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IC封装资料_电容_0603B223K101NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1218461.05 MB27页260
IC封装资料_电容_GCM1885C2A1R0CA16D.pdf
汽车用片状多层陶瓷电容器汽车用片状多层陶瓷电容器MurataManufacturingCo.,Ltd.C03C-4.pdf14.09.09C03C-4.pdf14.09.09•本PDF产品目录是从...
2024-12-1215895.94 MB73页260
IC封装资料_电容_0805CG181J101NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-123511.05 MB27页260
IC封装资料_电源管理芯片_LT1965EMS8E-3.3_PBF.pdf
LT1965Series11965fbFormoreinformationwww.linear.com/LT1965FeaturesapplicationsDescription1.1A,LowNoise,LowDropoutLinearRegulatorTh...
2024-12-1210151.04 MB22页260
IC封装资料_电容_CC0402CRNPO9BN3R9.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-1219351.22 MB13页260
IC封装资料_电源管理芯片_LT3799EMSE_TRPBF.pdf
LT379913799fbFormoreinformationwww.linear.com/LT3799nIsolatedPFCLEDDriverwithMinimumNumberofExternalComponentsnTRIACDimmablenVINan...
2024-12-12831991.97 KB20页260
IC封装资料_电容_CC0805ZKY5V6BB475.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-1216151.22 MB13页260
IC封装资料_电源管理芯片_LTC3113EDHD_TRPBF.pdf
LTC311313113fTYPICALAPPLICATIONDESCRIPTION3ALowNoiseBuck-BoostDC/DCConverterTheLTC®3113isawideVINrange,highlyefficient,fixedfrequ...
2024-12-121641471.89 KB24页260
IC封装资料_电容_CL10A106KQ8NNWC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12741259.57 KB3页260
IC封装资料_电感_SWPA5020S1R5MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-1218261.32 MB22页260
IC封装资料_电容_CC0603JRNPO9BN101.pdf
PRODUCTSELECTIONGUIDE2014SMDRESISTORS+MLCCSMDCERAMICEMIFILTERCAPACITORS-X2Y®WIRELESSCOMPONENTSMULTILAYERCHIPVARISTORSwww.yageo.co...
2024-12-1257017.81 MB176页260
IC封装资料_电容_0201CG6R0D500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1214471.05 MB27页260
IC封装资料_电容_0201CG2R0C250NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-125571.05 MB27页260
IC封装资料_电感_LQG15HS1N3S02D.pdf
SpecNo.JELF243B-0010S-01P.1/11MURATAMFG.CO.,LTDReferenceOnlyCHIPCOIL(CHIPINDUCTORS)LQG15HS□□□□02DREFERENCESPECIFICATION1.Scope...
2024-12-121892361.38 KB11页260
IC封装资料_电容_GRM1885C1H180FA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12940944.07 KB30页260
IC封装资料_电源管理芯片_TL432.pdf
SOT-23EncapsulateAdjustableReferenceSourceTL432AdjustableAccurateReferenceSourceDEVICEDESCRIPSIONTheTL432isathree-terminalShuntVol...
2024-12-121523783.55 KB5页260
IC封装资料_电容_GRM188R71E154KA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121465944.07 KB30页260
IC封装资料_连接器_DF12E_3.5_-20DP-0.5V_81_.pdf
A1930.5mmPitchSMTBoard-to-BoardConnectorDF12Series■Features1.BroadVariationsofStackingHeightInadditionto0.5mmpitchultra-miniature...
2024-12-12686288.67 KB11页260
IC封装资料_三极管_UMW_5N65F.pdf
650V650650UMW5N651●最大额定值（TC=25TC=25TC=25TC=25°°°°CCCC）●●●●AbsoluteAbsoluteAbsoluteAbsoluteMaximumMaximumMaximumMax...
2024-12-127602.98 MB9页260
IC封装资料_电容_GRM188R71C473KA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12523944.07 KB30页260

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