拖动LOGO至书签栏，立即收藏五八文库

添加五八文库到电脑桌面

已经有10万+用户把五八文库添加到电脑桌面，以后点击桌面图标一键打开，无需搜索，非常快捷！

开通会员限时优惠

登录 | 注册

IC资料

分类:

类型:

IC封装资料_电容_CL10B472KB8NNND.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B472KB8NNND·Product:Multi-layerCeramicCapacitor...
2024-12-12124361.67 KB3页229
IC封装资料_电容_1206B331K102NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-12511.05 MB27页119
IC封装资料_连接器_BM28B0.6-16DP2-0.35V_53_.pdf
12019.7④0.35mmpitch,0.6mmheight,BoardtoBoardorBoardtoFPCConnectorswithRatedCurrentUpto5ABM28Series■Features1.Ratedcurrent5A2Powe...
2024-12-121867562.52 KB8页78
IC封装资料_电容_RVT1C100M0405-TR.pdf
RVTSeriesHUAHUIStandardproduct标准品Operatingwithwidetemperaturerange-40~+105C適用於-40~+105°C的寬溫範圍Loadlifeof2000hours負荷...
2024-12-121441.08 MB3页195
IC封装资料_连接器_BM28B0.6-18DP2-0.35V_51_.pdf
12019.7④0.35mmpitch,0.6mmheight,BoardtoBoardorBoardtoFPCConnectorswithRatedCurrentUpto5ABM28Series■Features1.Ratedcurrent5A2Powe...
2024-12-121019562.52 KB8页228
IC封装资料_连接器_1766165.pdf
PHOENIXCONTACTInc.,USAPage1/5http://www.phoenixcon.comJan25,2011ExtractfromtheonlinecatalogGMSTB2,5/6-G-7,62OrderNo.:1766165Thefig...
2024-12-12358230.38 KB5页250
IC封装资料_电源管理芯片_SN6501DBVR.pdf
SN6501TransformerDriverforIsolatedPowerSupplies1Features•Push-pulldriverforsmalltransformers•Single3.3-Vor5-Vsupply•Highprimary...
2024-12-1216783.4 MB38页155
IC封装资料_连接器_BM28B0.6-16DS2-0.35V_53_.pdf
12019.7④0.35mmpitch,0.6mmheight,BoardtoBoardorBoardtoFPCConnectorswithRatedCurrentUpto5ABM28Series■Features1.Ratedcurrent5A2Powe...
2024-12-12647562.52 KB8页145
IC封装资料_连接器_BM28B0.6-16DS2-0.35V_51_.pdf
12019.7④0.35mmpitch,0.6mmheight,BoardtoBoardorBoardtoFPCConnectorswithRatedCurrentUpto5ABM28Series■Features1.Ratedcurrent5A2Powe...
2024-12-121900562.52 KB8页30
IC封装资料_电容_RVT1C101M0605-TR.pdf
RVTSeriesHUAHUIStandardproduct标准品Operatingwithwidetemperaturerange-40~+105C適用於-40~+105°C的寬溫範圍Loadlifeof2000hours負荷...
2024-12-122051.08 MB3页267
IC封装资料_电容_CL10B472KB8NNWC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12378259.58 KB3页131
IC封装资料_电容_1206B331K500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1217641.05 MB27页284
IC封装资料_电容_ERF0JM681F12OT.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-12198415.39 MB230页117
IC封装资料_电感_YP0705-100M.pdf
SMDPowerInductors-YP0705Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Highc...
2024-12-12688721.48 KB5页276
IC封装资料_连接器_1766181.pdf
https://www.phoenixcontact.com/us/products/176618110/24/2014Page1/5Basestrip-GMSTB2,5/8-G-7,62-1766181Pleasebeinformedthatthedatas...
2024-12-121189169.07 KB5页114
IC封装资料_电容_CL10B472KB8SFNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12707259.57 KB3页280
IC封装资料_电容_1206B331K501NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-121851.05 MB27页285
IC封装资料_连接器_BM28B0.6-20DP2-0.35V_51_.pdf
12019.7④0.35mmpitch,0.6mmheight,BoardtoBoardorBoardtoFPCConnectorswithRatedCurrentUpto5ABM28Series■Features1.Ratedcurrent5A2Powe...
2024-12-12337562.52 KB8页287
IC封装资料_电感_YP0705-101M.pdf
SMDPowerInductors-YP0705Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Highc...
2024-12-121869721.48 KB5页55
IC封装资料_连接器_BM28B0.6-18DS2-0.35V_53_.pdf
12019.7④0.35mmpitch,0.6mmheight,BoardtoBoardorBoardtoFPCConnectorswithRatedCurrentUpto5ABM28Series■Features1.Ratedcurrent5A2Powe...
2024-12-121713562.52 KB8页118

首页上页 411 412 413 414 415 下页尾页

确认删除?