD.PartNo.AL-314OR1CDiffNo.3mmRoundType:LEDLamps2006/9/161Notes:1.Alldimensionsarei...
2024-12-11545311.28 KB5页56
IC封装资料_电容_GRM1555C1H4R7BA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-12906920.26 KB29页56
IC封装资料_电源管理芯片_VD051212S-1W.pdf
DC-DCConverterVD系列宽压输入3KVDC双回路隔离稳压自恢复过载短路保护输出:VDXXXXS-1WVD系列双回路3KV隔离输出DC-DC模块电源，两个输出端都...
2024-12-121297908.16 KB4页56
IC封装资料_三极管_DMN2011UFX-7.pdf
DMN2011UFXDocumentnumber:DS37250Rev.3-21of7www.diodes.comAugust2015©DiodesIncorporatedDMN2011UFXADVANCEDINFORMATIONS1G1S2G2D1/D2D...
2024-12-12488726.09 KB7页56
IC封装资料_电容_CL10C101JB8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12656259.58 KB3页56
IC封装资料_电容_TAJE158M004RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-121728210.32 KB7页56
IC封装资料_电容_TAJC336M025RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-121345210.32 KB7页56
IC封装资料_电容_CL10C030CB81PNC.pdf
●Supplier:Samsungelectro-mechanicsCL10C030CB81PNC●Product:Multi-layerCeramicCapacitorCAP,3㎊,50V,±0.25㎊,C0G,0603●AEC-Q200Qual...
2024-12-1210685.8 MB36页56
IC封装资料_电感_YSPI0750-470M.pdf
SMDPowerInductors-YSPI0750Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjysmd.com.cn-1-■Features●M...
2024-12-12809700.46 KB5页56
IC封装资料_电容_GRM188R72A221KA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121716944.07 KB30页56
IC封装资料_连接器_SM02B-GHS-TBT.pdf
GHCONNECTORGHCONNECTORGHCONNECTORGHCONNECTOR1.25mmpitch/DisconnectableCrimpstyleconnectorsEmbossTapeGHCONNECTORGHCONNECTORGHCONNEC...
2024-12-12307661.07 KB4页56
IC封装资料_电容_CL10B562JB8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B562JB8NNNC·Product:Multi-layerCeramicCapacitor...
2024-12-121425360.96 KB3页56
IC封装资料_连接器_DF12E_3.0_-40DP-0.5V_81_.pdf
A1930.5mmPitchSMTBoard-to-BoardConnectorDF12Series■Features1.BroadVariationsofStackingHeightInadditionto0.5mmpitchultra-miniature...
2024-12-121077288.67 KB11页56
IC封装资料_电感_YP0504-1R0M.pdf
SMDPowerInductors-YP0504Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Highc...
2024-12-12139776.58 KB5页56
IC封装资料_电容_CL10B331KC8WPNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121592259.58 KB3页56

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