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IC资料

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IC封装资料_连接器_AFC11-S34ICA-00.pdf
浙江博众电气有限公司ZHEJIANGBOZHONGELECTRICCO.，LTD承认书SPECIFICATIONFORAPPROVAL客户Customer：产品名Project：规格型号PartNo：贵公...
2024-12-124431.4 MB10页269
IC封装资料_三极管_IRLR024NTRPBF.pdf
HEXFET®PowerMOSFETSDGParameterTyp.Max.UnitsRθJCJunction-to-Case–––3.3RθJACase-to-Ambient(PCBmount)**–––50°C/WRθJAJuncti...
2024-12-12835396.58 KB11页269
IC封装资料_电容_GRM188R61A224KA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121984944.07 KB30页269
IC封装资料_电容_CL10C8R2CB81PNC.pdf
●Supplier:Samsungelectro-mechanicsCL10C8R2CB81PNC●Product:Multi-layerCeramicCapacitorCAP,8.2㎊,50V,±0.25㎊,C0G,0603●AEC-Q200Qu...
2024-12-1214235.8 MB36页268
IC封装资料_电容_CC0402JRNPO9BN200.pdf
PRODUCTSELECTIONGUIDE2014SMDRESISTORS+MLCCSMDCERAMICEMIFILTERCAPACITORS-X2Y®WIRELESSCOMPONENTSMULTILAYERCHIPVARISTORSwww.yageo.co...
2024-12-1216717.81 MB176页268
IC封装资料_电容_CL10B823KA8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B823KA8NNNC·Product:Multi-layerCeramicCapacitor...
2024-12-12518361.49 KB3页268
IC封装资料_电容_CL10C250JB8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12856259.58 KB3页268
IC封装资料_电容_T491B105K035AT.pdf
©KEMETElectronicsCorporation•P.O.Box5928•Greenville,SC29606•864-963-6300•www.kemet.comT2005_T491•5/8/20171Oneworld.OneKEMETB...
2024-12-1218361.54 MB23页268
IC封装资料_电源管理芯片_TPS65053RGER.pdf
L2EN_DCDC1ENABLEVCCFB_DCDC2PGND2AGNDEN_LDO1ENABLEEN_DCDC2ENABLEVLDO2200mALDOVLDO2VLDO3DCDC1(I/O)STEP-DOWNCONVERTERVINDCDC1/2L1FB_D...
2024-12-1213422.68 MB37页268
IC封装资料_电容_TAJV157M025RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-121065210.32 KB7页268
IC封装资料_连接器_DF12E_3.0_-20DP-0.5V_81_.pdf
A1930.5mmPitchSMTBoard-to-BoardConnectorDF12Series■Features1.BroadVariationsofStackingHeightInadditionto0.5mmpitchultra-miniature...
2024-12-12176288.67 KB11页268
IC封装资料_电容_CL10C221GB8NCNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-121513316.17 KB3页268
IC封装资料_电源管理芯片_XC6220B251MR-G.pdf
1/26XC6220Series1ALDOVoltageRegulatorwith“GreenOperation”CIN=10μF(ceramic)VINVINVSSCEVOUTCL=10μF(ceramic)LOADInput■GENERALDES...
2024-12-12458906.33 KB26页268
IC封装资料_电容_CL10C150JB8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121851259.58 KB3页268
IC封装资料_三极管_NX7002AK_215.pdf
NX7002AK60V,singleN-channelTrenchMOSFET6August2015Productdatasheet1.GeneraldescriptionN-channelenhancementmodeField-EffectTransist...
2024-12-121579809.89 KB16页268
IC封装资料_电感_YP0503-101M.pdf
SMDPowerInductors-YP0503Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Highc...
2024-12-1295776.48 KB5页268
IC封装资料_电容_CL10A226MP8NUNE.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121295259.57 KB3页268
IC封装资料_电容_0603CG200J500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1211531.05 MB27页268
IC封装资料_电容_CL10C332JB8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121472259.58 KB3页268
IC封装资料_电感_YNR3010-3R3M.pdf
SMDPowerInductors-YNR3010Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Lowp...
2024-12-12440661.07 KB5页268

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