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IC资料

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IC封装资料_连接器_BM28B0.6-6DS2-0.35V_51_.pdf
12019.7④0.35mmpitch,0.6mmheight,BoardtoBoardorBoardtoFPCConnectorswithRatedCurrentUpto5ABM28Series■Features1.Ratedcurrent5A2Powe...
2024-12-121641562.52 KB8页288
IC封装资料_连接器_1766136.pdf
https://www.phoenixcontact.com/us/products/176613610/24/2014Page1/5Basestrip-GMSTB2,5/3-G-7,62-1766136Pleasebeinformedthatthedatas...
2024-12-121204169.07 KB5页14
IC封装资料_连接器_BM28B0.6-6DP2-0.35V_53_.pdf
12019.7④0.35mmpitch,0.6mmheight,BoardtoBoardorBoardtoFPCConnectorswithRatedCurrentUpto5ABM28Series■Features1.Ratedcurrent5A2Powe...
2024-12-12678562.52 KB8页150
IC封装资料_电容_RVT1A470M0405-TR.pdf
RVTSeriesHUAHUIStandardproduct标准品Operatingwithwidetemperaturerange-40~+105C適用於-40~+105°C的寬溫範圍Loadlifeof2000hours負荷...
2024-12-1211171.08 MB3页183
IC封装资料_电源管理芯片_SGM6603-ADJYN6GTR.pdf
SGM660390%EfficientSynchronousStep-UpConverterwith1ASwitchGENERALDESCRIPTIONTheSGM6603isaconstantfrequency,currentmode,synchronous...
2024-12-121576444 KB12页210
IC封装资料_电容_ERE1AM471F11OT.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-12112715.39 MB230页3
IC封装资料_电源管理芯片_SGM6600-ADJYN6GTR.pdf
SGM660090%EfficientSynchronousStep-UpConverterwith1.2ASwitchGENERALDESCRIPTIONTheSGM6600isa1.2MHz,constantfrequency,currentmode,sy...
2024-12-121601559.51 KB14页149
IC封装资料_电容_CL10B472KB8NFNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B472KB8NFNC·Product:Multi-layerCeramicCapacitor...
2024-12-1217321.45 MB36页282
IC封装资料_电容_1206B272K500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1218701.05 MB27页54
IC封装资料_电感_YP0705-3R3M.pdf
SMDPowerInductors-YP0705Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Highc...
2024-12-121599721.48 KB5页16
IC封装资料_连接器_BM28B0.6-16DP2-0.35V_51_.pdf
12019.7④0.35mmpitch,0.6mmheight,BoardtoBoardorBoardtoFPCConnectorswithRatedCurrentUpto5ABM28Series■Features1.Ratedcurrent5A2Powe...
2024-12-121837562.52 KB8页226
IC封装资料_连接器_1766149.pdf
https://www.phoenixcontact.com/us/products/176614910/24/2014Page1/5Basestrip-GMSTB2,5/4-G-7,62-1766149Pleasebeinformedthatthedatas...
2024-12-12586169.12 KB5页51
IC封装资料_电源管理芯片_SN74AUP1T34QDCKRQ1.pdf
SN74AUP1T34-Q1ADASHostProcessorControlOutputCameraModule1CameraModule2CameraModule3ToMultipleLoadsCopyright©2016,TexasInstruments...
2024-12-121213950.08 KB18页13
IC封装资料_连接器_BM28B0.6-10DS2-0.35V_53_.pdf
12019.7④0.35mmpitch,0.6mmheight,BoardtoBoardorBoardtoFPCConnectorswithRatedCurrentUpto5ABM28Series■Features1.Ratedcurrent5A2Powe...
2024-12-121648562.52 KB8页84
IC封装资料_电容_GRM188R70J104KA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121206944.07 KB30页68
IC封装资料_连接器_BM28B0.6-10DS2-0.35V_51_.pdf
12019.7④0.35mmpitch,0.6mmheight,BoardtoBoardorBoardtoFPCConnectorswithRatedCurrentUpto5ABM28Series■Features1.Ratedcurrent5A2Powe...
2024-12-121492562.52 KB8页201
IC封装资料_连接器_BM28B0.6-10DP2-0.35V_53_.pdf
12019.7④0.35mmpitch,0.6mmheight,BoardtoBoardorBoardtoFPCConnectorswithRatedCurrentUpto5ABM28Series■Features1.Ratedcurrent5A2Powe...
2024-12-12271562.52 KB8页55
IC封装资料_电容_CL10B472KB8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121256259.58 KB3页285
IC封装资料_电容_RVT1A471M0810-TR.pdf
RVTSeriesHUAHUIStandardproduct标准品Operatingwithwidetemperaturerange-40~+105C適用於-40~+105°C的寬溫範圍Loadlifeof2000hours負荷...
2024-12-123831.08 MB3页280
IC封装资料_电容_RVT1A471M0607-TR.pdf
RVTSeriesHUAHUIStandardproduct标准品Operatingwithwidetemperaturerange-40~+105C適用於-40~+105°C的寬溫範圍Loadlifeof2000hours負荷...
2024-12-1214121.08 MB3页218

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