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IC封装资料_连接器_1730201.pdf
TableofcontentsDeviceconnectiontechnologyforsignals,data,andpowerfromPhoenixContact2HighdensityPCBterminalblocksandplug-inconnecto...
2024-12-1276736.13 MB445页153
IC封装资料_电源管理芯片_LT1963AES8_TRPBF.pdf
LT1963ASeries11963affFormoreinformationwww.linear.com/LT1963ATypicalapplicaTionDescripTion1.5A,LowNoise,FastTransientResponseLDORe...
2024-12-12767629.18 KB28页200
IC封装资料_电容_CC0805MKX5R6BB226.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-127671.22 MB13页28
IC封装资料_电感_LQW18AN82NJ00D.pdf
SpecNo.JELF243A-0024Y-01P.1/11MURATAMFG.CO.,LTDReferenceOnlyCHIPCOIL(CHIPINDUCTORS)LQW18AN□□□□00DREFERENCESPECIFICATION1.Scope...
2024-12-12767333.23 KB11页185
IC封装资料_电容_0201CG6R8D250NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-127671.05 MB27页38
IC封装资料_电容_TAJE337M010RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-12767210.32 KB7页222
IC封装资料_电容_GRM1555C1H1R2WA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-12766920.26 KB29页160
IC封装资料_电感_YSPI0730-R47M.pdf
SMDPowerInductors-YSPI0730Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Mol...
2024-12-12766702.26 KB5页292
IC封装资料_电容_TAJB474M050RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-12766210.32 KB7页244
IC封装资料_电容_RVT1V471M1010-TR.pdf
RVTSeriesHUAHUIStandardproduct标准品Operatingwithwidetemperaturerange-40~+105C適用於-40~+105°C的寬溫範圍Loadlifeof2000hours負荷...
2024-12-127661.08 MB3页85
IC封装资料_电容_CL10B333JB8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12766259.58 KB3页243
IC封装资料_电源管理芯片_MC7915CTG.pdf
©SemiconductorComponentsIndustries,LLC,2013July,2013−Rev.181PublicationOrderNumber:MC7900/DMC7900Series1.0ANegativeVoltageRegula...
2024-12-12766278.94 KB16页174
IC封装资料_电容_0805CG270J101NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-127661.05 MB27页154
IC封装资料_电源管理芯片_LTC6803HG-2_TRPBF.pdf
LTC6803-2/LTC6803-41680324faTYPICALAPPLICATIONFEATURESDESCRIPTIONMulticellBatteryStackMonitorTheLTC®6803isa2ndgeneration,complete...
2024-12-12766486.53 KB40页291
IC封装资料_电感_SWPA4018S2R2MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-127661.32 MB22页255
IC封装资料_电感_SWPA4030S150MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-127661.32 MB22页276
IC封装资料_电感_NLCV25T-6R8M-EF.pdf
•Allspecificationsaresubjecttochangewithoutnotice.•ConformitytoRoHSDirective:Thismeansthat,inconformitywithEUDirective2002/95/EC...
2024-12-12766249.79 KB16页100
IC封装资料_电容_0603N220J500CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-127651.26 MB20页130
IC封装资料_电容_TAJD106M035RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-12765210.32 KB7页110
IC封装资料_连接器_KF2EDGR-Y-3.81-11P.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-12765192.45 KB1页285

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