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AB-46G1-24VD-MF (A-BRIGHT).pdf
AAA---BBBRRRIIIGGGHHHTTTA-BRIGHTINDUSTRIALCO.,LTD.A-BRIGHTSINGLELAMPLEDBULBDataSheetFeature:HighefficiencyLEDmaterialsareusedinthi...
2024-12-11566218.67 KB3页219
IC封装资料_微控制器_TMP86FH09ANGG,ZHZ.pdf
8BitMicrocontrollerTLCS-870/CSeriesTMP86FH09ANG更多资料下载请到五八文库wk.58sms.comRevisionHistoryDateRevision2007/4/91FirstReleas...
2024-12-125661.89 MB200页292
IC封装资料_三极管_MMUN2214LT1G.pdf
©SemiconductorComponentsIndustries,LLC,2012November,2016−Rev.41PublicationOrderNumber:DTC114Y/DMUN2214,MMUN2214L,MUN5214,DTC114Y...
2024-12-12566219.42 KB12页161
IC封装资料_电容_GRM1555C1H1R0WA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-12566920.26 KB29页115
IC封装资料_电源管理芯片_TPS53513RVER.pdf
GNDMODEVREGVDDNCVINVINVINTPS53513RFPGOODENVBSTN/CSW1234567892221201918171615PGNDSWSWSWVIN10EN11121314PGNDPGNDPGNDPGNDPGOODFB2328GN...
2024-12-125665.49 MB42页224
IC封装资料_电容_GRM188R71E474KA12D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12566944.07 KB30页152
IC封装资料_电感_YP0402-221M.pdf
SMDPowerInductors-YP0402Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Highc...
2024-12-12566771.92 KB4页124
IC封装资料_电容_EMK316AB7106KLHT.pdf
NoticeforTAIYOYUDENProducts[ForGeneralElectronicEquipment]PleasereadthisnoticebeforeusingtheTAIYOYUDENproducts.REMINDERS■Producti...
2024-12-12565653.27 KB26页273
IC封装资料_电容_GRM188R60J225KE19D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12565944.07 KB30页260
IC封装资料_电容_GCM1555C1H271JA16D.pdf
汽车用片状多层陶瓷电容器汽车用片状多层陶瓷电容器MurataManufacturingCo.,Ltd.C03C-4.pdf14.09.09C03C-4.pdf14.09.09•本PDF产品目录是从...
2024-12-125655.94 MB73页289
IC封装资料_电感_NLCV32T-330K-EF.pdf
•Allspecificationsaresubjecttochangewithoutnotice.•ConformitytoRoHSDirective:Thismeansthat,inconformitywithEUDirective2002/95/EC...
2024-12-12565249.79 KB16页214
IC封装资料_电源管理芯片_APX811-29UG-7.pdf
APX811/8124-PinMicroprocessorSupervisorWithManualResetAPX811/812Rev.21of10OCTOBER2009DS31960www.diodes.com©DiodesIncorporated•Pr...
2024-12-12565257.37 KB10页32
IC封装资料_电容_CL10C140JB8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12564259.57 KB3页178
IC封装资料_连接器_KF2EDGCVM-X-7.62-10P.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-12564634.58 KB1页71
IC封装资料_电源管理芯片_SP708SEN-L_TR.pdf
•www.maxlinear.com•Rev3.0.1SP706R/SP706S/SP706T,SP708S/SP708TDataSheet3.0V/3.3VLowPowerMicroprocessorSupervisoryCircuitsGeneralD...
2024-12-125641.04 MB22页162
IC封装资料_电容_0402CG221J500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-125641.05 MB27页70
IC封装资料_电容_CL10F104ZO8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12563259.58 KB3页298
IC封装资料_三极管_IRF100B202.pdf
HEXFET®PowerMOSFETDSGBenefitsImprovedGate,AvalancheandDynamicdV/dtRuggednessFullyCharacterizedCapacitanceandAvalancheSOA...
2024-12-12563617.28 KB10页65
IC封装资料_电容_CL10C4R7CB8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12563259.58 KB3页198
IC封装资料_电容_GRM188R71H103JA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12563944.07 KB30页5

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