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IC资料

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IC封装资料_电容_JMK105BBJ475MV-F.pdf
NoticeforTAIYOYUDENProducts[ForGeneralElectronicEquipment]PleasereadthisnoticebeforeusingtheTAIYOYUDENproducts.REMINDERS■Producti...
2024-12-121981857.12 KB55页133
IC封装资料_电源管理芯片_TLV70230DBVR.pdf
TLV702xxGNDENINOUTVINVOUTOnOffCINCOUT1FCeramic�ProductFolderOrderNowTechnicalDocumentsTools&SoftwareSupport&CommunityAnIMPORTANTN...
2024-12-1219811.28 MB34页45
IC封装资料_连接器_KF2EDGR-Y-3.81-14P.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-121981192.45 KB1页7
IC封装资料_连接器_KF170V-5.0-2P.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-121981207.6 KB1页66
IC封装资料_数据转换器_AD5648ARUZ-2.pdf
Octal,12-/14-/16-Bit,SPIVoltageOutputdenseDACwith5ppm/°C,On-ChipReferenceDataSheetAD5628/AD5648/AD5668Rev.JDocumentFeedbackInform...
2024-12-1219811.04 MB30页297
IC封装资料_电容_GCM1555C1H102GA16D.pdf
汽车用片状多层陶瓷电容器汽车用片状多层陶瓷电容器MurataManufacturingCo.,Ltd.C03C-4.pdf14.09.09C03C-4.pdf14.09.09•本PDF产品目录是从...
2024-12-1219805.94 MB73页48
IC封装资料_电感_NLV32T-560J-EFD.pdf
Pleasebesuretorequestdeliveryspecificationsthatprovidefurtherdetailsonthefeaturesandspecificationsoftheproductsforproperandsafeuse...
2024-12-121980325.74 KB6页88
IC封装资料_电感_SWPA4012S4R7NT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-1219801.32 MB22页297
IC封装资料_电容_0805B333K500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1219801.05 MB27页75
IC封装资料_电容_CL10B122KB8NFNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B122KB8NFNC·Product:Multi-layerCeramicCapacitor...
2024-12-1219801.45 MB36页209
IC封装资料_电容_0805X225K160NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1219801.05 MB27页30
IC封装资料_电感_YPRH1204-680M.pdf
SMDPowerInductors-YPRH1204Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Hig...
2024-12-121980735.47 KB5页278
IC封装资料_电容_GRM188R71H333KA61D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121980944.07 KB30页194
IC封装资料_电容_CL10C222JB8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121980259.57 KB3页135
IC封装资料_电容_0201CG180J500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1219791.05 MB27页242
IC封装资料_电感_NLV25T-100J-EFD.pdf
Pleasebesuretorequestdeliveryspecificationsthatprovidefurtherdetailsonthefeaturesandspecificationsoftheproductsforproperandsafeuse...
2024-12-121979318.58 KB6页110
IC封装资料_电容_0603N1R0C500CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-1219791.26 MB20页211
IC封装资料_电感_WPN3012H2R2MT.pdf
TheSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2016/07/21SunlordIndustrialPark,Daf...
2024-12-121979624.92 KB9页236
IC封装资料_电容_JMK105BJ225MV-F.pdf
SpecSheethttp://www.ty-top.comThedataisreferenceonly.Electricalcharacteristicsvarydependingonenvironmentormeasurementcondition.TAI...
2024-12-121979482.28 KB3页131
IC封装资料_电容_1210B105K101NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1219791.05 MB27页10

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