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IC资料

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IC封装资料_电容_GRM1885C1H910JA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12776944.07 KB30页16
IC封装资料_三极管_AO3401.pdf
P-ChannelEnhancementModeMOSFETFeature-30V/-4.2A,RDS(ON)=55mΩ(MAX)@VGS=RDS(ON)=70mΩ(MAX)@VGSRDS(ON)=120mΩ(MAX)@VGSSuperHighdense...
2024-12-12775542.21 KB3页288
IC封装资料_电容_TAJC155M050RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-12775210.32 KB7页140
IC封装资料_连接器_AFC01-S35FCA-00.pdf
CUSTOMER:CUSTOMERP/N:PARTNAME:PARTNO.:0.5mmPitchH=2.0mmSMT掀盖式DAET:2016.05.08DAET:2016.05.10DAET:2016.05.12李涛设计朱成峰审核朱...
2024-12-127751.85 MB10页248
IC封装资料_连接器_5179031-1.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-12775157.59 KB2页207
IC封装资料_电容_CL10C471JC8NNND.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-12775316.26 KB3页216
IC封装资料_电源管理芯片_LTC1326CS8-2.5_PBF.pdf
1LTC1326/LTC1326-2.5132625fcTYPICALAPPLICATIOUAPPLICATIOSUFEATURESDESCRIPTIOUMicropowerPrecisionTripleSupplyMonitorsRSTOutputVolta...
2024-12-12775277.82 KB16页223
IC封装资料_电容_GRM216R61E105KA12D.pdf
IC封装资料_电容_GRM216R61E105KA12D.pdf
2024-12-127756.77 MB1页25
IC封装资料_电容_GCM1555C1H8R2DA16D.pdf
汽车用片状多层陶瓷电容器汽车用片状多层陶瓷电容器MurataManufacturingCo.,Ltd.C03C-4.pdf14.09.09C03C-4.pdf14.09.09•本PDF产品目录是从...
2024-12-127755.94 MB73页219
IC封装资料_电容_0402CG0R8B500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-127741.05 MB27页126
IC封装资料_语音芯片_NV040D.pdf
广州市九芯电子科技有限公司NVD系列语音芯片GUANGZHOUNINECHIPELECTRONTECHNOLOGYCO,.LTD.1NVD系列语音芯片（NV040D/NV080D/NV170D/NV340D...
2024-12-127741.2 MB16页266
IC封装资料_嵌入式微处理器_STC15W4K56S4-30I-LQFP64S.pdf
STC15W4K32S4系列单片机器件手册��...
2024-12-127746.56 MB1116页40
IC封装资料_电感_YPRH1204-102M.pdf
SMDPowerInductors-YPRH1204Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Hig...
2024-12-12774735.47 KB5页187
IC封装资料_电感_LQP03TN2N5B02D.pdf
SpecNo.JELF243C-0015T-01P.1/12MURATAMFG.CO.,LTDReferenceOnlyCHIPCOIL(CHIPINDUCTORS)LQP03TN□□□□02DREFERENCESPECIFICATION1.Scope...
2024-12-12774281.03 KB12页119
IC封装资料_电容_CL10C680JB8NCNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-12773316.28 KB3页92
IC封装资料_三极管_BSC016N06NSATMA1.pdf
BSC016N06NSOptiMOSTMPower-MOSFETFeatures•Optimizedforsynchronousrectification•100%avalanchetested•Superiorthermalresistance•N-...
2024-12-12773702.6 KB10页1
IC封装资料_电容_1206F223M500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-127731.05 MB27页67
IC封装资料_三极管_IRFP460PBF.pdf
DocumentNumber:91237www.vishay.comS-81360-Rev.A,28-Jul-081PowerMOSFETIRFP460,SiHFP460VishaySiliconixFEATURES•DynamicdV/dtRating•...
2024-12-12772254.77 KB9页1
IC封装资料_三极管_IPN70R600P7SATMA1.pdf
1IPN70R600P7SRev.2.1,2017-09-15FinalDataSheetPG-SOT223DrainPin2,TabGatePin1SourcePin3MOSFET700VCoolMOSªP7PowerTransistorCoolMOS™...
2024-12-127721.07 MB13页34
IC封装资料_电容_CL10B682KB8SFNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12772259.58 KB3页63

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