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IC资料

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IC封装资料_连接器_1844210.pdf
PHOENIXCONTACTDeutschlandGmbHPage1/5http://www.phoenixcontact.deMar11,2010ExtractfromtheonlinecatalogMC1,5/2-G-3,5OrderNo.:1844210...
2024-12-12612246.93 KB5页60
IC封装资料_电容_GCM188R71H333KA55D.pdf
ChipMultilayerCeramicCapacitorsforAutomotive2017C03E.pdfJun22,2017更多资料下载请到五八文库wk.58sms.comEURoHSCompliant��...
2024-12-126124.17 MB96页217
IC封装资料_电容_CL21B105KBFNFNE.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL21B105KBFNFNE·Product:Multi-layerCeramicCapacitor...
2024-12-126121.45 MB36页173
IC封装资料_连接器_1758018.pdf
TableofcontentsDeviceconnectiontechnologyforsignals,data,andpowerfromPhoenixContact2HighdensityPCBterminalblocksandplug-inconnecto...
2024-12-1261236.13 MB445页37
IC封装资料_电源管理芯片_LM317TG.pdf
©SemiconductorComponentsIndustries,LLC,2016February,2019−Rev.161PublicationOrderNumber:LM317/DLM317,NCV3171.5AAdjustableOutput,P...
2024-12-12612253.31 KB12页42
IC封装资料_电源管理芯片_LT1175IS8-5_PBF.pdf
LT117511175ffTYPICALAPPLICATIONFEATURESDESCRIPTION500mANegativeLowDropoutMicropowerRegulatorTheLT®1175isanegativemicropowerlowdro...
2024-12-12612299.02 KB20页191
IC封装资料_电容_CL03C180JA3NNNC.pdf
SPECIFICATION(Referencesheet)Supplier:Samsungelectro-mechanicsSamsungP/N:CL03C180JA3NNNCProduct:Multi-layerCeramicCapacitor...
2024-12-126111.4 MB36页135
IC封装资料_三极管_RTR025N03TL.pdf
RTR025N03Nch30V2.5AMiddlePowerMOSFETDatasheetllOutlineVDSS30VSOT-346TRDS(on)(Max.)92mΩSC-96ID±2.5ATSMT3PD1.0WllInnercircuitllFea...
2024-12-126112.43 MB14页95
IC封装资料_三极管_MMUN2133LT1G.pdf
©SemiconductorComponentsIndustries,LLC,2012October,2016−Rev.71PublicationOrderNumber:DTA143Z/DMUN2133,MMUN2133L,MUN5133,DTA143ZE...
2024-12-12611261.99 KB12页43
IC封装资料_电容_GCJ319R71H104KA01L.pdf
汽车用片状多层陶瓷电容器汽车用片状多层陶瓷电容器MurataManufacturingCo.,Ltd.C03C-4.pdf14.09.09C03C-4.pdf14.09.09•本PDF产品目录是从...
2024-12-126115.94 MB73页33
IC封装资料_电容_CL10B203KB8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12611259.58 KB3页37
IC封装资料_三极管_DMP2540UCB9-7.pdf
DMP2540UCB9Documentnumber:DS35611Rev.6-31of6www.diodes.comFebruary2018©DiodesIncorporatedDMP2540UCB9NEWPRODUCTADVANCEINFORMATIONP...
2024-12-12610606.42 KB6页110
IC封装资料_连接器_SM04B-GHS-TB.pdf
GHCONNECTORGHCONNECTORGHCONNECTORGHCONNECTOR1.25mmpitch/DisconnectableCrimpstyleconnectorsEmbossTapeGHCONNECTORGHCONNECTORGHCONNEC...
2024-12-12610661.07 KB4页217
IC封装资料_电感_YPRH1205-150M.pdf
SMDPowerInductors-YPRH1205Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Hig...
2024-12-12610737.24 KB5页23
IC封装资料_电源管理芯片_LTC3564EDCB_TRPBF.pdf
1LTC35643564f■HighEfficiency:Upto96%■VeryLowQuiescentCurrent:Only20μA■1.25AOutputCurrent■2.5Vto5.5VInputVoltageRange■2.25MHz...
2024-12-12610348.63 KB20页112
IC封装资料_电源管理芯片_LT3508HFE_TRPBF.pdf
LT350813508fdTYPICALAPPLICATIONFEATURESAPPLICATIONSDESCRIPTIONDualMonolithic1.4AStep-DownSwitchingRegulatorTheLT®3508isadualcurre...
2024-12-12610398.49 KB26页266
IC封装资料_电容_0603CG6R0C500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-126101.05 MB27页131
IC封装资料_电容_0805B182K500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-126091.05 MB27页233
IC封装资料_电容_0603YC104KAT2A.pdf
18GeneralSpecificationsPARTNUMBER(SEEPAGE4FORCOMPLETEPARTNUMBEREXPLANATION)08055СMA2AT103Size(L”xW”)DielectricX7R=CCapacitanceT...
2024-12-12609593.79 KB4页104
IC封装资料_连接器_BM28B0.6-44DP2-0.35V_51_.pdf
12019.7④0.35mmpitch,0.6mmheight,BoardtoBoardorBoardtoFPCConnectorswithRatedCurrentUpto5ABM28Series■Features1.Ratedcurrent5A2Powe...
2024-12-12609562.52 KB8页248

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