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IC资料

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IC封装资料_电源管理芯片_MC34063ADR2G.pdf
©SemiconductorComponentsIndustries,LLC,2016December,2016−Rev.241PublicationOrderNumber:MC34063A/DMC34063A,MC33063A,SC34063A,SC33...
2024-12-124181.19 MB15页299
IC封装资料_连接器_1829222.pdf
https://www.phoenixcontact.com/us/products/182922210/28/2014Page1/5Basestrip-GMSTBV2,5/9-GF-7,62-1829222Pleasebeinformedthatthedat...
2024-12-12418177.78 KB5页115
IC封装资料_电容_0603X225K100NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-124181.05 MB27页43
IC封装资料_电容_CL10F105ZO8NNND.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10F105ZO8NNND·Product:Multi-layerCeramicCapacitor...
2024-12-124171.42 MB36页224
IC封装资料_电感_NLC453232T-221K-PF.pdf
•Allspecificationsaresubjecttochangewithoutnotice.•ConformitytoRoHSDirective:Thismeansthat,inconformitywithEUDirective2002/95/EC...
2024-12-12417249.79 KB16页270
IC封装资料_连接器_KF127-5.08-4P.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-12417505.5 KB1页72
IC封装资料_电源管理芯片_F0512S-1W.pdf
YUANDC-DCCONVERTERF系列FxxxxS-xW3KVDC隔离0.1W～2W非稳压单输出SIP7脚封装输入电压3.3V/5V/9V/12V/15V/24VDC输出电压3.3V/5V/9V/12V/15V/...
2024-12-12417489.36 KB4页88
IC封装资料_电容_0201CG1R0B250NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-124161.05 MB27页115
IC封装资料_电容_GRM1885C1H6R8CA01D.pdf
GRM1885C1H6R8CA01_(0603,C0G:EIA,6.8pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:m...
2024-12-12416944.09 KB30页194
IC封装资料_连接器_1806245.pdf
PHOENIXCONTACTInc.,USAPage1/5http://www.phoenixcon.comJan25,2011ExtractfromtheonlinecatalogGMSTB2,5/4-GF-7,62OrderNo.:1806245Thefi...
2024-12-12416230.05 KB5页196
IC封装资料_电感_SWPA8040S331MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-124161.32 MB22页255
IC封装资料_电容_C822E474J90C000.pdf
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2024-12-124162.9 MB5页244
IC封装资料_电容_GRM155R60J225ME15D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-12416920.26 KB29页148
IC封装资料_电容_0603B473K101NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-124161.05 MB27页229
IC封装资料_电感_SDFL1608Q1R8KTF.pdf
Specificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2013/11/15SunlordIndustrialPark,Dafuyu...
2024-12-12415457.75 KB7页146
IC封装资料_连接器_1757608.pdf
https://www.phoenixcontact.com/us/produkte/175760819.10.2012Page1/7Basestrip-MSTBA2,5/16-G-1757608Pleasebeinformedthatthedatashown...
2024-12-12415203.75 KB7页174
IC封装资料_电容_CC0603CRNPO9BN6R2.pdf
ProductSpecification–January18,2017V.9DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORS01005NP0/X5R/X7R4VTO16V0.5pFto220nFRoHScom...
2024-12-12415998.46 KB11页249
IC封装资料_电源管理芯片_TPS25200DRVR.pdf
654321ENILIMOUTINGNDFAULTPowerPADTPS25200DRV300kΩ300kΩCINCOUTVOUTVINFaultsignalVIORILIMUVLO(2.35V)OVLO(7.6V)OverVoltageClamp(OVC...
2024-12-124154.65 MB31页161
IC封装资料_连接器_KF2EDGCV-X-5.08-10P.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-12415627.15 KB1页237
IC封装资料_连接器_DF12D_4.0_-32DP-0.5V_81_.pdf
A1930.5mmPitchSMTBoard-to-BoardConnectorDF12Series■Features1.BroadVariationsofStackingHeightInadditionto0.5mmpitchultra-miniature...
2024-12-12415288.67 KB11页114

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