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IC封装资料_连接器_1843936.pdf
https://www.phoenixcontact.com/us/produkte/184393605.10.2012Page1/6Basestrip-MC1,5/16-GF-3,5-1843936Pleasebeinformedthatthedatasho...
2024-12-121375183.16 KB6页34
IC封装资料_电容_TAJC106M016RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-121374210.32 KB7页43
IC封装资料_电容_T491B106K010AT.pdf
©KEMETElectronicsCorporation•P.O.Box5928•Greenville,SC29606•864-963-6300•www.kemet.comT2005_T491•5/8/20171Oneworld.OneKEMETB...
2024-12-1213741.54 MB23页39
IC封装资料_电容_JMK107BBJ226MA-T.pdf
注意■本产品目录所记载的内容为2016年10月之内容。因改良等原因，可能会不经预告而变更记载内容，所以请务必在使用前先确认最新的产品信息...
2024-12-1213741.83 MB52页16
IC封装资料_电容_0603B475K160NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1213741.05 MB27页26
IC封装资料_电容_CL10A225KQ8NNND.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10A225KQ8NNND·Product:Multi-layerCeramicCapacitor...
2024-12-1213731.42 MB36页196
IC封装资料_电容_CL10A105MQ8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121373259.58 KB3页256
IC封装资料_电容_TMK107B7105KA-T.pdf
NoticeforTAIYOYUDENProducts[ForGeneralElectronicEquipment]PleasereadthisnoticebeforeusingtheTAIYOYUDENproducts.REMINDERS■Producti...
2024-12-121373654.27 KB29页114
IC封装资料_连接器_AFC11-S60ICA-00.pdf
浙江博众电气有限公司ZHEJIANGBOZHONGELECTRICCO.，LTD承认书SPECIFICATIONFORAPPROVAL客户Customer：产品名Project：规格型号PartNo：贵公...
2024-12-1213731.4 MB10页270
IC封装资料_电源管理芯片_MIC5504-1.2YM5-TR.pdf
2019MicrochipTechnologyInc.DS20006006B-page1MIC5501/2/3/4Features•InputVoltageRange:2.5Vto5.5V•FixedOutputVoltagesfrom1.0Vto3....
2024-12-1213731.39 MB22页138
IC封装资料_电容_0402B473K100CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-1213731.26 MB20页180
IC封装资料_电感_LQW15AN12NJ00D.pdf
SpecNo.JELF243A-0050AA-01P.1/14MURATAMFG.CO.,LTDReferenceOnlyCHIPCOIL(CHIPINDUCTORS)LQW15AN□□□□00DReferenceSpecification1.Scop...
2024-12-121373376.63 KB15页150
IC封装资料_电源管理芯片_ADR381ARTZ-REEL7.pdf
PrecisionLowDrift2.048V/2.500VSOT-23VoltageReferenceADR380/ADR381Rev.CInformationfurnishedbyAnalogDevicesisbelievedtobeaccurateand...
2024-12-121373337.04 KB16页205
IC封装资料_三极管_SMUN5313DW1T1G.pdf
©SemiconductorComponentsIndustries,LLC,2016June,2017−Rev.41PublicationOrderNumber:DTC144EP/DMUN5313DW1,NSBC144EPDXV6,NSBC144EPDP...
2024-12-121372185.09 KB10页116
IC封装资料_电容_C322J153J30C000.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-1213724.24 MB7页79
IC封装资料_电容_AC0805JRNPO9BN471.pdf
85ProductSpecification–July5,2018V.11DATASHEETSURFACEMOUNTMULTILAYERCERAMICCAPACITORSAutomotivegradeNP0/X7R6.3VTO630V0.2pFto2.2µ...
2024-12-1213721.06 MB24页126
IC封装资料_电感_YSPI0420-3R3M.pdf
SMDPowerInductors-YSPI0420Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Mol...
2024-12-121372700.01 KB4页228
IC封装资料_电感_YPRH0704-221M.pdf
SMDPowerInductors-YPRH0704Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjysmd.com.cn-1-■Features●H...
2024-12-121372730.34 KB5页279
IC封装资料_电容_0805X106K100NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1213721.05 MB27页185
IC封装资料_电容_CL10C220FB8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121371259.58 KB3页45

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