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AB-9G1-24V-E12 (A-BRIGHT).pdf
AAA---BBBRRRIIIGGGHHHTTTA-BRIGHTINDUSTRIALCO.,LTD.A-BRIGHT2/9/2007SINGLELAMPLEDBULBDataSheetFeature:HighefficiencyLEDmaterialsareu...
2024-12-11387189.84 KB3页158
IC封装资料_电容_CL10C270JB8NNND.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-12387316.29 KB3页100
IC封装资料_连接器_1.25T-13A.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-12387273.91 KB1页112
IC封装资料_电容_0603N5R6C500CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-123861.26 MB20页111
IC封装资料_电源管理芯片_LTC1732EMS-8.4_TRPBF.pdf
1LTC1732-8.417328fTYPICALAPPLICATIOUFEATURESAPPLICATIOSUDESCRIPTIOULithium-IonLinearBatteryChargerControllerTheLTC®1732-8.4isacom...
2024-12-12386238.04 KB12页19
IC封装资料_三极管_SI9945BDY-T1-GE3.pdf
VishaySiliconixSi9945BDYNewProductDocumentNumber:64737S09-0321-Rev.A,02-Mar-09www.vishay.com1DualN-Channel60-V(D-S)MOSFETFEATURES...
2024-12-12386291.96 KB9页5
IC封装资料_三极管_SI4848DY-T1-E3.pdf
VishaySiliconixSi4848DYDocumentNumber:71356S09-0870-Rev.C,18-May-09www.vishay.com1N-Channel150-V(D-S)MOSFETFEATURES•Halogen-freeA...
2024-12-12386263.24 KB7页6
IC封装资料_三极管_IRFR9120NTRPBF.pdf
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2024-12-12386345.91 KB11页140
IC封装资料_电容_TAJC336M010RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-12386210.32 KB7页173
IC封装资料_电感_YSPI0730-4R7M.pdf
SMDPowerInductors-YSPI0730Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Mol...
2024-12-12386702.26 KB5页244
IC封装资料_电容_1206CG102J500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-123851.05 MB27页281
IC封装资料_电容_CL10B153KO8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B153KO8NNNC·Product:Multi-layerCeramicCapacitor...
2024-12-12385361.31 KB3页300
IC资料_K50RPFF50GREQ (BANNER).pdf
DatasheetCompact,Single-PointDevicesforError-ProofingofBin-PickingOperationsToviewordownloadthelatesttechnicalinformationaboutthis...
2024-12-15385583.23 KB8页185
IC封装资料_连接器_1827884.pdf
TableofcontentsDeviceconnectiontechnologyforsignals,data,andpowerfromPhoenixContact2HighdensityPCBterminalblocksandplug-inconnecto...
2024-12-1238536.13 MB445页36
IC封装资料_电容_CL05A154KP5NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL05A154KP5NNNC·Product:Multi-layerCeramicCapacitor...
2024-12-12385359.78 KB3页104
IC封装资料_电源管理芯片_LT1763MPS8_PBF.pdf
Formoreinformationwww.linear.com/LT1763LT1763Series11763fhTypicalapplicaTionDescripTion500mA,LowNoise,LDOMicropowerRegulatorsTheLT...
2024-12-123851.22 MB22页278
IC封装资料_电容_CC0603KRX7R9BB471.pdf
PRODUCTSELECTIONGUIDE2014SMDRESISTORS+MLCCSMDCERAMICEMIFILTERCAPACITORS-X2Y®WIRELESSCOMPONENTSMULTILAYERCHIPVARISTORSwww.yageo.co...
2024-12-1238517.81 MB176页123
IC封装资料_电容_0402N101J500CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-123841.26 MB20页15
IC封装资料_电容_CL10C050DB8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12384259.58 KB3页55
IC封装资料_电源管理芯片_TPS23753APWR.pdf
TPS23753M1RCSCOUTDVCGATERTNVCCSCVCCTLVBD158VC10.1�FRDENRCLSFromEthernetTransformersVDD1VSSCLSCINVOUTRCTLCCTLFromSparePairsorTrans...
2024-12-123841.47 MB35页226

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