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IC封装资料_三极管_DMP32D4S-13.pdf
DMP32D4SDocumentnumber:DS35822Rev.4-21of6www.diodes.comNovember2013©DiodesIncorporatedDMP32D4SADVANCEINFORMATION30VP-CHANNELENHAN...
2024-12-121985417.7 KB6页258
IC封装资料_三极管_MMBF4393LT1G.pdf
©SemiconductorComponentsIndustries,LLC,1994October,2016−Rev.121PublicationOrderNumber:MMBF4391LT1/DMMBF4391L,MMBF4392L,MMBF4393L...
2024-12-121985259.05 KB6页238
IC封装资料_电容_CL10B104MO8NNND.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B104MO8NNND·Product:Multi-layerCeramicCapacitor...
2024-12-1219841.45 MB36页177
IC封装资料_电容_GRM188R61A224KA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121984944.07 KB30页269
IC封装资料_电容_ERF0JM681F12OT.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-12198415.39 MB230页117
IC封装资料_电容_1206CG331J500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1219841.05 MB27页194
IC封装资料_电感_YPRH1204-151M.pdf
SMDPowerInductors-YPRH1204Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Hig...
2024-12-121983735.47 KB5页166
IC封装资料_电感_YSPI0530-R47M.pdf
SMDPowerInductors-YSPI0530Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Mol...
2024-12-121983698.99 KB4页10
IC封装资料_电感_YSPI0750-330M.pdf
SMDPowerInductors-YSPI0750Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjysmd.com.cn-1-■Features●M...
2024-12-121983700.46 KB5页256
IC封装资料_电容_CL10B105KP8NFNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B105KP8NFNC·Product:Multi-layerCeramicCapacitor...
2024-12-1219821.45 MB36页160
IC封装资料_连接器_532611171.pdf
更多资料下载请到五八文库wk.58sms.comDETAILZ注釈NOTE1.コネクタ53261**19の詳細寸法については図面SD-53261-024をご参照ください。REFERT...
2024-12-121981597.48 KB6页275
IC封装资料_电容_JMK105BBJ475MV-F.pdf
NoticeforTAIYOYUDENProducts[ForGeneralElectronicEquipment]PleasereadthisnoticebeforeusingtheTAIYOYUDENproducts.REMINDERS■Producti...
2024-12-121981857.12 KB55页133
IC封装资料_电源管理芯片_TLV70230DBVR.pdf
TLV702xxGNDENINOUTVINVOUTOnOffCINCOUT1FCeramic�ProductFolderOrderNowTechnicalDocumentsTools&SoftwareSupport&CommunityAnIMPORTANTN...
2024-12-1219811.28 MB34页45
IC封装资料_连接器_KF2EDGR-Y-3.81-14P.pdf
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2024-12-121981192.45 KB1页7
IC封装资料_连接器_KF170V-5.0-2P.pdf
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2024-12-121981207.6 KB1页66
IC封装资料_数据转换器_AD5648ARUZ-2.pdf
Octal,12-/14-/16-Bit,SPIVoltageOutputdenseDACwith5ppm/°C,On-ChipReferenceDataSheetAD5628/AD5648/AD5668Rev.JDocumentFeedbackInform...
2024-12-1219811.04 MB30页297
IC封装资料_电感_SWPA4012S4R7NT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-1219801.32 MB22页297
IC封装资料_电容_0805B333K500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1219801.05 MB27页75
IC封装资料_电容_CL10B122KB8NFNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B122KB8NFNC·Product:Multi-layerCeramicCapacitor...
2024-12-1219801.45 MB36页209
IC封装资料_电容_0805X225K160NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1219801.05 MB27页30

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