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IC资料

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IC封装资料_连接器_FH28-40S-0_5SH.pdf
■Features1.HighlyreliableconnectionandrobuststructureMulti-polarizedconnectors,reinforcedbodystructureandhighFPCretentionproduced...
2024-12-12568492.73 KB12页130
IC封装资料_电容_0201HQ1R6B250NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-125681.05 MB27页24
IC封装资料_电容_0201B472K160NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-125681.05 MB27页281
IC封装资料_连接器_1806287.pdf
https://www.phoenixcontact.com/us/produkte/180628719.10.2012Page1/6Basestrip-GMSTB2,5/8-GF-7,62-1806287Pleasebeinformedthatthedata...
2024-12-12568186.6 KB6页140
IC封装资料_连接器_1755817.pdf
TableofcontentsDeviceconnectiontechnologyforsignals,data,andpowerfromPhoenixContact2HighdensityPCBterminalblocksandplug-inconnecto...
2024-12-1256836.13 MB445页239
IC封装资料_电容_GRM155R61C225ME44D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-12567920.26 KB29页233
IC封装资料_电容_0805B223K500CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-125671.26 MB20页43
IC封装资料_电源管理芯片_LT1764EQ_PBF.pdf
1LT1764Series1764fb3A,FastTransientResponse,LowNoise,LDORegulators■OptimizedforFastTransientResponse■OutputCurrent:3A■DropoutVo...
2024-12-12567360.65 KB20页165
IC封装资料_电容_TAJV157K020RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-12567210.32 KB7页63
IC封装资料_电容_TAJB155K050RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-12567210.32 KB7页297
IC封装资料_电容_LMK212B7225MG-T.pdf
NoticeforTAIYOYUDENProducts[ForGeneralElectronicEquipment]PleasereadthisnoticebeforeusingtheTAIYOYUDENproducts.REMINDERS■Producti...
2024-12-12567653.27 KB26页88
IC封装资料_电容_GRM1885C1H330FA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12567944.07 KB30页1
IC封装资料_微控制器_TMP86FH09ANGG,ZHZ.pdf
8BitMicrocontrollerTLCS-870/CSeriesTMP86FH09ANG更多资料下载请到五八文库wk.58sms.comRevisionHistoryDateRevision2007/4/91FirstReleas...
2024-12-125661.89 MB200页292
IC封装资料_三极管_MMUN2214LT1G.pdf
©SemiconductorComponentsIndustries,LLC,2012November,2016−Rev.41PublicationOrderNumber:DTC114Y/DMUN2214,MMUN2214L,MUN5214,DTC114Y...
2024-12-12566219.42 KB12页161
IC封装资料_电容_AC0603JRNPO0BN470.pdf
85ProductSpecification–July5,2018V.11DATASHEETSURFACEMOUNTMULTILAYERCERAMICCAPACITORSAutomotivegradeNP0/X7R6.3VTO630V0.2pFto2.2µ...
2024-12-125661.81 MB24页109
IC封装资料_电源管理芯片_TPS53513RVER.pdf
GNDMODEVREGVDDNCVINVINVINTPS53513RFPGOODENVBSTN/CSW1234567892221201918171615PGNDSWSWSWVIN10EN11121314PGNDPGNDPGNDPGNDPGOODFB2328GN...
2024-12-125665.49 MB42页224
IC封装资料_电容_GRT31CC81E106KE01L.pdf
GRT31CC81E106KE01_(1206,X6S:EIA,10uF,DC25V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm...
2024-12-12566958.83 KB30页135
IC封装资料_电感_YP0402-221M.pdf
SMDPowerInductors-YP0402Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Highc...
2024-12-12566771.92 KB4页124
IC封装资料_电容_CL10B225KP8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12566259.58 KB3页248
IC封装资料_电容_CL10B221KC8WPNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12566259.58 KB3页228

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