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IC资料

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IC封装资料_连接器_1754698.pdf
PHOENIXCONTACTDeutschlandGmbHPage1/5http://www.phoenixcontact.deJan28,2011ExtractfromtheonlinecatalogMSTB2,5/15-GOrderNo.:1754698T...
2024-12-121383232.51 KB5页139
IC封装资料_电容_GCM219R72A333KA37D.pdf
汽车用片状多层陶瓷电容器汽车用片状多层陶瓷电容器MurataManufacturingCo.,Ltd.C03C-4.pdf14.09.09C03C-4.pdf14.09.09•本PDF产品目录是从...
2024-12-1213835.94 MB73页158
IC封装资料_电源管理芯片_BD9D321EFJ-E2.pdf
○Productstructure:Siliconmonolithicintegratedcircuit○Thisproducthasnodesignedprotectionagainstradioactiverays.1/25TSZ02201-0J3J0...
2024-12-1213821.6 MB28页67
IC封装资料_电容_CL10C330JC81PNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121382259.58 KB3页31
IC封装资料_电源管理芯片_LT1117IST_TRPBF.pdf
LT1117/LT1117-2.85LT1117-3.3/LT1117-511117fdTYPICALAPPLICATIONFEATURESDESCRIPTION800mALowDropoutPositiveRegulatorsAdjustableandFix...
2024-12-121382271.56 KB16页172
IC封装资料_三极管_FQD13N10LTM.pdf
January2014ThermalCharacteristicsSymbolParameterFQD13N10LTM/FQU13N10LTUUnitRJCThermalResistance,JunctiontoCase,Max.3.13oC/WRJA...
2024-12-1213821.29 MB9页88
IC封装资料_电容_GRM1555C1H4R2CA01D.pdf
GRM1555C1H4R2CA01_(0402,C0G:EIA,4.2pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:m...
2024-12-121381944.33 KB30页182
IC封装资料_电容_GCM155R71H473KE02D.pdf
GCM155R71H473KE02_(0402,X7R:EIA,47000pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit...
2024-12-121381934.88 KB29页98
IC封装资料_电容_0201CG6R2C250NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1213811.05 MB27页161
IC封装资料_电容_0805CG220F500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1213811.05 MB27页191
IC封装资料_电容_GRM21BR71H104KA01L.pdf
ChipMultilayerCeramicCapacitorsforGeneral2018C02E.pdfNov.27,2017更多资料下载请到五八文库wk.58sms.comC02E.pdfNov.27,2017!Note•Plea...
2024-12-12138110.43 MB296页28
IC封装资料_电感_SDCL1608CR22JTDF.pdf
Specificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2013/05/15SunlordIndustrialPark,Dafuyu...
2024-12-121381376.19 KB4页37
IC封装资料_电容_GCM1885C2A331JA16D.pdf
ChipMultilayerCeramicCapacitorsforAutomotive2017C03E.pdfJun22,2017更多资料下载请到五八文库wk.58sms.comEURoHSCompliant��...
2024-12-1213814.17 MB96页222
IC封装资料_电容_CL10B104KC8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121380259.58 KB3页251
IC封装资料_电容_0402CG8R2D500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1213801.05 MB27页7
IC封装资料_连接器_DF12C_3.0_-40DS-0.5V_81_.pdf
A1930.5mmPitchSMTBoard-to-BoardConnectorDF12Series■Features1.BroadVariationsofStackingHeightInadditionto0.5mmpitchultra-miniature...
2024-12-121380288.67 KB11页97
IC封装资料_电源管理芯片_HX7024A _SOT-89.pdf
Ver2.11HX70XX系列低电压检测器■产品简介系列是一款采用CMOS技术实现的三端口低电压检测器。该系列检测器能检测2.2V~7V的固定电压，检测器...
2024-12-1213801.5 MB8页154
IC封装资料_电容_CL21B224KOCNNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL21B332KBANNNC·Product:Multi-layerCeramicCapacitor...
2024-12-1213791.45 MB36页90
IC封装资料_电容_0201CG2R7C250NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1213781.05 MB27页147
IC封装资料_连接器_BM28B0.6-60DS2-0.35V_51_.pdf
12019.7④0.35mmpitch,0.6mmheight,BoardtoBoardorBoardtoFPCConnectorswithRatedCurrentUpto5ABM28Series■Features1.Ratedcurrent5A2Powe...
2024-12-121378562.52 KB8页20

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