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IC封装资料_连接器_AFC11-S18ICA-00.pdf
浙江博众电气有限公司ZHEJIANGBOZHONGELECTRICCO.，LTD承认书SPECIFICATIONFORAPPROVAL客户Customer：产品名Project：规格型号PartNo：贵公...
2024-12-123581.4 MB10页43
IC封装资料_连接器_1843619.pdf
PHOENIXCONTACTDeutschlandGmbHPage1/4http://www.phoenixcontact.deMar11,2010ExtractfromtheonlinecatalogMCV1,5/3-G-3,5OrderNo.:184361...
2024-12-12358227 KB4页235
IC封装资料_电源管理芯片_RT9013-18GB.pdf
RT90131DS9013-10April2011www.richtek.comPinConfigurationsApplications�CDMA/GSMCellularHandsets�PortableInformationAppliances�La...
2024-12-12357384.76 KB13页241
IC封装资料_电容_GRM1885C2A101FA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12357944.07 KB30页182
IC封装资料_电容_293D476X9010B2TE3.pdf
293Dwww.vishay.comVishaySpragueRevision:07-Feb-20191DocumentNumber:40002Fortechnicalquestions,contact:tantalum@vishay.comTHISDOCUM...
2024-12-12357568.22 KB24页201
IC封装资料_电容_CC0402GRNPO8BN150.pdf
ProductSpecification–January18,2017V.9DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORS01005NP0/X5R/X7R4VTO16V0.5pFto220nFRoHScom...
2024-12-12357998.46 KB11页117
IC封装资料_电容_CL10B153KB8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12357259.58 KB3页153
IC封装资料_电感_MLG1005SR12JT000.pdf
INDUCTORSMay2016��MLG1005S1005[0402inch]**��JIS[EIA]��MLG1005S�MLG��更多资料下载请到五八文库wk....
2024-12-12356420.58 KB16页15
IC封装资料_三极管_IRF9310TRPBF.pdf
www.irf.com1IRF9310PbFHEXFET��PowerMOSFETNotes��through�areonpage2FeaturesandBenefitsApplications•��...
2024-12-12356366.6 KB8页232
IC封装资料_连接器_AFC11-S43ICA-00.pdf
浙江博众电气有限公司ZHEJIANGBOZHONGELECTRICCO.，LTD承认书SPECIFICATIONFORAPPROVAL客户Customer：产品名Project：规格型号PartNo：贵公...
2024-12-123561.4 MB10页127
IC封装资料_电源管理芯片_ADR421BRZ-REEL7.pdf
ADI中文版数据手册是英文版数据手册的译文，敬请谅解翻译中可能存在的语言组织或翻译错误，ADI不对翻译中存在的差异或由此产生的错误负责。...
2024-12-12356716.44 KB24页81
IC封装资料_电源管理芯片_AL8861Y-13.pdf
AL8861Documentnumber:DS39435Rev.3-21of18www.diodes.comOctober2017©DiodesIncorporatedAL8861NEWPRODUCT40V1.5ABUCKLEDDRIVERDescripti...
2024-12-123551.1 MB18页295
IC封装资料_电容_CL10A225KO8N3NC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10A225KO8N3NC·Product:Multi-layerCeramicCapacitor...
2024-12-123551.45 MB36页261
IC封装资料_电容_CC0805JRNPO0BN200.pdf
ProductSpecification–January18,2017V.9DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORS01005NP0/X5R/X7R4VTO16V0.5pFto220nFRoHScom...
2024-12-12355998.46 KB11页127
IC封装资料_电容_GRM1555C1H7R5WA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-12355920.26 KB29页13
IC封装资料_电容_0805F475M500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-123551.05 MB27页181
IC封装资料_三极管_WSF45P10.pdf
BVDSSRDSONID-100V44mΩ-40A�AdvancedhighcelldensityTrenchtechnology�SuperLowGateCharge�ExcellentCdv/dteffectdecline�GreenDevice...
2024-12-12354794.98 KB9页252
IC封装资料_三极管_DMN3150L-7.pdf
DMN3150LDocumentnumber:DS31126Rev.9-21of5www.diodes.comOctober2013©DiodesIncorporatedDMN3150L31NYMN-CHANNELENHANCEMENTMODEFIELDEF...
2024-12-12354387.24 KB5页184
IC封装资料_电源管理芯片_TPS2384PAP.pdf
PSE+48�VSCLSDA-�ISDA-�OTPS2384OptionalMSP430Micro-Controller+48�VReturnSpare�PairSingnal�PairSingnal�PairSpare�PairTPS2375...
2024-12-123542.08 MB60页147
IC封装资料_连接器_DF12E_3.0_-50DP-0.5V_81_.pdf
A1930.5mmPitchSMTBoard-to-BoardConnectorDF12Series■Features1.BroadVariationsofStackingHeightInadditionto0.5mmpitchultra-miniature...
2024-12-12354288.67 KB11页73

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