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IC封装资料_电感_LQP15MN10NG02D.pdf
SpecNo.JELF243C-0007P-01P.1/9MURATAMFG.CO.,LTD.ReferenceOnlyCHIPCOIL(CHIPINDUCTORS)LQP15MN□□□□02DReferenceSpecification1.Scope...
2024-12-12354245 KB9页40
IC封装资料_电容_593D227X0010D2TE3.pdf
593Dwww.vishay.comVishaySpragueRevision:27-Jun-20191DocumentNumber:40005Fortechnicalquestions,contact:tantalum@vishay.comTHISDOCUM...
2024-12-12354531.77 KB18页41
IC封装资料_电容_CL21B474KBFNNNE.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL21B474KBFNNNE·Product:Multi-layerCeramicCapacitor...
2024-12-123531.45 MB36页264
IC封装资料_电容_C3216X5R1E476MTJ00E.pdf
MULTILAYERCERAMICCHIPCAPACITORSMULTILAYERCERAMICCHIPCAPACITORSC0402[01005inch]C0603[0201inch]C1005[0402inch]C1608[0603inch]C2012[0...
2024-12-123531.61 MB56页293
IC封装资料_电容_GRM21BR60J476ME15L.pdf
GRM21BR60J476ME15_(0805,X5R:EIA,47uF,DC6.3V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:m...
2024-12-12353936.88 KB30页259
IC封装资料_电源管理芯片_LT3651EUHE-8.4_TRPBF.pdf
LT3651-8.2/LT3651-8.4136518284faFormoreinformationwww.linear.com/LT3651-8.2TYPICALAPPLICATIONFEATURESAPPLICATIONSDESCRIPTIONMonoli...
2024-12-12353429.93 KB24页64
IC封装资料_电容_CC1206JRNPO9BN101.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-123521.22 MB13页234
IC封装资料_电容_0805CG181J101NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-123511.05 MB27页260
IC封装资料_三极管_IRFPC60LCPBF.pdf
DocumentNumber:91244www.vishay.comS11-0443-Rev.B,14-Mar-111Thisdatasheetissubjecttochangewithoutnotice.THEPRODUCTDESCRIBEDHEREINAN...
2024-12-12351753.52 KB9页78
IC封装资料_电容_AC0402KRX7R9BB103.pdf
85ProductSpecification–July5,2018V.11DATASHEETSURFACEMOUNTMULTILAYERCERAMICCAPACITORSAutomotivegradeNP0/X7R6.3VTO630V0.2pFto2.2µ...
2024-12-123511.06 MB24页46
IC封装资料_电容_TAJC337M006RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-12351210.32 KB7页160
IC封装资料_电源管理芯片_SGM2036-2_8YN5GTR.pdf
SGM2036300mA,LowPower,LowDropout,RFLinearRegulatorsREV.A.4SGMicroCorpwww.sg-micro.comGENERALDESCRIPTIONTheSGM2036serieslow-power,l...
2024-12-12350834.94 KB20页19
IC封装资料_电感_NLCV32T-1R5M-EFRD.pdf
•Allspecificationsaresubjecttochangewithoutnotice.•ConformitytoRoHSDirective:Thismeansthat,inconformitywithEUDirective2002/95/EC...
2024-12-12350249.79 KB16页99
IC封装资料_电容_TAJA476K002RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-12349210.32 KB7页224
IC封装资料_电感_YPRH104R-4R7M.pdf
SMDPowerInductors-YPRH104RSeries深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjysmd.com.cn-1-■Features●U...
2024-12-12349762.21 KB4页58
IC封装资料_电容_C312G473J4SC000.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-123482.19 MB4页272
IC封装资料_电源管理芯片_TLV1117-33IDCYR.pdf
TLV1117-ADJOUTPUTADJ/GNDINPUTProductFolderSample&BuyTechnicalDocumentsTools&SoftwareSupport&CommunityTLV1117SLVS561L–DECEMBER2004...
2024-12-123481.68 MB40页53
IC封装资料_电容_CL10B473KB8NNND.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B473KB8NNND·Product:Multi-layerCeramicCapacitor...
2024-12-12348361.37 KB3页25
IC封装资料_电容_LMK105BBJ475MVLF.pdf
NoticeforTAIYOYUDENProducts[ForGeneralElectronicEquipment]PleasereadthisnoticebeforeusingtheTAIYOYUDENproducts.REMINDERS■Producti...
2024-12-12348653.27 KB26页202
IC封装资料_电容_CL10A105KL8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12348259.57 KB3页240

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