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IC封装资料_电容_0805B431K500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-126701.05 MB27页125
IC封装资料_电感_LQG15HN1N2S02D.pdf
SpecNo.JELF243B-0009T-01P.1/11MURATAMFG.CO.,LTDReferenceOnlyCHIPCOIL(CHIPINDUCTORS)LQG15HN□□□□02DREFERENCESPECIFICATION1.Scope...
2024-12-12670273.56 KB11页103
AL-H483OR6C (A-BRIGHT).pdf
AAA---BBBRRRIIIGGGHHHTTTA-BRIGHTINDUSTRIALCO.,LTD.PartNo.AL-H483OR6CDiffNo.4.8mmType:LEDLamps2006/9/201Notes:1.Alldimensionsareinm...
2024-12-11670324.92 KB5页243
IC封装资料_电容_AC1206KKX7R0BB104.pdf
85ProductSpecification–July5,2018V.11DATASHEETSURFACEMOUNTMULTILAYERCERAMICCAPACITORSAutomotivegradeNP0/X7R6.3VTO630V0.2pFto2.2µ...
2024-12-126701.06 MB24页291
IC封装资料_电容_CL10C020CB8NNND.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-12670340 KB3页53
IC封装资料_连接器_HJ30J-100TJN.pdf
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2024-12-126701.35 MB23页194
IC封装资料_电容_1206B226K160NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-126701.05 MB27页199
IC封装资料_电容_GRM188R61E225KA12D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12670944.07 KB30页143
IC封装资料_连接器_1935161.pdf
https://www.phoenixcontact.com/us/products/193516108/04/2015Page1/6PCBterminalblock-PT1,5/2-5,0-H-1935161Pleasebeinformedthattheda...
2024-12-12670172.21 KB6页43
IC封装资料_电容_1812CG220J501NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-126691.05 MB27页289
IC封装资料_电感_YPRH105R-221M.pdf
SMDPowerInductors-YPRH105RSeries深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjysmd.com.cn-1-■Features●U...
2024-12-12669765.25 KB5页275
IC封装资料_电容_CL10B104KO8NNNL.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B104KO8NNNL·Product:Multi-layerCeramicCapacitor...
2024-12-126691.45 MB36页40
IC封装资料_电容_GRM1555C1H910JA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-12669920.26 KB29页182
IC封装资料_电感_SWPA3012S4R7MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-126691.32 MB22页194
IC封装资料_电源管理芯片_AP2204K-3.3TRG1.pdf
AP2204Documentnumber:DS37168Rev.5-21of18www.diodes.comJuly2018©DiodesIncorporatedAP2204WIDEINPUTVOLTAGERANGE,150mAULDOREGULATORDe...
2024-12-12669890.63 KB18页71
IC封装资料_连接器_1715747.pdf
TableofcontentsDeviceconnectiontechnologyforsignals,data,andpowerfromPhoenixContact2HighdensityPCBterminalblocksandplug-inconnecto...
2024-12-1266936.13 MB445页197
IC封装资料_电源管理芯片_VB2405D-2W.pdf
DC-DCConverterVB系列宽压输入3KVDC隔离稳压自恢复过载短路保护单输出：VBXXXXS-1WVB系列DC-DC模块电源，输出端具有长时间自恢复过载保护和...
2024-12-12668890.92 KB3页220
IC封装资料_三极管_CSD16323Q3.pdf
VGS-Gate-to-SourceVoltage(V)RDS(on)-On-StateResistance(m:)012345678910051015202530D007TC=25qC,ID=24ATC=125qC,ID=24AQg-GateCharge(n...
2024-12-12668514.03 KB13页46
IC封装资料_电容_T491A475K010AT.pdf
©KEMETElectronicsCorporation•P.O.Box5928•Greenville,SC29606•864-963-6300•www.kemet.comT2005_T491•5/8/20171Oneworld.OneKEMETB...
2024-12-126681.54 MB23页159
IC封装资料_电容_CC0402JRNPO9BN750.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-126681.22 MB13页52

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