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IC资料

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IC封装资料_电容_CC1206JRNPO9BN682.pdf
ProductSpecification–January18,2017V.9DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORS01005NP0/X5R/X7R4VTO16V0.5pFto220nFRoHScom...
2024-12-12664998.46 KB11页299
AB-46W3-6VD-T5 (A-BRIGHT).pdf
AAA---BBBRRRIIIGGGHHHTTTA-BRIGHTINDUSTRIALCO.,LTD.A-BRIGHT10/30/2006SINGLELAMPLEDBULBDataSheetFeature:HighefficiencyLEDmaterialsar...
2024-12-11664199.54 KB4页229
IC封装资料_三极管_IRLML2244TRPBF.pdf
1/24/11IRLML2244TRPbFHEXFET��PowerMOSFETPD-97631www.irf.com1ORDERINGINFORMATION:Seedetailedorderingandshippinginformationonthela...
2024-12-12664322.11 KB10页248
IC封装资料_三极管_9926A.pdf
深圳市富满电子集团股份有限公司SHENZHENFINEMADELECTRONICSGROUPCO.,LTD.9926A(文件编号：S&CIC1368)20VN沟道增强型MOS场效应管www.superc...
2024-12-12664736.08 KB5页187
IC封装资料_电容_TAJE106K050RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-12664210.32 KB7页296
IC封装资料_三极管_IRLML6246TRPBF.pdf
10/12/12IRLML6246TRPbFHEXFET��PowerMOSFETwww.irf.com1ORDERINGINFORMATION:Seedetailedorderingandshippinginformationonthelastpageo...
2024-12-12663293.5 KB10页236
IC封装资料_连接器_1829248.pdf
https://www.phoenixcontact.com/us/products/182924810/28/2014Page1/5Basestrip-GMSTBV2,5/11-GF-7,62-1829248Pleasebeinformedthattheda...
2024-12-12663177.73 KB5页125
IC封装资料_电容_CL10X106MQ8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12663259.58 KB3页30
IC封装资料_电容_0603F105M160NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-126631.05 MB27页101
IC封装资料_电源管理芯片_LT1963ES8_TRPBF.pdf
1LT1963Series1963fcTYPICALAPPLICATIONUAPPLICATIOSUFEATURESDESCRIPTIOU1.5A,LowNoise,FastTransientResponseLDORegulators■Optimizedfo...
2024-12-12663343.5 KB20页97
IC封装资料_电源管理芯片_LT1963AEFE_PBF.pdf
LT1963ASeries11963affFormoreinformationwww.linear.com/LT1963ATypicalapplicaTionDescripTion1.5A,LowNoise,FastTransientResponseLDORe...
2024-12-12663629.18 KB28页179
IC封装资料_电容_0603B222K500CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-126631.26 MB20页115
IC封装资料_电容_CC0201CRNPO9BN3R3.pdf
ProductSpecification–January18,2017V.9DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORS01005NP0/X5R/X7R4VTO16V0.5pFto220nFRoHScom...
2024-12-12662998.46 KB11页156
IC封装资料_电容_GRM1555C1H511JA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-12662920.26 KB29页165
IC封装资料_电容_CL10C470JB81PNC.pdf
Supplier:Samsungelectro-mechanicsCL10C470JB81PNCProduct:Multi-layerCeramicCapacitorCAP,47,50V,±5%,C0G,0603AEC-Q200QualifiedA.Dime...
2024-12-126626.16 MB36页224
IC封装资料_连接器_1757336.pdf
TableofcontentsDeviceconnectiontechnologyforsignals,data,andpowerfromPhoenixContact2HighdensityPCBterminalblocksandplug-inconnecto...
2024-12-1266236.13 MB445页233
IC封装资料_电源管理芯片_LT3437IFE_TRPBF.pdf
1LT34373437fc■HighVoltagePowerConversion■14Vand42VAutomotiveSystems■IndustrialPowerSystems■DistributedPowerSystems■Battery-Po...
2024-12-12662626.23 KB28页13
IC封装资料_三极管_SSM3J56MFV_L3F_T.pdf
SSM3J56MFV2014-03-011TOSHIBAField-EffectTransistorSiliconP-ChannelMOSType(U-MOSⅥ)SSM3J56MFV○LoadSwitchingApplications•1.2Vdrive...
2024-12-12662281.33 KB6页124
IC封装资料_三极管_LSI1012XT1G.pdf
DBNumber:DB-270March2015,RevisionAPage1TAKCHEONGSEMICONDUCTOR150mWSOT-523SURFACEMOUNTPlasticPackageN-Channel1.8-V(G-S)MOSFETAbsolu...
2024-12-12662251.9 KB4页288
IC封装资料_电容_TAJA106M006RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-12662210.32 KB7页36

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