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IC封装资料_电容_1210B472K202NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1214421.05 MB27页264
IC封装资料_电容_GRM188R61E105KA12D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121442944.07 KB30页98
IC封装资料_连接器_A1254WR-S-10P.pdf
A1254SERIESCHANGJIANGCONNECTORSTEL:86-755-2995911929959129FAX:86-755-29959139Http://www.CJT.cn1.25mmpitchwiretoboardconnectorSpeci...
2024-12-121442281.76 KB3页191
IC封装资料_电感_YNR4030-2R2M.pdf
SMDPowerInductors-YNR4030Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Lowp...
2024-12-121442664.95 KB5页22
IC封装资料_电感_SDFL1608T270KTF.pdf
Specificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2013/11/15SunlordIndustrialPark,Dafuyu...
2024-12-121442457.75 KB7页269
IC封装资料_电容_0603F123M500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1214421.05 MB27页92
IC封装资料_电源管理芯片_LTC3601EUD_TRPBF.pdf
LTC360113601fcFormoreinformationwww.linear.com/LTC3601TYPICALAPPLICATIONFEATURESAPPLICATIONSDESCRIPTION1.5A,15VMonolithicSynchrono...
2024-12-121442491.31 KB26页81
IC封装资料_电感_NLC453232T-3R3K-PF.pdf
•Allspecificationsaresubjecttochangewithoutnotice.•ConformitytoRoHSDirective:Thismeansthat,inconformitywithEUDirective2002/95/EC...
2024-12-121442249.79 KB16页270
IC封装资料_电容_0805CG1R8C500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1214411.05 MB27页247
IC封装资料_过压保护_P0300SCLRP.pdf
SIDACtor®ProtectionThyristors©2017Littelfuse,Inc.Specificationsaresubjecttochangewithoutnotice.Revised:02/23/17BasebandProtectio...
2024-12-121441928.83 KB6页227
IC封装资料_连接器_1804881.pdf
https://www.phoenixcontact.com/pi/products/180488104/09/2019Page1/4Printed-circuitboardconnector-PC4/11-G-7,62-1804881Pleasebeinfo...
2024-12-121441218.83 KB4页241
IC封装资料_电容_CL10C910JB8NCNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121440259.58 KB3页4
IC封装资料_电源管理芯片_HX7530 _TO-92.pdf
HX75XX系列Ver2.00(1/9)系列LDO线性稳压器■产品简介系列是采用CMOS工艺制造，低功耗的高压稳压器，最高输入电压可达18V，输出电压范围为2....
2024-12-121440545.12 KB9页104
IC封装资料_电容_GRM0335C1H470GA01.pdf
ChipMultilayerCeramicCapacitorsforGeneral2018C02E.pdfNov.27,2017更多资料下载请到五八文库wk.58sms.comC02E.pdfNov.27,2017!Note•Plea...
2024-12-12144010.43 MB296页263
IC封装资料_电容_TAJA107K002RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-121440210.32 KB7页243
IC封装资料_电容_RVT2A4R7M0605-TR.pdf
RVTSeriesHUAHUIStandardproduct标准品Operatingwithwidetemperaturerange-40~+105C適用於-40~+105°C的寬溫範圍Loadlifeof2000hours負荷...
2024-12-1214391.08 MB3页209
IC封装资料_电容_CC0402KRX7R7BB393.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-1214391.22 MB13页143
IC封装资料_电源管理芯片_PAM2861ABR.pdf
PAM2861Documentnumber:DSxxxxxRev.1-11of12www.diodes.comJuly2013©DiodesIncorporatedPAM2861AProductLineofDiodesIncorporated1ALEDDRI...
2024-12-121439428.49 KB12页47
IC封装资料_电容_GRM1885C2A270FA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121439944.07 KB30页166
IC封装资料_电容_0805B501K500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1214391.05 MB27页40

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