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IC封装资料_连接器_1751264.pdf
PHOENIXCONTACTInc.,USAPage1/5http://www.phoenixcon.comJan19,2011ExtractfromtheonlinecatalogMKDS1/4-3,5OrderNo.:1751264Thefiguresho...
2024-12-121515225.34 KB5页132
IC封装资料_电容_0201HQ0R2B250NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1215151.05 MB27页279
IC封装资料_电容_GRM188R72A104KA35D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121515944.07 KB30页95
IC封装资料_连接器_BM28B0.6-24DS2-0.35V_53_.pdf
12019.7④0.35mmpitch,0.6mmheight,BoardtoBoardorBoardtoFPCConnectorswithRatedCurrentUpto5ABM28Series■Features1.Ratedcurrent5A2Powe...
2024-12-121515562.52 KB8页236
IC封装资料_连接器_1843703.pdf
PHOENIXCONTACTDeutschlandGmbHPage1/4http://www.phoenixcontact.deMar11,2010ExtractfromtheonlinecatalogMCV1,5/12-G-3,5OrderNo.:18437...
2024-12-121515227.35 KB4页201
IC封装资料_三极管_FDC2512.pdf
TolearnmoreaboutONSemiconductor,pleasevisitourwebsiteatwww.onsemi.comPleasenote:AspartoftheFairchildSemiconductorintegration,someo...
2024-12-121514673.98 KB7页167
IC封装资料_电容_1812B222K202NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1215141.05 MB27页184
IC封装资料_电感_SWPA8040S151MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-1215141.32 MB22页4
IC封装资料_连接器_53398-0471.pdf
TABLE11番号NO.部品PART材質MATERIAL①ハウジングHOUSINGポリアミド(PA),UL94V-0,GLASS-FILLED,色:ナチュラル(ベージュ)POLYAMIDE(PA),UL94...
2024-12-121514855.65 KB4页99
IC封装资料_电感_LQG18HN82NJ00D.pdf
SpecNo.JELF243B-0002T-01P.1/9MURATAMFG.CO.,LTDReferenceOnlyCHIPCOIL(CHIPINDUCTORS)LQG18HN□□□□00DREFERENCESPECIFICATION1.ScopeT...
2024-12-121513269.73 KB9页5
IC封装资料_电容_CL10C221GB8NCNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-121513316.17 KB3页268
IC封装资料_电容_GRM1885C2A5R0CA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121513944.07 KB30页253
IC封装资料_电容_CL21C470JBANNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL21B472KBANNNC·Product:Multi-layerCeramicCapacitor...
2024-12-1215131.45 MB36页172
IC封装资料_电容_0603B221K101NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1215131.05 MB27页262
IC封装资料_电源管理芯片_LT1076HVCT_PBF.pdf
LT1074/LT10761sn10741074fds,LTCandLTareregisteredtrademarksofLinearTechnologyCorporation.APPLICATIOSUFEATURESDESCRIPTIOUTYPICALAPP...
2024-12-121513268.47 KB16页11
IC封装资料_电容_GRM1555C1H9R1CA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121512920.26 KB29页20
IC封装资料_电容_0805B161K500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1215121.05 MB27页47
IC封装资料_电感_SWPA5020SR22NT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-1215121.32 MB22页249
IC封装资料_电容_0603CG1R5C500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1215121.05 MB27页76
IC封装资料_电容_GRM1885C2A270JA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121512944.07 KB30页126

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