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IC封装资料_连接器_BM28B0.6-18DS2-0.35V_51_.pdf
12019.7④0.35mmpitch,0.6mmheight,BoardtoBoardorBoardtoFPCConnectorswithRatedCurrentUpto5ABM28Series■Features1.Ratedcurrent5A2Powe...
2024-12-1251562.52 KB8页3
IC封装资料_连接器_1766194.pdf
https://www.phoenixcontact.com/us/products/176619410/24/2014Page1/5Basestrip-GMSTB2,5/9-G-7,62-1766194Pleasebeinformedthatthedatas...
2024-12-12191168.95 KB5页47
IC封装资料_连接器_BM28B0.6-18DP2-0.35V_53_.pdf
12019.7④0.35mmpitch,0.6mmheight,BoardtoBoardorBoardtoFPCConnectorswithRatedCurrentUpto5ABM28Series■Features1.Ratedcurrent5A2Powe...
2024-12-121478562.52 KB8页49
IC封装资料_电源管理芯片_SP706REN-L_TR.pdf
•www.maxlinear.com•Rev3.0.1SP706R/SP706S/SP706T,SP708S/SP708TDataSheet3.0V/3.3VLowPowerMicroprocessorSupervisoryCircuitsGeneralD...
2024-12-129711.04 MB22页243
IC封装资料_电容_RVT1C102M1010-TR.pdf
RVTSeriesHUAHUIStandardproduct标准品Operatingwithwidetemperaturerange-40~+105C適用於-40~+105°C的寬溫範圍Loadlifeof2000hours負荷...
2024-12-128031.08 MB3页4
IC封装资料_电容_CL10B472KB8WPNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121804259.58 KB3页10
IC封装资料_电容_1206B332K102NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-128641.05 MB27页247
IC封装资料_连接器_BM28B0.6-20DS2-0.35V_53_.pdf
12019.7④0.35mmpitch,0.6mmheight,BoardtoBoardorBoardtoFPCConnectorswithRatedCurrentUpto5ABM28Series■Features1.Ratedcurrent5A2Powe...
2024-12-121467562.52 KB8页58
IC封装资料_连接器_BM28B0.6-20DS2-0.35V_51_.pdf
12019.7④0.35mmpitch,0.6mmheight,BoardtoBoardorBoardtoFPCConnectorswithRatedCurrentUpto5ABM28Series■Features1.Ratedcurrent5A2Powe...
2024-12-121741562.52 KB8页270
IC封装资料_电感_YP0705-102M.pdf
SMDPowerInductors-YP0705Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Highc...
2024-12-121118721.48 KB5页125
IC封装资料_连接器_BM28B0.6-20DP2-0.35V_53_.pdf
12019.7④0.35mmpitch,0.6mmheight,BoardtoBoardorBoardtoFPCConnectorswithRatedCurrentUpto5ABM28Series■Features1.Ratedcurrent5A2Powe...
2024-12-12780562.52 KB8页100
IC封装资料_连接器_1766217.pdf
https://www.phoenixcontact.com/us/products/176621710/24/2014Page1/5Basestrip-GMSTB2,5/11-G-7,62-1766217Pleasebeinformedthatthedata...
2024-12-121423168.86 KB5页199
IC封装资料_电容_RVT1C220M0405-TR.pdf
RVTSeriesHUAHUIStandardproduct标准品Operatingwithwidetemperaturerange-40~+105C適用於-40~+105°C的寬溫範圍Loadlifeof2000hours負荷...
2024-12-122021.08 MB3页83
IC封装资料_连接器_BM28B0.6-24DS2-0.35V_53_.pdf
12019.7④0.35mmpitch,0.6mmheight,BoardtoBoardorBoardtoFPCConnectorswithRatedCurrentUpto5ABM28Series■Features1.Ratedcurrent5A2Powe...
2024-12-121515562.52 KB8页236
IC封装资料_连接器_1766204.pdf
https://www.phoenixcontact.com/us/products/176620410/24/2014Page1/5Basestrip-GMSTB2,5/10-G-7,62-1766204Pleasebeinformedthatthedata...
2024-12-121697169.01 KB5页53
IC封装资料_电源管理芯片_SP706SEN-L_TR.pdf
•www.maxlinear.com•Rev3.0.1SP706R/SP706S/SP706T,SP708S/SP708TDataSheet3.0V/3.3VLowPowerMicroprocessorSupervisoryCircuitsGeneralD...
2024-12-128321.04 MB22页196
IC封装资料_连接器_BM28B0.6-24DS2-0.35V_51_.pdf
12019.7④0.35mmpitch,0.6mmheight,BoardtoBoardorBoardtoFPCConnectorswithRatedCurrentUpto5ABM28Series■Features1.Ratedcurrent5A2Powe...
2024-12-121444562.52 KB8页143
IC封装资料_连接器_BM28B0.6-24DP2-0.35V_53_.pdf
12019.7④0.35mmpitch,0.6mmheight,BoardtoBoardorBoardtoFPCConnectorswithRatedCurrentUpto5ABM28Series■Features1.Ratedcurrent5A2Powe...
2024-12-121410562.52 KB8页297
IC封装资料_电容_GRM188R70J224KA88D.pdf
ChipMultilayerCeramicCapacitorsforGeneral2018C02E.pdfNov.27,2017更多资料下载请到五八文库wk.58sms.comC02E.pdfNov.27,2017!Note•Plea...
2024-12-12188010.43 MB296页133
IC封装资料_连接器_BM28B0.6-24DP2-0.35V_51_.pdf
12019.7④0.35mmpitch,0.6mmheight,BoardtoBoardorBoardtoFPCConnectorswithRatedCurrentUpto5ABM28Series■Features1.Ratedcurrent5A2Powe...
2024-12-12641562.52 KB8页291

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