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IC资料

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IC封装资料_电容_GCM319R71H104KA37D.pdf
GCM319R71H104KA37_(1206,X7R,0.1uF,50Vdc)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)4....
2024-12-12680841.81 KB28页88
IC封装资料_电容_GCM155R71H102JA37D.pdf
汽车用片状多层陶瓷电容器汽车用片状多层陶瓷电容器MurataManufacturingCo.,Ltd.C03C-4.pdf14.09.09C03C-4.pdf14.09.09•本PDF产品目录是从...
2024-12-126805.94 MB73页273
IC封装资料_电容_GCM31CR71C475KA37L.pdf
汽车用片状多层陶瓷电容器汽车用片状多层陶瓷电容器MurataManufacturingCo.,Ltd.C03C-4.pdf14.09.09C03C-4.pdf14.09.09•本PDF产品目录是从...
2024-12-126795.94 MB73页117
IC封装资料_三极管_DMP3098LSS-13.pdf
DMP3098LSSDocumentnumber:DS31265Rev.4-21of5www.diodes.comSeptember2008©DiodesIncorporatedDMP3098LSSNEWPRODUCTSINGLEP-CHANNELENHAN...
2024-12-12679311.55 KB5页173
IC封装资料_电容_CL10C080DB81PNC.pdf
Supplier:Samsungelectro-mechanicsCL10C080DB81PNCProduct:Multi-layerCeramicCapacitorCAP,8,50V,±0.5,C0G,0603AEC-Q200QualifiedA.Dime...
2024-12-12679486.02 KB3页274
IC封装资料_电容_EKY-350ELL222MM25S.pdf
Productspecificationsinthiscatalogaresubjecttochangewithoutnotice.Requestourproductspecificationsbeforepurchaseand/oruse.Pleaseuse...
2024-12-12679385.18 KB3页83
IC封装资料_电容_CL10C820JB81PNC.pdf
●Supplier:Samsungelectro-mechanicsCL10C820JB81PNC●Product:Multi-layerCeramicCapacitorCAP,82㎊,50V,±5%,C0G,0603●AEC-Q200Qualifi...
2024-12-126795.8 MB36页2
IC封装资料_电感_SDFL1608T150KTF.pdf
Specificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2013/11/15SunlordIndustrialPark,Dafuyu...
2024-12-12679457.75 KB7页243
IC封装资料_电源管理芯片_LTC3615EUF_PBF.pdf
LTC3615/LTC3615-113615fbFormoreinformationwww.linear.com/LTC3615TypicalapplicaTionDescripTionDual4MHz,3ASynchronousStep-DownDC/DCC...
2024-12-12679673.13 KB32页64
IC封装资料_电容_0402CG0R8C500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-126791.05 MB27页203
IC封装资料_连接器_1733606.pdf
https://www.phoenixcontact.com/us/produkte/173360621.12.2012Page1/6PCBterminalblock-SMKDSP1,5/5-5,08-1733606Pleasebeinformedthatth...
2024-12-12678179.04 KB6页200
IC封装资料_电感_NLV32T-391J-PF.pdf
INDUCTORSJanuary2015WoundFerriteNLV32-PF3225[1210inch]**DimensionsCodeJIS[EIA]InductorsforStandardCircuitsNLV32-PFTypeNLV-PFSeries...
2024-12-12678224.35 KB10页296
IC封装资料_电源管理芯片_LT1963AEST-1.8_TRPBF.pdf
LT1963ASeries11963affFormoreinformationwww.linear.com/LT1963ATypicalapplicaTionDescripTion1.5A,LowNoise,FastTransientResponseLDORe...
2024-12-12678629.18 KB28页93
IC封装资料_电源管理芯片_UCC21520ADW.pdf
10911DriverVDDBOUTBVSSB1213NCNCUVLODEMODMOD151416DriverVDDAOUTAVSSAUVLODEMODMODFunctionalIsolationReinforcedIsolationDisable,UVLOa...
2024-12-126782.48 MB52页198
IC封装资料_电容_CL10C100JB8NNWC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-126781.45 MB36页196
IC封装资料_电容_1206CG360J500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-126781.05 MB27页298
IC封装资料_电源管理芯片_PAM3103AABADJ.pdf
PAM3103Documentnumber:DS36410Rev.2-31of11www.diodes.comMay2016©DiodesIncorporatedPAM3103NOTRECOMMENDEDFORNEWDESIGNUSEAP2127N/K/AP...
2024-12-12678592.33 KB11页194
IC封装资料_电容_CL10C080DC81PNC.pdf
-MiniatureSize-WideCapacitanceandVoltageRange-Tape&ReelforSurfaceMountAssembly-LowESR-GeneralElectronicCircuitGeneralFeaturesAppli...
2024-12-12677452.9 KB21页97
IC封装资料_电容_TAJB686M006RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-12677210.32 KB7页258
IC封装资料_连接器_BM28B0.6-6DP2-0.35V_53_.pdf
12019.7④0.35mmpitch,0.6mmheight,BoardtoBoardorBoardtoFPCConnectorswithRatedCurrentUpto5ABM28Series■Features1.Ratedcurrent5A2Powe...
2024-12-12677562.52 KB8页150

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