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IC封装资料_连接器_1755736.pdf
TableofcontentsDeviceconnectiontechnologyforsignals,data,andpowerfromPhoenixContact2HighdensityPCBterminalblocksandplug-inconnecto...
2024-12-12196636.13 MB445页166
IC封装资料_电感_MLK1005S6N8DT000.pdf
INDUCTORSFebruary2015MultilayerCeramicMLK10051005[0402inch]**DimensionsCodeJIS[EIA]InductorsforHighFrequencyCircuitsMLK1005TypeMLK...
2024-12-121966209.31 KB10页221
IC封装资料_电容_CC0805KRX7R0BB221.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-1219661.22 MB13页23
IC封装资料_电容_0402CGR75C500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1219661.05 MB27页145
IC封装资料_电容_GJM1555C1H8R2BB01D.pdf
ChipMultilayerCeramicCapacitorsforGeneral2018C02E.pdfNov.27,2017更多资料下载请到五八文库wk.58sms.comC02E.pdfNov.27,2017!Note•Plea...
2024-12-12196610.43 MB296页65
IC封装资料_电源管理芯片_LTC3404EMS8_TRPBF.pdf
1LTC34043404fbAPPLICATIOSUFEATURESDESCRIPTIOUTYPICALAPPLICATIOU■HighEfficiency:Upto95%■VeryLowQuiescentCurrent:Only10μADuringOp...
2024-12-121966293.17 KB16页6
IC封装资料_电容_GRM155R71E333KA88D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121966920.26 KB29页192
IC封装资料_电容_CL21C0R5BBANNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL21B222KBANNNC·Product:Multi-layerCeramicCapacitor...
2024-12-1219661.45 MB36页244
IC封装资料_连接器_KF2EDGCV-X-5.08-7P.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-121966627.15 KB1页174
IC封装资料_电容_T491D226K025AT.pdf
©KEMETElectronicsCorporation•P.O.Box5928•Greenville,SC29606•864-963-6300•www.kemet.comT2005_T491•5/8/20171Oneworld.OneKEMETB...
2024-12-1219661.54 MB23页91
IC封装资料_电容_0805B104K500CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-1219651.26 MB20页268
IC封装资料_电容_CL10C390GB8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-121965316.18 KB3页57
IC封装资料_电容_CL10B682KB8NNWC.pdf
-MiniatureSize-WideCapacitanceandVoltageRange-Tape&ReelforSurfaceMountAssembly-LowESR-GeneralElectronicCircuitGeneralFeaturesAppli...
2024-12-121965452.9 KB21页168
IC封装资料_无线芯片及模块_ESP-07.pdf
ESP-07802.11b/g/nWi-Fi��V1.2Copyright©2017ShenzhenAi-ThinkerTechnologyCo.,LtdAllRightsReserved��2�ESP-07802.11b/g/nWi-Fi...
2024-12-121965325.01 KB2页88
IC封装资料_电容_CC0402KRX7R9BB103.pdf
PRODUCTSELECTIONGUIDE2014SMDRESISTORS+MLCCSMDCERAMICEMIFILTERCAPACITORS-X2Y®WIRELESSCOMPONENTSMULTILAYERCHIPVARISTORSwww.yageo.co...
2024-12-12196417.81 MB176页198
IC封装资料_电感_MLF2012DR12JT000.pdf
February2017INDUCTORSFebruary2017积层铁氧体MLF20122012[0805inch]**表示尺寸代码。JIS[EIA]普通电路用电感器MLF2012型MLF系列更多资料下...
2024-12-121964441.85 KB11页182
IC封装资料_电容_TAJA336M010RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-121964210.32 KB7页138
IC封装资料_电容_GCJ188R72A223KA01D.pdf
ChipMultilayerCeramicCapacitorsforAutomotive2017C03E.pdfJun22,2017更多资料下载请到五八文库wk.58sms.comEURoHSCompliant��...
2024-12-1219644.17 MB96页189
IC封装资料_电源管理芯片_LT1371CR_TRPBF.pdf
1LT1371500kHzHighEfficiency3ASwitchingRegulatorTheLT®1371isamonolithichighfrequencycurrentmodeswitchingregulator.Itcanbeoperatedi...
2024-12-121963361.84 KB16页248
IC封装资料_电容_CL31A226MOCLNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL31A226MOCLNNC·Product:Multi-layerCeramicCapacitor...
2024-12-1219631.48 MB36页240

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