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IC资料

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IC封装资料_电容_CL10B333JB8NNND.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B333JB8NNND·Product:Multi-layerCeramicCapacitor...
2024-12-121044360.63 KB3页137
IC封装资料_电源管理芯片_ME6219C13M5G.pdf
南京微盟电子有限公司第1页共8页www.microne.com.cn电话：025-84731186ME6219系列线性稳压器Ver08300mA，超低噪声，超快响应LDO线性稳压器...
2024-12-121044353.77 KB8页287
IC封装资料_电容_CC0402JRNPO9BN100.pdf
PRODUCTSELECTIONGUIDE2014SMDRESISTORS+MLCCSMDCERAMICEMIFILTERCAPACITORS-X2Y®WIRELESSCOMPONENTSMULTILAYERCHIPVARISTORSwww.yageo.co...
2024-12-12104417.81 MB176页177
IC封装资料_电容_C1608X7S0J225M080AB.pdf
August2019MULTILAYERCERAMICCHIPCAPACITORSMULTILAYERCERAMICCHIPCAPACITORSMULTILAYERCERAMICCHIPCAPACITORSC0402[01005inch]C0603[0201i...
2024-12-1210441.67 MB57页148
IC封装资料_电源管理芯片_LTC4290BIUJ_PBF.pdf
LTC4290/LTC42711429071fbFormoreinformationwww.linear.com/LTC4290nPoEPSESwitches/RoutersnPoEPSEMidspansAPPLICATIONSFEATURESDESCRIPT...
2024-12-121044489.19 KB32页272
IC封装资料_电容_CL03B222KP3NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL03B222KP3NNNC·Product:Multi-layerCeramicCapacitor...
2024-12-1210441.45 MB36页50
IC封装资料_电容_GJM0335C1H3R3BB01D.pdf
ChipMultilayerCeramicCapacitorsforGeneral2018C02E.pdfNov.27,2017更多资料下载请到五八文库wk.58sms.comC02E.pdfNov.27,2017!Note•Plea...
2024-12-12104410.43 MB296页72
IC封装资料_电源管理芯片_AZ1117H-ADJTRG1.pdf
1Mar.2008Rev.2.1BCDSemiconductorManufacturingLimited1ALOWDROPOUTLINEARREGULATORAZ1117DataSheetGeneralDescriptionTheAZ1117isaseries...
2024-12-121044806.36 KB24页171
IC封装资料_电感_IHLP2020BZER4R7M01.pdf
IHLP-2020BZ-01www.vishay.comVishayDaleRevision:07-Jun-171DocumentNumber:34253Fortechnicalquestions,contact:magnetics@vishay.comTHI...
2024-12-121043402.67 KB6页208
IC封装资料_电源管理芯片_TPS560200DBVR.pdf
PHGNDVSENSEENCoLoR1R2CinVINVINVOUTProductFolderSample&BuyTechnicalDocumentsTools&SoftwareSupport&CommunityAnIMPORTANTNOTICEattheen...
2024-12-1210431.15 MB23页177
IC封装资料_连接器_KF2EDGCV-X-5.08-13P.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-121043627.15 KB1页177
IC封装资料_电容_CL10B332KB8SFNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121043259.58 KB3页271
IC封装资料_电源管理芯片_REF195ESZ-REEL.pdf
PrecisionMicropower,LowDropoutVoltageReferencesDataSheetREF19xSeriesRev.LInformationfurnishedbyAnalogDevicesisbelievedtobeaccurate...
2024-12-121043598.33 KB28页188
IC封装资料_连接器_AFC01-S04H1A-00.pdf
更多资料下载请到五八文库wk.58sms.com深圳市钜硕电子有限公司AFC01-S**F**-00
2024-12-1210431.58 MB1页240
IC封装资料_电容_CC0402FRNPO9BN330.pdf
ProductSpecification–January18,2017V.9DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORS01005NP0/X5R/X7R4VTO16V0.5pFto220nFRoHScom...
2024-12-121043998.46 KB11页200
IC封装资料_电容_CL10C820JB8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121043259.58 KB3页184
IC封装资料_电容_CL10A226MQ8NUNE.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121043259.58 KB3页232
IC封装资料_电感_NLCV32T-150K-EF.pdf
•Allspecificationsaresubjecttochangewithoutnotice.•ConformitytoRoHSDirective:Thismeansthat,inconformitywithEUDirective2002/95/EC...
2024-12-121043249.79 KB16页57
IC封装资料_电容_0603N270J500CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-1210421.26 MB20页36
IC封装资料_电源管理芯片_LTC3546EUFD_TRPBF.pdf
LTC354613546fdFormoreinformationwww.linear.com/3546LOADCURRENT(A)0.0010.01EFFICIENCY(%)POWERLOSS(W)1008075959085701001010.10.010.0...
2024-12-121042694.76 KB30页75

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