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IC封装资料_连接器_1844333.pdf
https://www.phoenixcontact.com/us/produkte/184433302.11.2012Page1/6Basestrip-MC1,5/14-G-3,5-1844333Pleasebeinformedthatthedatashow...
2024-12-121976190.53 KB6页192
IC封装资料_电源管理芯片_HX6206P282MR.pdf
HX6206系列Ver2.0(1/8)管脚序号管脚定义功能说明MR封装形式PP封装形式P1R封装形式SOT23-3SOT89-3SOT89-3112VSS芯片接地端231VOUT芯片输出端...
2024-12-121975655.49 KB8页113
IC封装资料_电源管理芯片_LTC3200ES6-5_TRPBF.pdf
LTC3200/LTC3200-51APPLICATIOSUDESCRIPTIOUFEATURESTYPICALAPPLICATIOUTheLTC®3200/LTC3200-5arelownoise,constantfre-quencyswitchedcap...
2024-12-121975263.11 KB12页24
IC封装资料_电容_T491B227M004AT.pdf
1©KEMETElectronicsCorporation•KEMETTower•OneEastBrowardBoulevardT2005_T491•8/20/2018FortLauderdale,FL33301USA•954-766-2800•w...
2024-12-1219751.47 MB23页124
IC封装资料_时钟管理_CDCV304PW.pdf
35781Y01Y11Y21Y3LogicControl21OECLKINProductFolderOrderNowTechnicalDocumentsTools&SoftwareSupport&CommunityAnIMPORTANTNOTICEatthee...
2024-12-1219751.08 MB17页132
IC封装资料_电容_GCM1885C2A121JA16D.pdf
汽车用片状多层陶瓷电容器汽车用片状多层陶瓷电容器MurataManufacturingCo.,Ltd.C03C-4.pdf14.09.09C03C-4.pdf14.09.09•本PDF产品目录是从...
2024-12-1219745.94 MB73页285
IC封装资料_电感_NLCV32T-101K-EFD.pdf
•Allspecificationsaresubjecttochangewithoutnotice.•ConformitytoRoHSDirective:Thismeansthat,inconformitywithEUDirective2002/95/EC...
2024-12-121974249.79 KB16页142
IC封装资料_电容_0805B105K500AT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1219741.05 MB27页205
IC封装资料_电容_CL21B331KBANNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL21B222KBANNNC·Product:Multi-layerCeramicCapacitor...
2024-12-1219741.45 MB36页125
IC封装资料_电容_CL10C222JA8NNNC.pdf
-MiniatureSize-WideCapacitanceandVoltageRange-Tape&ReelforSurfaceMountAssembly-LowESR-GeneralElectronicCircuitGeneralFeaturesAppli...
2024-12-121974452.9 KB21页262
IC封装资料_电容_0201B102K250NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1219731.05 MB27页206
IC封装资料_连接器_1753534.pdf
https://www.phoenixcontact.com/us/produkte/175353403.10.2012Page1/7Basestrip-MSTBV2,5/7-G-1753534Pleasebeinformedthatthedatashowni...
2024-12-121973203.46 KB7页284
IC封装资料_电容_CL10C330KB8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121973259.58 KB3页232
IC封装资料_电容_CC0402KRX5R5BB474.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-1219731.22 MB13页298
IC封装资料_电容_ERJ1HM560F09OT.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-12197315.39 MB230页92
IC封装资料_电容_0805B331K101NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1219721.05 MB27页152
IC封装资料_电容_LMK212BBJ226MG-T.pdf
NoticeforTAIYOYUDENProducts[ForGeneralElectronicEquipment]PleasereadthisnoticebeforeusingtheTAIYOYUDENproducts.REMINDERS■Producti...
2024-12-121972653.27 KB26页83
IC封装资料_电容_TAJB476M010RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-121972210.32 KB7页238
IC封装资料_电源管理芯片_LTC3441EDE_TRPBF.pdf
LTC344113441fcFormoreinformationwww.linear.com/LTC3441TypicalapplicaTionFeaTuresapplicaTionsDescripTionHighCurrentMicropowerSynchr...
2024-12-121971354.19 KB16页177
IC封装资料_电源管理芯片_SPX5205M5-L_TR.pdf
150mA,Low-NoiseLDOVoltageRegulatorSPX52051/8REVLFEATURES■■LowNoiseOutputLDO:40μVRMSPossible■■1%InitialAccuracy■■VeryLowQuie...
2024-12-121971469.15 KB8页50

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