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IC资料

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IC封装资料_连接器_DF12B_3.0_-40DP-0.5V_86_.pdf
A1930.5mmPitchSMTBoard-to-BoardConnectorDF12Series■Features1.BroadVariationsofStackingHeightInadditionto0.5mmpitchultra-miniature...
2024-12-121478288.67 KB11页144
IC封装资料_连接器_AYF534235.pdf
–1–ACCTB1E201803-TDETAILEDFEATURESForFPC/FFCY5B/Y5BWFPC/FFCconnectors(0.5mmpitch)BacklockPitch0.5mm,lowprofile/spacesavinganddou...
2024-12-1214781.1 MB13页57
IC封装资料_连接器_SM05B-GHS-TB.pdf
GHCONNECTORGHCONNECTORGHCONNECTORGHCONNECTOR1.25mmpitch/DisconnectableCrimpstyleconnectorsEmbossTapeGHCONNECTORGHCONNECTORGHCONNEC...
2024-12-121477661.13 KB4页244
IC封装资料_电容_TAJA105M020RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-121477210.32 KB7页222
IC封装资料_电容_GCM0335C1H101JA16D.pdf
汽车用片状多层陶瓷电容器汽车用片状多层陶瓷电容器MurataManufacturingCo.,Ltd.C03C-4.pdf14.09.09C03C-4.pdf14.09.09•本PDF产品目录是从...
2024-12-1214775.94 MB73页144
IC封装资料_电感_LQW15AN5N6C10D.pdf
SpecNo.JELF243A-0051T-01P.1/10MURATAMFG.CO.,LTDReferenceOnlyCHIPCOIL(CHIPINDUCTORS)LQW15AN□□□□10DReferenceSpecification1.Scope...
2024-12-121477304.44 KB11页102
IC封装资料_电源管理芯片_LTC4412ES6_TRPBF.pdf
LTC441214412fbFormoreinformationwww.linear.com/LTC4412TypicalapplicaTionDescripTionLowLossPowerPath™ControllerinThinSOTTheLTC®44...
2024-12-121477486.18 KB14页219
IC封装资料_电源管理芯片_LTC3780IG_PBF.pdf
LTC37801RevGFormoreinformationwww.analog.comDocumentFeedbackTYPICALAPPLICATIONFEATURESAPPLICATIONSDESCRIPTIONHighEfficiency,Synchr...
2024-12-121477452.33 KB30页297
IC封装资料_电感_YNR5020-1R0M.pdf
SMDPowerInductors-YNR5020Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Lowp...
2024-12-121476664.7 KB5页64
IC封装资料_电容_CL10B102JB8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121476259.58 KB3页19
IC封装资料_电容_CL10A475KP8NNNL.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10A475KP8NNNL·Product:Multi-layerCeramicCapacitor...
2024-12-1214761.42 MB36页278
IC封装资料_电源管理芯片_LT3480EMSE_TRPBF.pdf
LT348013480feFormoreinformationwww.linear.com/LT3480TYPICALAPPLICATIONFEATURESAPPLICATIONSDESCRIPTION36V,2A,2.4MHzStep-DownSwitchi...
2024-12-121476462.12 KB24页35
IC封装资料_电感_NLCV25T-330K-EFD.pdf
•Allspecificationsaresubjecttochangewithoutnotice.•ConformitytoRoHSDirective:Thismeansthat,inconformitywithEUDirective2002/95/EC...
2024-12-121476249.79 KB16页164
IC封装资料_电容_TAJC685K025RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-121476210.32 KB7页298
IC封装资料_电容_GCJ188R71H153KA01D.pdf
ChipMultilayerCeramicCapacitorsforAutomotive2017C03E.pdfJun22,2017更多资料下载请到五八文库wk.58sms.comEURoHSCompliant��...
2024-12-1214764.17 MB96页225
IC封装资料_电容_CL10B333JB8NNNL.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B333JB8NNNL·Product:Multi-layerCeramicCapacitor...
2024-12-121476360.62 KB3页262
IC封装资料_电容_CL10B272KC8WPNC.pdf
-MiniatureSize-WideCapacitanceandVoltageRange-Tape&ReelforSurfaceMountAssembly-LowESR-GeneralElectronicCircuitGeneralFeaturesAppli...
2024-12-121475452.9 KB21页234
IC封装资料_电容_0805N101J201CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-1214751.26 MB20页89
IC封装资料_电容_C0603C471K3RACTU.pdf
1©KEMETElectronicsCorporation•KEMETTower•OneEastBrowardBoulevardC1002_X7R_SMD•11/8/2018FortLauderdale,FL33301USA•954-766-2800...
2024-12-1214751.48 MB25页278
IC封装资料_电容_0603B682K101NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1214751.05 MB27页194

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