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IC资料

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IC封装资料_电容_0402B122M500CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-1215211.26 MB20页282
IC封装资料_电容_GCM216R71H471KA01D.pdf
汽车用片状多层陶瓷电容器汽车用片状多层陶瓷电容器MurataManufacturingCo.,Ltd.C03C-4.pdf14.09.09C03C-4.pdf14.09.09•本PDF产品目录是从...
2024-12-1215215.94 MB73页33
IC封装资料_电容_CL10B105MQ8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B105MQ8NNNC·Product:Multi-layerCeramicCapacitor...
2024-12-1215201.45 MB36页217
IC封装资料_电源管理芯片_LTM4632EV_PBF.pdf
LTM46321Rev.DFormoreinformationwww.analog.comTYPICALAPPLICATIONFEATURESDESCRIPTIONUltrathin,TripleOutput,Step-DownµModuleRegulato...
2024-12-1215203.09 MB28页149
IC封装资料_电容_0603N222J500CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-1215201.26 MB20页86
IC封装资料_三极管_DTC143ZETL.pdf
DTC143ZseriesNPN100mA50VDigitalTransistors(BiasResistorBuilt-inTransistors)DatasheetllOutlineParameterValueVMT3EMT3FVCC50VIC(MAX.)...
2024-12-1215203.77 MB12页140
IC封装资料_电感_YNR6045-680M.pdf
SMDPowerInductors-YNR6045Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Lowp...
2024-12-121520672.55 KB6页86
IC封装资料_三极管_IRLR7843TRPBF.pdf
www.irf.com104/30/08IRLR7843PbFIRLU7843PbFHEXFET��PowerMOSFETNotes��through�areonpage11ApplicationsBenefits�VeryLowRDS(on)...
2024-12-121519454.95 KB11页35
IC封装资料_电容_EGN2GM3R3F12OT.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-12151915.39 MB230页106
IC封装资料_电源管理芯片_REF3130AIDBZR.pdf
120100806040200DropoutVoltage(mV)�15�10�5051015LoadCurrent(mA)ADS7822VCCCSDOUTDCLOCKVREF+In�InGND++5�1Fto10F��1Fto�10F�3....
2024-12-1215191.33 MB28页165
IC封装资料_电源管理芯片_173010542.pdf
WPMDH1100xx1S/173010x42MagI3CPowerModuleFDSM–FixedStepDownRegulatorModulewe-online.comWürthElektronikeiSosGmbH&Co.KG–DataSheetR...
2024-12-1215191.75 MB24页52
IC封装资料_电感_LQG15HN4N7S02D.pdf
SpecNo.JELF243B-0009T-01P.1/11MURATAMFG.CO.,LTDReferenceOnlyCHIPCOIL(CHIPINDUCTORS)LQG15HN□□□□02DREFERENCESPECIFICATION1.Scope...
2024-12-121519273.56 KB11页83
IC资料_HLS27DGG0430C (BANNER).pdf
DatasheetBanner'sHLS27HazardousLocationLEDStripLighthasasturdyaluminumhousingandisencasedinashatterproof,UV-stabilized,polycarbona...
2024-12-151519673.17 KB8页187
IC封装资料_电容_CL10C560JB8NFNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-1215191.39 MB36页99
IC封装资料_电容_CL21B475KOFNNNE.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL21B475KOFNNNE·Product:Multi-layerCeramicCapacitor...
2024-12-1215181.49 MB36页94
IC封装资料_连接器_1830693.pdf
TableofcontentsDeviceconnectiontechnologyforsignals,data,andpowerfromPhoenixContact2HighdensityPCBterminalblocksandplug-inconnecto...
2024-12-12151836.13 MB445页237
IC封装资料_电容_GRM1885C1H2R0BA01D.pdf
GRM1885C1H2R0BA01_(0603,C0G:EIA,2pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121518944.09 KB30页276
IC封装资料_电感_SWPA4030S4R7MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-1215181.32 MB22页182
IC封装资料_电容_CL10C221KD8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-121518353.15 KB3页221
IC封装资料_电容_GRM188R71H473KA61D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121518944.07 KB30页75

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