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IC封装资料_电容_GCJ32ER71C226KE01L.pdf
ChipMultilayerCeramicCapacitorsforAutomotive2017C03E.pdfJun22,2017更多资料下载请到五八文库wk.58sms.comEURoHSCompliant��...
2024-12-1214804.17 MB96页185
IC封装资料_电感_YPRH0704-330M.pdf
SMDPowerInductors-YPRH0704Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjysmd.com.cn-1-■Features●H...
2024-12-121480730.34 KB5页162
IC封装资料_电容_CC0402JRX7R9BB471.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-1214801.22 MB13页12
IC封装资料_连接器_1757378.pdf
TableofcontentsDeviceconnectiontechnologyforsignals,data,andpowerfromPhoenixContact2HighdensityPCBterminalblocksandplug-inconnecto...
2024-12-12148036.13 MB445页148
IC封装资料_电感_MLP2016S1R5MT0S1.pdf
INDUCTORSMarch2015��MLP20162016[0806inch]**��JIS[EIA]��MLP2016�MLP��更多资料下载请到五八文库w...
2024-12-121480334.71 KB13页286
IC封装资料_电感_MLG1005S6N8HT000.pdf
INDUCTORSMay2016��MLG1005S1005[0402inch]**��JIS[EIA]��MLG1005S�MLG��更多资料下载请到五八文库wk....
2024-12-121480420.58 KB16页113
IC封装资料_电容_0201B103M250NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1214801.05 MB27页156
IC封装资料_电源管理芯片_E05012S-1W.pdf
YUANDC-DCCONVERTERE系列ExxxxS-xW3KVAC隔离0.5W-2W非稳压双输出SIP7脚封装输入电压5,12,15,24VDC输出电压(+/-)：3.3,5,9,12,15,18,24VDC如...
2024-12-121479374.55 KB3页187
AL-513IR-850-30C_08 (A-BRIGHT).pdf
AAA---BBBRRRIIIGGGHHHTTTA-BRIGHTINDUSTRIALCO.,LTD.PartNo.AL-513IR-850-30CDiffNo.0025mmRoundType：LEDLamps12008/3/20Notes:1.Alldime...
2024-12-111479329.38 KB5页46
IC封装资料_电源管理芯片_TPS79333DBVR.pdf
101001k10k2060100100k1M10MRippleRejection(dB)Frequency(Hz)VIN=3.8VCOUT=2.2F�CNR=0.1F�IOUT=10mAIOUT=200mA407090305080100VINVINVOU...
2024-12-1214791.44 MB35页289
IC封装资料_电容_EMK212AB7475KGHT.pdf
NoticeforTAIYOYUDENProducts[ForGeneralElectronicEquipment]PleasereadthisnoticebeforeusingtheTAIYOYUDENproducts.REMINDERS■Producti...
2024-12-121479653.27 KB26页71
IC封装资料_电容_GRM155R61A105KE01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121479920.26 KB29页268
IC封装资料_电源管理芯片_LTC4062EDD_TRPBF.pdf
LTC406214062fb■ChargeCurrentProgrammableUpto1A■ChargesSingle-CellLi-IonBatteriesDirectlyfromUSBPort■PresetFloatVoltagewith±0.3...
2024-12-121479263.04 KB20页253
IC封装资料_电容_0805B223K500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1214791.05 MB27页64
IC封装资料_电容_CC0805KRX7R9BB102.pdf
ProductSpecification–June16,2017V.18DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSGeneralPurpose&HighCapacitanceClass2,X7R6.3V...
2024-12-1214791.61 MB20页211
IC封装资料_电感_SWPA6045S4R7MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-1214781.32 MB22页205
IC封装资料_电感_NLV25T-R68J-EF.pdf
Pleasebesuretorequestdeliveryspecificationsthatprovidefurtherdetailsonthefeaturesandspecificationsoftheproductsforproperandsafeuse...
2024-12-121478316.79 KB6页201
IC封装资料_连接器_DF12B_3.0_-40DP-0.5V_86_.pdf
A1930.5mmPitchSMTBoard-to-BoardConnectorDF12Series■Features1.BroadVariationsofStackingHeightInadditionto0.5mmpitchultra-miniature...
2024-12-121478288.67 KB11页144
IC封装资料_连接器_BM28B0.6-18DP2-0.35V_53_.pdf
12019.7④0.35mmpitch,0.6mmheight,BoardtoBoardorBoardtoFPCConnectorswithRatedCurrentUpto5ABM28Series■Features1.Ratedcurrent5A2Powe...
2024-12-121478562.52 KB8页49
IC封装资料_电容_CL10C130JB8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-121477340.15 KB3页247

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