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IC资料

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IC封装资料_电容_CL10B333KO8NFNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B333KO8NFNC·Product:Multi-layerCeramicCapacitor...
2024-12-1213781.45 MB36页61
IC封装资料_连接器_1935297.pdf
https://www.phoenixcontact.com/us/products/193529708/04/2015Page1/6PCBterminalblock-PT1,5/15-5,0-H-1935297Pleasebeinformedthatthed...
2024-12-121378172.23 KB6页265
IC封装资料_电容_0805F124M500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1213781.05 MB27页89
IC封装资料_电容_TAJE336M025RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-121377210.32 KB7页15
IC封装资料_连接器_KF170V-5.0-7P.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-121377207.6 KB1页178
IC封装资料_电源管理芯片_SGM6232YPS8GTR.pdf
SGM62322A,38V,1.4MHzStep-DownConverterGENERALDESCRIPTIONTheSGM6232isacurrent-modestep-downregulatorwithaninternalpowerMOSFET.Thisd...
2024-12-121377451.25 KB14页271
IC封装资料_电容_GJM1555C1H5R0BB01D.pdf
ChipMultilayerCeramicCapacitorsforGeneral2018C02E.pdfNov.27,2017更多资料下载请到五八文库wk.58sms.comC02E.pdfNov.27,2017!Note•Plea...
2024-12-12137710.43 MB296页116
IC封装资料_电感_MLZ2012M220WT000.pdf
May2017INDUCTORS积层铁氧体MLZ20122012[0805inch]**表示尺寸代码。JIS[EIA]去耦电路用电感器MLZ2012型MLZ系列更多资料下载请到五八文库wk....
2024-12-121377483.14 KB15页265
IC封装资料_电容_CL10B123KB8NNND.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B123KB8NNND·Product:Multi-layerCeramicCapacitor...
2024-12-121376361.46 KB3页229
IC封装资料_电容_0805B681K251CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-1213761.26 MB20页111
IC封装资料_电容_CL10C200JB81PNC.pdf
●Supplier:Samsungelectro-mechanicsCL10C200JB81PNC●Product:Multi-layerCeramicCapacitorCAP,20㎊,50V,±5%,C0G,0603●AEC-Q200Qualifi...
2024-12-1213765.8 MB36页47
IC封装资料_连接器_DF12C_3.0_-60DS-0.5V_81_.pdf
A1930.5mmPitchSMTBoard-to-BoardConnectorDF12Series■Features1.BroadVariationsofStackingHeightInadditionto0.5mmpitchultra-miniature...
2024-12-121376288.67 KB11页117
IC封装资料_电容_GRM188R6YA106MA73D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121376944.07 KB30页73
IC资料_CL50XRXAOSIPQ (BANNER).pdf
DatasheetMulti-ColorGeneralPurposeorAudibleIndicators•Rugged,cost-effective,andeasy-to-installmulti-colorindicators•Illumination...
2024-12-1513761 MB6页230
IC封装资料_连接器_9631S-33Z02-GFN4.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-121375204.61 KB1页247
IC封装资料_电源管理芯片_TP5602.pdf
南京拓品微电子有限公司NanJingTopPowerASICCorp.1REV_2.0南京拓品微电子有限公司NanJingTopPowerASICCorp.数据手册DATASHEETTP5602移动电...
2024-12-1213751.46 MB22页8
IC封装资料_电容_CL10C1R2BB8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121375259.58 KB3页37
IC封装资料_连接器_F0502-B-35-20T.pdf
FPC0.50mmConnectorsF0502-B-XX-20T≥24D更多资料下载请到五八文库wk.58sms.com
2024-12-121375290.85 KB1页213
IC封装资料_电容_0805F563M500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1213751.05 MB27页97
IC封装资料_电感_YNR6045-220M.pdf
SMDPowerInductors-YNR6045Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Lowp...
2024-12-121375672.55 KB6页135

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