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IC资料

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IC封装资料_电容_0402CG390J500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-129451.05 MB27页269
IC封装资料_电感_LQW15AN39NG00D.pdf
SpecNo.JELF243A-0050AA-01P.1/14MURATAMFG.CO.,LTDReferenceOnlyCHIPCOIL(CHIPINDUCTORS)LQW15AN□□□□00DReferenceSpecification1.Scop...
2024-12-121064376.63 KB15页269
IC封装资料_电容_TAJD686K020RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-12482210.32 KB7页269
IC封装资料_电容_TAJA156K006RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-12938210.32 KB7页269
IC封装资料_连接器_BM28B0.6-36DP2-0.35V_51_.pdf
12019.7④0.35mmpitch,0.6mmheight,BoardtoBoardorBoardtoFPCConnectorswithRatedCurrentUpto5ABM28Series■Features1.Ratedcurrent5A2Powe...
2024-12-12204562.52 KB8页269
IC封装资料_电容_GRM1885C1H161JA01D.pdf
GRM1885C1H161JA01_(0603,C0G:EIA,160pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:m...
2024-12-12384944.12 KB30页269
IC封装资料_电容_TAJB106K016RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-121852210.32 KB7页269
IC封装资料_电容_CL10C220JB81PNC.pdf
●Supplier:Samsungelectro-mechanicsCL10C220JB81PNC●Product:Multi-layerCeramicCapacitorCAP,22㎊,50V,±5%,C0G,0603●AEC-Q200Qualifi...
2024-12-124585.8 MB36页269
IC封装资料_电容_GRM188R72A681KA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121037944.07 KB30页269
IC封装资料_信号隔离芯片_FOD2712R2V_Q.pdf
4/10/03OPTICALLYISOLATEDERRORAMPLIFIERPage1of13FOD2712©2003FairchildSemiconductorCorporationPACKAGEDIMENSIONSFUNCTIONALBLOCKDIAGR...
2024-12-121694670.43 KB14页269
IC封装资料_电容_0805F225M250NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-125791.05 MB27页269
IC封装资料_微控制器_TMP86FH46BNGZ.pdf
8BitMicrocontrollerTLCS-870/CSeriesTMP86FH46BNG更多资料下载请到五八文库wk.58sms.com©2011TOSHIBACORPORATIONAllRightsReservedDiffer...
2024-12-1218422.31 MB216页269
IC封装资料_电容_GRM188R71H471KA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121986944.07 KB30页269
IC封装资料_连接器_AFC11-S34ICA-00.pdf
浙江博众电气有限公司ZHEJIANGBOZHONGELECTRICCO.，LTD承认书SPECIFICATIONFORAPPROVAL客户Customer：产品名Project：规格型号PartNo：贵公...
2024-12-124441.4 MB10页269
IC封装资料_电容_TAJA684K050RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-12302210.32 KB7页269
IC封装资料_三极管_IRLR024NTRPBF.pdf
HEXFET®PowerMOSFETSDGParameterTyp.Max.UnitsRθJCJunction-to-Case–––3.3RθJACase-to-Ambient(PCBmount)**–––50°C/WRθJAJuncti...
2024-12-12835396.58 KB11页269
IC封装资料_连接器_KF2EDGRM-Y-3.5-16P.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-121638637.56 KB1页269
IC封装资料_电容_0805N330J501CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-124501.26 MB20页269
IC封装资料_电容_GRM155R71H271KA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121453920.26 KB29页269
IC封装资料_电容_0805N471J101CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-127191.26 MB20页269

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