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IC资料

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IC封装资料_电源管理芯片_LT1963ES8_TRPBF.pdf
1LT1963Series1963fcTYPICALAPPLICATIONUAPPLICATIOSUFEATURESDESCRIPTIOU1.5A,LowNoise,FastTransientResponseLDORegulators■Optimizedfo...
2024-12-12662343.5 KB20页97
IC封装资料_电源管理芯片_LT1963AEFE_PBF.pdf
LT1963ASeries11963affFormoreinformationwww.linear.com/LT1963ATypicalapplicaTionDescripTion1.5A,LowNoise,FastTransientResponseLDORe...
2024-12-12662629.18 KB28页179
IC封装资料_电容_0603B222K500CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-126621.26 MB20页115
IC封装资料_三极管_SSM3J56MFV_L3F_T.pdf
SSM3J56MFV2014-03-011TOSHIBAField-EffectTransistorSiliconP-ChannelMOSType(U-MOSⅥ)SSM3J56MFV○LoadSwitchingApplications•1.2Vdrive...
2024-12-12662281.33 KB6页124
IC封装资料_三极管_LSI1012XT1G.pdf
DBNumber:DB-270March2015,RevisionAPage1TAKCHEONGSEMICONDUCTOR150mWSOT-523SURFACEMOUNTPlasticPackageN-Channel1.8-V(G-S)MOSFETAbsolu...
2024-12-12662251.9 KB4页288
IC封装资料_电容_TAJA106M006RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-12662210.32 KB7页36
IC封装资料_电容_TAJB335M016RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-12661210.32 KB7页202
IC封装资料_电感_YP1005-4R7M.pdf
SMDPowerInductors-YP1005Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Highc...
2024-12-12661776.32 KB5页223
IC封装资料_电容_CC0201CRNPO9BN3R3.pdf
ProductSpecification–January18,2017V.9DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORS01005NP0/X5R/X7R4VTO16V0.5pFto220nFRoHScom...
2024-12-12661998.46 KB11页156
IC封装资料_电容_GRM1555C1H511JA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-12661920.26 KB29页165
IC封装资料_电容_CL10C470JB81PNC.pdf
Supplier:Samsungelectro-mechanicsCL10C470JB81PNCProduct:Multi-layerCeramicCapacitorCAP,47,50V,±5%,C0G,0603AEC-Q200QualifiedA.Dime...
2024-12-126616.16 MB36页224
IC封装资料_电源管理芯片_LT3437IFE_TRPBF.pdf
1LT34373437fc■HighVoltagePowerConversion■14Vand42VAutomotiveSystems■IndustrialPowerSystems■DistributedPowerSystems■Battery-Po...
2024-12-12661626.23 KB28页13
IC封装资料_电感_NLCV25T-2R2M-PF.pdf
•Allspecificationsaresubjecttochangewithoutnotice.•ConformitytoRoHSDirective:Thismeansthat,inconformitywithEUDirective2002/95/EC...
2024-12-12660249.79 KB16页53
IC封装资料_电容_0402CG470G500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-126601.05 MB27页166
IC封装资料_电容_CL10C1R8BB8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12660259.58 KB3页62
IC封装资料_电容_T491C106K016AT.pdf
©KEMETElectronicsCorporation•P.O.Box5928•Greenville,SC29606•864-963-6300•www.kemet.comT2005_T491•5/8/20171Oneworld.OneKEMETB...
2024-12-126601.54 MB23页40
IC封装资料_连接器_SM02B-GHHD-B-TB.pdf
GHCONNECTORGHCONNECTORGHCONNECTORGHCONNECTOR1.25mmpitch/DisconnectableCrimpstyleconnectorsEmbossTapeGHCONNECTORGHCONNECTORGHCONNEC...
2024-12-12659661.11 KB4页125
IC封装资料_电容_CL10B224KO8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12659259.58 KB3页109
IC封装资料_电源管理芯片_MAX6814XK_T.pdf
GeneralDescriptionTheMAX6814isalow-powerwatchdogcircuitinatiny5-pinSC70package.Thisdeviceimprovessystemreliabilitybymonitoringthes...
2024-12-12659904.46 KB6页192
IC封装资料_电容_CC0402BRNPO9BNR68.pdf
ProductSpecification–January18,2017V.9DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORS01005NP0/X5R/X7R4VTO16V0.5pFto220nFRoHScom...
2024-12-12659998.46 KB11页76

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