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IC封装资料_电容_CL10B154KA8SFNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B154KA8SFNC·Product:Multi-layerCeramicCapacitor...
2024-12-1215181.45 MB36页178
IC封装资料_电容_CC0603JRNPO0BN560.pdf
ProductSpecification–January18,2017V.9DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORS01005NP0/X5R/X7R4VTO16V0.5pFto220nFRoHScom...
2024-12-121518998.46 KB11页242
IC资料_CL50XRXAOS3NQ (BANNER).pdf
DatasheetMulti-ColorGeneralPurposeorAudibleIndicators•Rugged,cost-effective,andeasy-to-installmulti-colorindicators•Illumination...
2024-12-1515171 MB6页52
IC封装资料_电容_GRM155R71C104KA88J.pdf
ChipMultilayerCeramicCapacitorsforGeneral2018C02E.pdfNov.27,2017更多资料下载请到五八文库wk.58sms.comC02E.pdfNov.27,2017!Note•Plea...
2024-12-12151710.43 MB296页96
IC封装资料_电容_CC0201KRX7R7BB222.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-1215171.22 MB13页203
IC封装资料_电容_TAJA107M004RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-121517210.32 KB7页80
IC封装资料_连接器_FH12-8S-1SH_55_.pdf
May.1.2020Copyright2020HIROSEELECTRICCO.,LTD.AllRightsReserved.IncaseofconsiderationforusingAutomotiveequipment/devicewhichdemandh...
2024-12-121517339.76 KB6页51
IC封装资料_连接器_DF12D_5.0_-20DP-0.5V_81_.pdf
A1930.5mmPitchSMTBoard-to-BoardConnectorDF12Series■Features1.BroadVariationsofStackingHeightInadditionto0.5mmpitchultra-miniature...
2024-12-121517288.67 KB11页3
IC封装资料_电感_YP0504-6R8M.pdf
SMDPowerInductors-YP0504Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Highc...
2024-12-121517776.58 KB5页3
IC封装资料_电容_CL10B333KB8SFNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121517259.58 KB3页19
IC封装资料_电容_0805X476M6R3NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1215171.05 MB27页55
IC封装资料_电容_CL10B224KO8SFNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B224KO8SFNC·Product:Multi-layerCeramicCapacitor...
2024-12-1215171.45 MB36页228
IC封装资料_三极管_SIS402DN-T1-GE3.pdf
VishaySiliconixSiS402DNDocumentNumber:68684S09-1086-Rev.C,15-Jun-09www.vishay.com1N-Channel30-V(D-S)MOSFETFEATURES•Halogen-freeAc...
2024-12-121516648.35 KB13页186
IC封装资料_三极管_SK2300A.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-1215161.1 MB4页106
IC封装资料_连接器_1881480.pdf
PHOENIXCONTACTDeutschlandGmbHPage1/5http://www.phoenixcontact.deMar11,2010ExtractfromtheonlinecatalogMC0,5/6-G-2,5OrderNo.:1881480...
2024-12-121516251.5 KB5页197
IC封装资料_电容_0805CG200G500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1215161.05 MB27页269
IC封装资料_电容_CL10C330JB8NFNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-1215161.39 MB36页53
IC封装资料_电容_C1608X7R1E105KT000N.pdf
MULTILAYERCERAMICCHIPCAPACITORSMULTILAYERCERAMICCHIPCAPACITORSC0402[01005inch]C0603[0201inch]C1005[0402inch]C1608[0603inch]C2012[0...
2024-12-1215151.61 MB56页277
IC封装资料_电源管理芯片_LTC3406AES5_TRPBF.pdf
LTC3406A13406afaTYPICALAPPLICATIONFEATURESAPPLICATIONSDESCRIPTION1.5MHz,600mASynchronousStep-DownRegulatorinThinSOTTheLTC®3406Ais...
2024-12-121515382.92 KB16页12
IC封装资料_电容_0805B104K500AT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1215151.05 MB27页98

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