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IC资料

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IC封装资料_电容_CL10C100JB8NNWC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-126781.45 MB36页196
IC封装资料_电容_CL10C080DC81PNC.pdf
-MiniatureSize-WideCapacitanceandVoltageRange-Tape&ReelforSurfaceMountAssembly-LowESR-GeneralElectronicCircuitGeneralFeaturesAppli...
2024-12-12678452.9 KB21页97
IC封装资料_电容_1206CG360J500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-126781.05 MB27页298
IC封装资料_电源管理芯片_PAM3103AABADJ.pdf
PAM3103Documentnumber:DS36410Rev.2-31of11www.diodes.comMay2016©DiodesIncorporatedPAM3103NOTRECOMMENDEDFORNEWDESIGNUSEAP2127N/K/AP...
2024-12-12678592.33 KB11页194
IC封装资料_电容_TAJB686M006RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-12677210.32 KB7页258
IC封装资料_连接器_BM28B0.6-6DP2-0.35V_53_.pdf
12019.7④0.35mmpitch,0.6mmheight,BoardtoBoardorBoardtoFPCConnectorswithRatedCurrentUpto5ABM28Series■Features1.Ratedcurrent5A2Powe...
2024-12-12677562.52 KB8页150
IC封装资料_电源管理芯片_RS3236-3_0YUTDN4.pdf
RS3236REVB.61www.run-ic.comLowPower,LowDropout,500mARFLinearRegulatorsFEATURESLowDropoutVoltageThermal-OverloadProtectionOut...
2024-12-12677793.06 KB15页63
IC封装资料_电源管理芯片_MC7805BDTRKG.pdf
©SemiconductorComponentsIndustries,LLC,2014November,2014−Rev.271PublicationOrderNumber:MC7800/DMC7800,MC7800A,MC7800AE,NCV78001....
2024-12-12677296.53 KB31页68
IC封装资料_电容_0402B331M500CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-126771.26 MB20页133
IC封装资料_电感_LQW18AN11NJ80D.pdf
SpecNo.JELF243A-0102G-01P.1/10MURATAMFG.CO.,LTDReferenceOnlyCHIPCOIL(CHIPINDUCTORS)LQW18AN□□□□80DREFERENCESPECIFICATION1.Scope...
2024-12-12677345.03 KB12页25
IC封装资料_三极管_CSD17313Q2T.pdf
VGS-Gate-to-SourceVoltage(V)RDS(on)-On-StateResistance(m:)01234567891001020304050607080D007TC=25°C,ID=4ATC=125°C,ID=4AQg-GateCha...
2024-12-12676498.69 KB13页86
IC封装资料_电源管理芯片_TPS563209DDCR.pdf
V=50mV/div(accoupled)OTime=200µsec/divI=1A/divOLoadstep=0.75A-2.25ASlewrate=500mA/µsecTPS563209TPS562209VINVBSTSWGNDENVFB123456V...
2024-12-126761.23 MB28页38
IC封装资料_连接器_DF12D_5.0_-50DP-0.5V_81_.pdf
A1930.5mmPitchSMTBoard-to-BoardConnectorDF12Series■Features1.BroadVariationsofStackingHeightInadditionto0.5mmpitchultra-miniature...
2024-12-12676288.67 KB11页161
IC封装资料_电容_CL21C040CBANNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL21B332KBANNNC·Product:Multi-layerCeramicCapacitor...
2024-12-126761.45 MB36页103
IC封装资料_电容_GRM21BR71E225KE11L.pdf
GRM21BR71E225KE11_(0805,X7R:EIA,2.2uF,DC25V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:m...
2024-12-12676916.49 KB29页23
IC封装资料_电容_0402F823M500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-126761.05 MB27页5
IC封装资料_电容_0603CG0R5C500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-126761.05 MB27页107
IC封装资料_电感_NLV25T-100J-EF.pdf
Pleasebesuretorequestdeliveryspecificationsthatprovidefurtherdetailsonthefeaturesandspecificationsoftheproductsforproperandsafeuse...
2024-12-12676316.79 KB6页90
IC封装资料_电感_SWPA5012S1R5MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-126751.32 MB22页122
IC封装资料_电容_CC1206KRX7RABB222.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-126751.22 MB13页223

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