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IC资料

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IC封装资料_电容_GRM1885C1H200JA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12668944.07 KB30页164
IC封装资料_电感_SWPA3012S3R3MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-126681.32 MB22页10
IC封装资料_电源管理芯片_LT3464ETS8_TRPBF.pdf
LT346413464fTYPICALAPPLICATIOUAPPLICATIOSUDESCRIPTIOUFEATURESITinySolutionSizeILowQuiescentCurrent•25µAinActiveMode•0.5µAinShu...
2024-12-12668332.17 KB16页76
IC封装资料_电容_GRM21BR61C106KE15L.pdf
ChipMultilayerCeramicCapacitorsforGeneral2018C02E.pdfNov.27,2017更多资料下载请到五八文库wk.58sms.comC02E.pdfNov.27,2017!Note•Plea...
2024-12-1266710.43 MB296页21
IC封装资料_电感_NLV25T-330J-PF.pdf
INDUCTORSJanuary2015WoundFerriteNLV25-PF2520[1008inch]**DimensionsCodeJIS[EIA]InductorsforStandardCircuitsNLV25-PFTypeNLV-PFSeries...
2024-12-12667215.06 KB9页14
IC封装资料_连接器_KF141R-2.54-3P.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-12667674.62 KB1页109
IC封装资料_电容_CS0805KKX7R8BB105.pdf
ProductSpecification–June19,2017V.4DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSSoftterminationNPOandX7R16VTO3KV0.47pFto2.2uF...
2024-12-126672.48 MB19页180
IC封装资料_电容_C222J104K40Y350.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-126661.98 MB5页3
IC封装资料_三极管_2N7002T-7-F.pdf
2N7002TDocumentnumber:DS30301Rev.15-21of5www.diodes.comAugust2018©DiodesIncorporated2N7002TN-CHANNELENHANCEMENTMODEMOSFETProductS...
2024-12-12666484.37 KB5页239
IC封装资料_电容_EMK316BJ225KL-T.pdf
注意■本产品目录所记载的内容为2016年10月之内容。因改良等原因，可能会不经预告而变更记载内容，所以请务必在使用前先确认最新的产品信息...
2024-12-126661.83 MB52页237
IC封装资料_电源管理芯片_HX6206P282MR _SOT-23.pdf
HX6206系列Ver2.01线性稳压器■产品简介系列是高纹波抑制率、低功耗、低压差，具有过流和短路保护的CMOS降压型电压稳压器。这些器件具有很...
2024-12-126661.1 MB8页149
IC封装资料_电容_CC0603GRNPO9BN561.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-126661.22 MB13页140
IC封装资料_电源管理芯片_LT8610ACEMSE_TRPBF.pdf
LT8610AC/LT8610AC-118610acfaFormoreinformationwww.linear.com/LT8610ACTypicalapplicaTionFeaTuresDescripTion42V,3.5ASynchronousStep-...
2024-12-12666620.25 KB26页170
IC封装资料_电感_NLV25T-470J-EF.pdf
Pleasebesuretorequestdeliveryspecificationsthatprovidefurtherdetailsonthefeaturesandspecificationsoftheproductsforproperandsafeuse...
2024-12-12666316.79 KB6页96
IC封装资料_机械式继电器_G6K-2G.pdf
1G6KG6KSurfaceMountingRelaySurfaceMountingRelaywiththeWorld’sSmallestMountingArea•Subminiaturemodelassmallas5.2(H)×6.5(W)×10(L...
2024-12-126651.72 MB9页230
IC封装资料_电容_CL10A474KB8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12665259.58 KB3页133
IC封装资料_电容_CC1206KRX7RABB222.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-126651.22 MB13页223
IC封装资料_电感_NLCV25T-220K-PF.pdf
•Allspecificationsaresubjecttochangewithoutnotice.•ConformitytoRoHSDirective:Thismeansthat,inconformitywithEUDirective2002/95/EC...
2024-12-12665249.79 KB16页296
IC封装资料_连接器_SM09B-GHS-TBT.pdf
GHCONNECTORGHCONNECTORGHCONNECTORGHCONNECTOR1.25mmpitch/DisconnectableCrimpstyleconnectorsEmbossTapeGHCONNECTORGHCONNECTORGHCONNEC...
2024-12-12665661.03 KB4页99
IC封装资料_连接器_AFC01-S09FCA-00.pdf
CUSTOMER:CUSTOMERP/N:PARTNAME:PARTNO.:0.5mmPitchH=2.0mmSMT掀盖式DAET:2016.05.08DAET:2016.05.10DAET:2016.05.12李涛设计朱成峰审核朱...
2024-12-126651.85 MB10页168

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