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IC资料

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IC封装资料_电源管理芯片_LT1371CR_TRPBF.pdf
1LT1371500kHzHighEfficiency3ASwitchingRegulatorTheLT®1371isamonolithichighfrequencycurrentmodeswitchingregulator.Itcanbeoperatedi...
2024-12-121964361.84 KB16页248
IC封装资料_电容_CL31A226MOCLNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL31A226MOCLNNC·Product:Multi-layerCeramicCapacitor...
2024-12-1219641.48 MB36页240
IC封装资料_电容_TAJA336M010RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-121964210.32 KB7页138
IC封装资料_电容_GCJ188R72A223KA01D.pdf
ChipMultilayerCeramicCapacitorsforAutomotive2017C03E.pdfJun22,2017更多资料下载请到五八文库wk.58sms.comEURoHSCompliant��...
2024-12-1219644.17 MB96页189
IC封装资料_电容_TAJE337M006RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-121964210.32 KB7页49
IC封装资料_电容_GRM1885C1H132JA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121963944.07 KB30页166
IC封装资料_电感_HK100556NJ-T.pdf
NoticeforTAIYOYUDENProducts[ForGeneralElectronicEquipment]PleasereadthisnoticebeforeusingtheTAIYOYUDENproducts.REMINDERS■Producti...
2024-12-121962560.85 KB22页134
IC封装资料_电容_GCM188R72A102KA37D.pdf
Lsize1.6±0.1mmWsize0.8±0.1mmTsize0.8±0.1mmExternalterminalwidthe0.2to0.5mmDistancebetweenexternalterminalsg0.5mmmin.Sizecodeini...
2024-12-1219623.23 MB2页48
IC封装资料_电感_MLG1005S9N1JT000.pdf
INDUCTORSMay2016��MLG1005S1005[0402inch]**��JIS[EIA]��MLG1005S�MLG��更多资料下载请到五八文库wk....
2024-12-121962420.58 KB16页251
IC封装资料_电感_MWSA0603-6R8MT.pdf
SunlordIndusSunloMoldedOperatingFEATUREMetalmaClosedmHalogenAPPLICAServer,GraphicIndustriaPRODUCMWS①①MWSA②041004120...
2024-12-121962319.07 KB8页93
IC封装资料_电容_GRM155R61H104JE14D.pdf
ChipMultilayerCeramicCapacitorsforGeneral2018C02E.pdfNov.27,2017更多资料下载请到五八文库wk.58sms.comC02E.pdfNov.27,2017!Note•Plea...
2024-12-12196210.43 MB296页186
IC封装资料_电容_GRM155R71H273KE14D.pdf
GRM155R71H273KE14_(0402,X7R:EIA,27000pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit...
2024-12-121962924.66 KB29页104
IC封装资料_电容_T520B107M006ATE040.pdf
©KEMETElectronicsCorporation•P.O.Box5928•Greenville,SC29606•864-963-6300•www.kemet.comT2076_T52X-530•4/28/20171Oneworld.OneK...
2024-12-1219622.01 MB37页189
IC封装资料_电容_TAJC687M002RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-121962210.32 KB7页124
IC封装资料_电容_GJM1555C1H6R0CB01D.pdf
ChipMultilayerCeramicCapacitorsforGeneral2018C02E.pdfNov.27,2017更多资料下载请到五八文库wk.58sms.comC02E.pdfNov.27,2017!Note•Plea...
2024-12-12196110.43 MB296页251
IC封装资料_电容_0603CG470G500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1219611.05 MB27页15
IC封装资料_电容_GRM1885C1H820FA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121961944.07 KB30页13
IC封装资料_三极管_DTC124XET1G.pdf
©SemiconductorComponentsIndustries,LLC,2012October,2016−Rev.31PublicationOrderNumber:DTC124X/DMUN2234,MMUN2234L,MUN5234,DTC124XE...
2024-12-121961212.66 KB11页84
IC封装资料_电容_CC1206KKX7R7BB225.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-1219601.22 MB13页286
IC封装资料_电感_SDCL1005CR12JTDF.pdf
Specificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2013/05/15SunlordIndustrialPark,Dafuyu...
2024-12-121960376.19 KB4页178

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