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IC资料

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IC封装资料_电容_CL10B471KB8WPNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B471KB8WPNC●Product:Multi-layerCeramicCapacitorCAP,470㎊,50V,±10%,X7R,0603●AEC-Q200Quali...
2024-12-1217705.82 MB36页261
IC封装资料_电感_MLK1005S1N8ST000.pdf
INDUCTORSFebruary2015MultilayerCeramicMLK10051005[0402inch]**DimensionsCodeJIS[EIA]InductorsforHighFrequencyCircuitsMLK1005TypeMLK...
2024-12-121047209.31 KB10页261
IC封装资料_电感_MLK1005S12NHT000.pdf
INDUCTORSFebruary2015MultilayerCeramicMLK10051005[0402inch]**DimensionsCodeJIS[EIA]InductorsforHighFrequencyCircuitsMLK1005TypeMLK...
2024-12-121551209.31 KB10页261
IC封装资料_电源管理芯片_MAX6071AAUT50+T.pdf
19-6355;Rev17;6/20GeneralDescriptionTheMAX6070/MAX6071offeraverylownoiseandlow-driftvoltagereferenceinasmall6-pinSOT23package.Thes...
2024-12-122276.31 MB26页261
IC封装资料_电容_CL10A225KO8N3NC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10A225KO8N3NC·Product:Multi-layerCeramicCapacitor...
2024-12-123551.45 MB36页261
IC封装资料_电容_CC1206KRX7R9BB471.pdf
ProductSpecification–January18,2017V.9DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORS01005NP0/X5R/X7R4VTO16V0.5pFto220nFRoHScom...
2024-12-12781998.46 KB11页261
IC封装资料_连接器_1759046.pdf
TableofcontentsDeviceconnectiontechnologyforsignals,data,andpowerfromPhoenixContact2HighdensityPCBterminalblocksandplug-inconnecto...
2024-12-129136.13 MB445页261
IC封装资料_电阻_MFR0W4F1001A50.pdf
PartNo.料号Type类型PowerRating功率70°CDimension(尺寸)(mm)DLd±0.05H±3NormalSize(正常尺寸)MFR0W8MF-121/8W1.9±0.33.3±0.30.4528MF...
2024-12-121363473.76 KB2页261
IC封装资料_电容_0603B272K500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1210641.05 MB27页261
IC封装资料_电容_0805CG1R2C500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-121011.05 MB27页261
IC封装资料_电感_NLCV32T-4R7M-EFRD.pdf
•Allspecificationsaresubjecttochangewithoutnotice.•ConformitytoRoHSDirective:Thismeansthat,inconformitywithEUDirective2002/95/EC...
2024-12-121777249.79 KB16页261
IC封装资料_电容_GRM1885C1H2R4CA01D.pdf
GRM1885C1H2R4CA01_(0603,C0G:EIA,2.4pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:m...
2024-12-12829944.09 KB30页261
IC封装资料_电容_GRM1885C1H1R8CA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121411944.07 KB30页260
IC封装资料_电容_0805CG151J500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-123021.05 MB27页260
IC封装资料_电感_SWPA5040S8R2MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-123741.32 MB22页260
IC封装资料_电感_NLV25T-8R2J-EFD.pdf
Pleasebesuretorequestdeliveryspecificationsthatprovidefurtherdetailsonthefeaturesandspecificationsoftheproductsforproperandsafeuse...
2024-12-121152318.58 KB6页260
IC封装资料_电源管理芯片_LT1236ACS8-5_PBF.pdf
1LT1236PrecisionReferenceUAOPPLICATITYPICALDUESCRIPTIOTheLT®1236isaprecisionreferencethatcombinesultra-lowdriftandnoisewithexcell...
2024-12-121834308.54 KB12页260
IC封装资料_电容_0603CG201J500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1210311.05 MB27页260
IC封装资料_电容_CL21B221KBANNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL21B221KBANNNC·Product:Multi-layerCeramicCapacitor...
2024-12-12717360.66 KB3页260
IC封装资料_电容_0603CG200G500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-129501.05 MB27页260

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