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IC资料

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IC封装资料_连接器_AFC01-S31FCA-00.pdf
CUSTOMER:CUSTOMERP/N:PARTNAME:PARTNO.:0.5mmPitchH=2.0mmSMT掀盖式DAET:2016.05.08DAET:2016.05.10DAET:2016.05.12李涛设计朱成峰审核朱...
2024-12-1210541.85 MB10页38
IC封装资料_电容_GCM188R72A152KA37D.pdf
ChipMultilayerCeramicCapacitorsforAutomotive2017C03E.pdfJun22,2017更多资料下载请到五八文库wk.58sms.comEURoHSCompliant��...
2024-12-1210544.17 MB96页129
IC封装资料_电感_LQW15AN56NG00D.pdf
SpecNo.JELF243A-0050AA-01P.1/14MURATAMFG.CO.,LTDReferenceOnlyCHIPCOIL(CHIPINDUCTORS)LQW15AN□□□□00DReferenceSpecification1.Scop...
2024-12-121054376.63 KB15页92
IC封装资料_电容_CL10B105KO8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121053259.58 KB3页164
IC封装资料_数据转换器_AD5668BCPZ-1500RL7.pdf
Octal,12-/14-/16-Bit,SPIVoltageOutputdenseDACwith5ppm/°C,On-ChipReferenceDataSheetAD5628/AD5648/AD5668Rev.JDocumentFeedbackInform...
2024-12-1210531.04 MB30页129
IC封装资料_三极管_IXTH110N10L2.pdf
©2010IXYSCORPORATION,AllRightsReservedSymbolTestConditionsMaximumRatingsVDSSTJ=25°Cto150°C100VVDGRTJ=25°Cto150°C,RGS=1MΩ100V...
2024-12-121053225.58 KB6页86
IC封装资料_连接器_BM28B0.6-58DS2-0.35V_53_.pdf
12019.7④0.35mmpitch,0.6mmheight,BoardtoBoardorBoardtoFPCConnectorswithRatedCurrentUpto5ABM28Series■Features1.Ratedcurrent5A2Powe...
2024-12-121053562.52 KB8页90
IC封装资料_连接器_1844249.pdf
https://www.phoenixcontact.com/pi/products/184424904/09/2019Page1/4Feed-throughheader-MC1,5/5-G-3,5-1844249Pleasebeinformedthatthe...
2024-12-121053249.83 KB4页250
IC封装资料_三极管_SIHB15N60E-GE3.pdf
SiHB15N60Ewww.vishay.comVishaySiliconixS16-0799-Rev.F,02-May-161DocumentNumber:91485Fortechnicalquestions,contact:hvm@vishay.comTH...
2024-12-121052302.38 KB9页176
IC封装资料_电感_YSPI0420-2R2M.pdf
SMDPowerInductors-YSPI0420Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Mol...
2024-12-121052700.01 KB4页175
IC封装资料_连接器_DF12C-40DS-0.5V_81_.pdf
A1930.5mmPitchSMTBoard-to-BoardConnectorDF12Series■Features1.BroadVariationsofStackingHeightInadditionto0.5mmpitchultra-miniature...
2024-12-121052288.67 KB11页132
IC封装资料_电容_0805N180J500CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-1210521.26 MB20页14
IC封装资料_电容_0402X104K160NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1210521.05 MB27页294
IC封装资料_电感_YNR4030-220M.pdf
SMDPowerInductors-YNR4030Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Lowp...
2024-12-121052664.95 KB5页135
IC封装资料_电感_SWPA6040S330MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-1210521.32 MB22页101
IC封装资料_电源管理芯片_LT3470ETS8_TRPBF.pdf
LT347013470fdTypicalapplicaTionFeaTuresapplicaTionsDescripTionMicropowerBuckRegulatorwithIntegratedBoostandCatchDiodesTheLT®3470i...
2024-12-121052368.74 KB20页51
IC封装资料_电源管理芯片_LT1933ES6_TRPBF.pdf
LT193311933feTYPICALAPPLICATIONFEATURESAPPLICATIONSDESCRIPTION600mA,500kHzStep-DownSwitchingRegulatorinSOT-23andDFNPackagesTheLT®...
2024-12-121052445.58 KB20页21
IC封装资料_电容_CC0805KKX7R9BB474.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-1210521.22 MB13页209
IC封装资料_电源管理芯片_LTC4370CDE_PBF.pdf
LTC437014370fTypicalapplicaTionFeaTuresDescripTionTwo-SupplyDiode-ORCurrentBalancingControllerTheLTC®4370isatwo-supplycurrentshar...
2024-12-121051346.99 KB20页278
IC封装资料_电容_CL10B102KB8NFNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121051259.58 KB3页86

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