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IC资料

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IC封装资料_三极管_WSP4016.pdf
SymbolParameterRatingUnitsVDSDrain-SourceVoltage40VVGSGate-SourceVoltage±20VID@TC=25℃ContinuousDrainCurrent,VGS@10V115.5AID@TC=7...
2024-12-127641.38 MB7页215
IC封装资料_电容_TAJE226K035RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-12764210.32 KB7页150
IC封装资料_电感_WPN252010HR68MT.pdf
TheSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2016/07/21SunlordIndustrialPark,Daf...
2024-12-12764624.92 KB9页115
IC封装资料_电容_0402N390J500CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-127641.26 MB20页13
IC封装资料_电容_0402F104Z100CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-127641.26 MB20页268
IC封装资料_电感_LQG15HS2N2B02D.pdf
SpecNo.JELF243B-0010Q-01P.1/11MURATAMFG.CO.,LTDCHIPCOIL(CHIPINDUCTORS)LQG15HS□□□□02DREFERENCESPECIFICATION1.ScopeThisreference...
2024-12-12764360.21 KB11页56
IC封装资料_电容_GRM1555C1H2R7CA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-12763920.26 KB29页148
IC封装资料_连接器_DF12D_3.0_-20DP-0.5V_81_.pdf
A1930.5mmPitchSMTBoard-to-BoardConnectorDF12Series■Features1.BroadVariationsofStackingHeightInadditionto0.5mmpitchultra-miniature...
2024-12-12763288.67 KB11页112
IC封装资料_电容_CL10B473KO8NFNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B473KO8NFNC·Product:Multi-layerCeramicCapacitor...
2024-12-127631.45 MB36页120
IC封装资料_电感_YNR5040-220M.pdf
SMDPowerInductors-YNR5040Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Lowp...
2024-12-12763666.66 KB5页118
IC封装资料_电容_0805CG391J500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-127631.05 MB27页109
IC封装资料_电源管理芯片_LT1019CS8-4.5_PBF.pdf
1LT10191019fdPrecisionReferenceTheLT®1019isathirdgenerationbandgapvoltagerefer-enceutilizingthinfilmtechnologyandagreatlyimproved...
2024-12-12763243.94 KB12页250
IC封装资料_电容_CL10A105KO8NNND.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10A105KO8NNND·Product:Multi-layerCeramicCapacitor...
2024-12-127621.42 MB36页224
IC封装资料_电容_0603CG240J250NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-127621.05 MB27页144
IC封装资料_电感_MLK1005S10NJT000.pdf
INDUCTORSFebruary2015MultilayerCeramicMLK10051005[0402inch]**DimensionsCodeJIS[EIA]InductorsforHighFrequencyCircuitsMLK1005TypeMLK...
2024-12-12762209.31 KB10页242
IC封装资料_电容_TAJC106M020RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-12762210.32 KB7页211
IC封装资料_电容_TAJA476K006RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-12762210.32 KB7页106
IC封装资料_电容_GRM1555C1H1R0BA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-12761920.26 KB29页172
IC封装资料_电容_CL10C300JB8NCNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-12761316.27 KB3页113
IC封装资料_电容_0603CG750J500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-127611.05 MB27页240

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