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IC封装资料_连接器_1803316.pdf
TableofcontentsDeviceconnectiontechnologyforsignals,data,andpowerfromPhoenixContact2HighdensityPCBterminalblocksandplug-inconnecto...
2024-12-12144536.13 MB445页145
IC封装资料_连接器_DF12E_3.5_-50DP-0.5V_81_.pdf
A1930.5mmPitchSMTBoard-to-BoardConnectorDF12Series■Features1.BroadVariationsofStackingHeightInadditionto0.5mmpitchultra-miniature...
2024-12-121445288.67 KB11页121
IC封装资料_电容_CL10C471JB8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121445259.58 KB3页193
IC封装资料_电容_CC1206KKX7RABB104.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-1214451.22 MB13页278
IC封装资料_电容_0201B472K500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1214451.05 MB27页132
IC封装资料_电容_GCM155R71E473KA55D.pdf
ChipMultilayerCeramicCapacitorsforAutomotive2017C03E.pdfJun22,2017更多资料下载请到五八文库wk.58sms.comEURoHSCompliant��...
2024-12-1214444.17 MB96页218
IC封装资料_电容_0603CG181J500NT.pdf
IC封装资料_电容_0603CG181J500NT.pdf
2024-12-121444653.4 KB1页248
IC封装资料_三极管_SI2312BDS-T1-E3.pdf
VishaySiliconixSi2312BDSDocumentNumber:73235S10-0791-Rev.D,05-Apr-10www.vishay.com1N-Channel20V(D-S)MOSFETFEATURES•Halogen-freeAc...
2024-12-121444308.47 KB8页263
IC封装资料_电容_TAJD227M002RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-121444208.62 KB7页246
IC封装资料_电容_GCJ319R72A104KA01L.pdf
汽车用片状多层陶瓷电容器汽车用片状多层陶瓷电容器MurataManufacturingCo.,Ltd.C03C-4.pdf14.09.09C03C-4.pdf14.09.09•本PDF产品目录是从...
2024-12-1214445.94 MB73页9
IC封装资料_电容_GCJ21BR71E225KA01L.pdf
汽车用片状多层陶瓷电容器汽车用片状多层陶瓷电容器MurataManufacturingCo.,Ltd.C03C-4.pdf14.09.09C03C-4.pdf14.09.09•本PDF产品目录是从...
2024-12-1214445.94 MB73页271
IC封装资料_连接器_BM28B0.6-24DS2-0.35V_51_.pdf
12019.7④0.35mmpitch,0.6mmheight,BoardtoBoardorBoardtoFPCConnectorswithRatedCurrentUpto5ABM28Series■Features1.Ratedcurrent5A2Powe...
2024-12-121444562.52 KB8页143
IC封装资料_电容_CL10B334KO8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121444259.58 KB3页275
IC封装资料_电容_CL21B225KAFNNNE.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL21B225KAFNNNE·Product:Multi-layerCeramicCapacitor...
2024-12-1214441.45 MB36页28
IC封装资料_电源管理芯片_LTC3789IGN_TRPBF.pdf
LTC378913789fcFormoreinformationwww.linear.com/LTC3789TypicalapplicaTionFeaTuresapplicaTionsDescripTionHighEfficiency,Synchronous,...
2024-12-121444611.07 KB30页158
IC封装资料_电容_CC1206KRX7R9BB103.pdf
ProductSpecification–June16,2017V.18DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSGeneralPurpose&HighCapacitanceClass2,X7R6.3V...
2024-12-1214441.61 MB20页254
IC封装资料_电容_GJM1555C1H4R3WB01D.pdf
ChipMultilayerCeramicCapacitorsforGeneral2018C02E.pdfNov.27,2017更多资料下载请到五八文库wk.58sms.comC02E.pdfNov.27,2017!Note•Plea...
2024-12-12144310.43 MB296页63
IC封装资料_电容_GRM188R71H104KA93D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121443944.07 KB30页111
IC封装资料_电容_0805F824M500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1214431.05 MB27页182
IC封装资料_三极管_NTZD3154NT1G.pdf
©SemiconductorComponentsIndustries,LLC,2014June,2019−Rev.31PublicationOrderNumber:NTZD3154N/DNTZD3154NMOSFET–Dual,N-Channel,Sma...
2024-12-121442208.28 KB5页201

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