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IC资料

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IC封装资料_电容_CC0805KKX7R7BB475.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-126851.22 MB13页283
IC封装资料_电容_GRM155R61C224KA12D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-12684920.26 KB29页273
IC封装资料_电容_GRM155R61A475MEAAD.pdf
GRM155R61A475MEAA_(0402,X5R:EIA,4.7uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:m...
2024-12-12684944.57 KB30页133
IC封装资料_电容_0603F203M500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-126841.05 MB27页95
IC封装资料_电容_AC0805JRNPO9BN200.pdf
85ProductSpecification–July5,2018V.11DATASHEETSURFACEMOUNTMULTILAYERCERAMICCAPACITORSAutomotivegradeNP0/X7R6.3VTO630V0.2pFto2.2µ...
2024-12-126841.06 MB24页253
IC封装资料_电源管理芯片_TPS63061DSCT.pdf
0.0010.010.11100.0001OutputCurrent(A)020308070100Efficiency(%)5010406090VIN=4.8VVIN=7.2VVOUT=5VTPS63061PowerSaveEnabledL1VINTPS630...
2024-12-126842.56 MB31页141
IC封装资料_电容_TAJC226M025RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-12684210.32 KB7页173
IC封装资料_连接器_HSC-200-D36P-X.pdf
ASeFINISHMATERIALANDFINISHJCELECTRONICSCORPORATION日本コネクト工業株式会社PARTNAME/PARTNUMBERDATEDRAWINGREV.NO,RELATED1DATEDE.CH.N...
2024-12-12684138.98 KB1页187
IC封装资料_连接器_AFC11-S13ICA-00.pdf
浙江博众电气有限公司ZHEJIANGBOZHONGELECTRICCO.，LTD承认书SPECIFICATIONFORAPPROVAL客户Customer：产品名Project：规格型号PartNo：贵公...
2024-12-126841.4 MB10页224
IC封装资料_连接器_AFC01-S43H1A-00.pdf
更多资料下载请到五八文库wk.58sms.com深圳市钜硕电子有限公司AFC01-S**F**-00
2024-12-126841.58 MB1页116
IC封装资料_连接器_A2541HWV-12P.pdf
A2541SERIESCHANGJIANGCONNECTORSTEL:86-755-2995911929959129FAX:86-755-29959139Http://www.CJT.cn2.54mmpitchwiretoboardconnectorSpeci...
2024-12-12684814.86 KB16页61
IC封装资料_电容_CL31A226MQHNNNE.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL31A226MQHNNNE·Product:Multi-layerCeramicCapacitor...
2024-12-126841.46 MB36页292
IC封装资料_电容_TAJC107M016RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-12683210.32 KB7页73
IC封装资料_电感_YSPI0750-4R7M.pdf
SMDPowerInductors-YSPI0750Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjysmd.com.cn-1-■Features●M...
2024-12-12683700.46 KB5页49
IC封装资料_电容_TAJA335K025RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-12683210.32 KB7页147
IC封装资料_电源管理芯片_SPX5205M5-L-5-0_TR.pdf
150mA,Low-NoiseLDOVoltageRegulatorSPX52051/8REVLFEATURES■■LowNoiseOutputLDO:40μVRMSPossible■■1%InitialAccuracy■■VeryLowQuie...
2024-12-12683469.15 KB8页69
IC封装资料_连接器_AFC11-S37ICA-00.pdf
浙江博众电气有限公司ZHEJIANGBOZHONGELECTRICCO.，LTD承认书SPECIFICATIONFORAPPROVAL客户Customer：产品名Project：规格型号PartNo：贵公...
2024-12-126831.4 MB10页295
IC封装资料_电感_YNR3015-2R2M.pdf
SMDPowerInductors-YNR3015Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Lowp...
2024-12-12683665.41 KB5页2
IC封装资料_电感_GLFR1608T2R2M-LR.pdf
(1/3)002-02/20080701/e531_glfr1608.fm•Allspecificationsaresubjecttochangewithoutnotice.SMDInductors(Coils)ForPowerLine(Wound,Magn...
2024-12-12683160.68 KB3页273
IC资料_HLS27DRW1130C (BANNER).pdf
DatasheetBanner'sHLS27HazardousLocationLEDStripLighthasasturdyaluminumhousingandisencasedinashatterproof,UV-stabilized,polycarbona...
2024-12-15683673.17 KB8页24

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