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IC资料

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IC封装资料_电容_0603N150J101CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-127821.26 MB20页202
IC封装资料_电容_CGA5L3X8R1H105K160AB.pdf
April2019MULTILAYERCERAMICCHIPCAPACITORSMULTILAYERCERAMICCHIPCAPACITORSCGA21005[0402inch]CGA31608[0603inch]CGA42012[0805inch]CGA53...
2024-12-12782724.43 KB16页273
IC封装资料_电源管理芯片_D121515S-2W.pdf
YUANDC-DCCONVERTERD系列DXXXXS(D)-1W/2W定压输入非稳压1KVAC双隔离双回路输出SIP7/DIP14脚封装输入电压5V/9V/12V/15V/24VDC输出电压（+-/+...
2024-12-12781543.53 KB4页266
IC封装资料_电容_CL10B472KC85PNC.pdf
-MiniatureSize-WideCapacitanceandVoltageRange-Tape&ReelforSurfaceMountAssembly-LowESR-GeneralElectronicCircuitGeneralFeaturesAppli...
2024-12-12781452.9 KB21页89
IC封装资料_电容_1206B301K500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-127811.05 MB27页82
IC封装资料_电容_CC0402JRX7R9BB682.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-127811.22 MB13页37
IC封装资料_电容_CL10B154KO8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B154KO8NNNC·Product:Multi-layerCeramicCapacitor...
2024-12-127811.45 MB36页8
IC封装资料_连接器_BM28B0.6-20DP2-0.35V_53_.pdf
12019.7④0.35mmpitch,0.6mmheight,BoardtoBoardorBoardtoFPCConnectorswithRatedCurrentUpto5ABM28Series■Features1.Ratedcurrent5A2Powe...
2024-12-12780562.52 KB8页100
IC封装资料_电容_CL21B104KBFNNNE.pdf
November20151.86gMLCC(02A104M)1pieceCarbonEmission更多资料下载请到五八文库wk.58sms.com1.86gMLCC(02A104M)1piece1.86gCarbonEmissionW...
2024-12-127807.55 MB84页185
IC封装资料_电容_CL10C680GB8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-12780316.17 KB3页235
IC封装资料_电容_GRM155R61A154KE19D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-12780920.26 KB29页208
IC封装资料_电容_CL10C470JB8NNND.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-12780316.29 KB3页142
IC封装资料_电容_0805B181K500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-127801.05 MB27页90
IC封装资料_电感_SDFL2012Q4R7KTF.pdf
Specificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2013/11/15SunlordIndustrialPark,Dafuyu...
2024-12-12780457.75 KB7页73
IC封装资料_电容_CC1206KRX7R9BB471.pdf
ProductSpecification–January18,2017V.9DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORS01005NP0/X5R/X7R4VTO16V0.5pFto220nFRoHScom...
2024-12-12780998.46 KB11页261
IC封装资料_电感_LQP15MN5N1B02D.pdf
SpecNo.JELF243C-0007P-01P.1/9MURATAMFG.CO.,LTD.ReferenceOnlyCHIPCOIL(CHIPINDUCTORS)LQP15MN□□□□02DReferenceSpecification1.Scope...
2024-12-12780245 KB9页234
IC封装资料_连接器_1714984.pdf
PHOENIXCONTACTDeutschlandGmbHPage1/5http://www.phoenixcontact.deFeb23,2010ExtractfromtheonlinecatalogMKDS5/3-9,5OrderNo.:1714984ht...
2024-12-12780224.59 KB5页156
IC封装资料_连接器_9631S-25Z02-GFN4.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-12780204.61 KB1页97
IC资料_HLS27DGB0570C (BANNER).pdf
DatasheetBanner'sHLS27HazardousLocationLEDStripLighthasasturdyaluminumhousingandisencasedinashatterproof,UV-stabilized,polycarbona...
2024-12-15779673.17 KB8页275
IC封装资料_三极管_DMN7022LFG-7.pdf
POWERDIisaregisteredtrademarkofDiodesIncorporated.DMN7022LFGDocumentnumber:DS37008Rev.1-21of6www.diodes.comJuly2014©DiodesIncorpo...
2024-12-12779412.23 KB6页176

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